Abstract:
A conductive film manufacturing method includes a coating formation step of forming a coating by applying onto a thermoplastic resin substrate a conductive film-forming composition including copper oxide particles (A), copper particles (B), and an organic polymer (C), a ratio of a copper particle (B) content to a copper oxide particle (A) content as expressed by B/A being 10 to 50 wt %, and a reduction step of reducing the copper oxide particles (A) through irradiation of the coating with pulsed light, thereby forming a copper-containing conductive film. The conductive film obtained by irradiation with pulsed light according to this method has good adhesion to the thermoplastic resin substrate.
Abstract:
The present invention provides a method for manufacturing a metal film material, the method including: applying an ink composition by discharging the ink composition onto a substrate via an inkjet method, the ink composition containing at least one first monomer having at least one group selected from the group consisting of a cyano group, an alkyloxy group, an amino group, a pyridine residue, a pyrrolidone residue, an imidazole residue, an alkylsulfanyl group, or a cyclic ether residue, at least one second monomer that has polyfunctionality, and at least one polymerization initiator, a total monomer content in the ink composition being 85% by mass or greater; forming a cured film by carrying out at least one of light exposure or heating of the ink composition that has been applied; applying a plating catalyst or a precursor thereof to the cured film; and a plating processing step of performing plating with respect to the plating catalyst or precursor thereof that has been applied.