公开(公告)号：US20240177885A1

公开(公告)日：2024-05-30

申请号：US18501118

申请日：2023-11-03

申请人： Eaton Intelligent Power Limited

发明人： James Dawson ,  Jason Degen

IPC分类号： H01B5/02 ,  G06F30/10 ,  G06F111/04 ,  H01B7/00 ,  H01B13/00 ,  H01B13/14 ,  H01M50/505 ,  H01R13/05

CPC分类号： H01B5/02 ,  G06F30/10 ,  H01B7/0009 ,  H01B13/003 ,  H01M50/505 ,  G06F2111/04 ,  H01B13/14 ,  H01M2220/20 ,  H01R13/05

摘要： A busbar for use in mechanically and electrically connecting components in a device or system. The busbar includes a plurality of conductors arranged to provide two opposed end portions and an intermediate portion, wherein each of the conductors has a plurality of intermediate extents that traverse the intermediate portion. The intermediate portion including: (A) an unfused segment where no intermediate extents of the conductors are fused together to form a single consolidated conductor, and (B) a fused segment that includes (i) a partial solidification zone where a majority of the intermediate extents of the conductors are fused together to form a partially solidified region that provides a single consolidated conductor, (ii) a full solidification zone where all of intermediate extents of the conductors are fused together to form a fully solidified region that provides a single consolidated conductor, and (iii) an unsolidified region where all of the intermediate extents of the conductors are not fused together.

公开(公告)号：US20230420164A1

公开(公告)日：2023-12-28

申请号：US18340391

申请日：2023-06-23

申请人： TE Connectivity Germany GmbH ,  TE Connectivity Solutions GmbH

发明人： Shallu Soneja ,  Yiliang Wu ,  Gokce Gulsoy ,  Helge Schmidt ,  Soenke Sachs

IPC分类号： H01B13/32 ,  H01B13/00 ,  H01B1/02 ,  H01B5/02

CPC分类号： H01B13/322 ,  H01B13/0016 ,  H01B13/003 ,  H01B1/02 ,  H01B5/02

摘要： A method for producing a surface finish on an electrically conductive substrate includes transferring an ink having a plurality of electrically conductive particles onto an area of a predetermined form and/or size on a surface of the electrically conductive substrate by gravure and/or flexo printing. The ink is heated to a temperature that is higher than a melting point of the electrically conductive particles to create a melt. The melt solidifies into the surface finish on the electrically conductive substrate.

公开(公告)号：US20230154644A1

公开(公告)日：2023-05-18

申请号：US17970116

申请日：2022-10-20

申请人： Eaton Intelligent Power Limited

发明人： James Dawson ,  Jason Degen

IPC分类号： H01B5/02 ,  G06F30/10 ,  H01M50/505 ,  H01B7/00 ,  H01B13/00

CPC分类号： H01B5/02 ,  G06F30/10 ,  H01M50/505 ,  H01B7/0009 ,  H01B13/003 ,  G06F2111/04

摘要： A busbar for use in mechanically and electrically connecting components in a device or system. The busbar includes a plurality of conductors arranged to provide two opposed end portions and an intermediate portion, wherein each of the conductors has a plurality of intermediate extents that traverse the intermediate portion. The intermediate portion including: (A) an unfused segment where no intermediate extents of the conductors are fused together to form a single consolidated conductor, and (B) a fused segment that includes (i) a partial solidification zone where a majority of the intermediate extents of the conductors are fused together to form a partially solidified region that provides a single consolidated conductor, (ii) a full solidification zone where all of intermediate extents of the conductors are fused together to form a fully solidified region that provides a single consolidated conductor, and (iii) an unsolidified region where all of the intermediate extents of the conductors are not fused together.

公开(公告)号：US09957363B2

公开(公告)日：2018-05-01

申请号：US14420606

申请日：2013-09-05

申请人： LG CHEM, LTD. ,  IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)

发明人： Yang Kyoo Han ,  Je Gwon Lee ,  Hyun Jin Lee ,  No Ma Kim ,  Sung Soo Yoon ,  Eun Ji Shin

IPC分类号： C08J7/12 ,  H01B13/00 ,  B05D5/00 ,  B05D5/06

CPC分类号： C08J7/12 ,  B22F1/0025 ,  B22F9/18 ,  B22F2001/0037 ,  B82B3/0014 ,  B82Y40/00 ,  C08J2333/26 ,  C30B29/02 ,  C30B29/60 ,  H01B13/0016 ,  H01B13/0026 ,  H01B13/003

摘要： The present invention relates to a method for forming a metal nanowire or a metal nanomesh. More particularly, the present invention relates to a method for forming a metal nanowire or a metal nanomesh capable of forming a variety of metal nanowires or metal nanomeshes in a desired shape by a simplified method.The method for forming a metal nanowire or a metal nanomesh includes the steps of forming a block copolymer thin film on a substrate, in which the block copolymer thin film includes specific hard segments and soft segments containing one or more polymer repeating units selected from the group consisting of a poly(meth)acrylate-based repeating unit, a polyalkylene oxide-based repeating unit, a polyvinylpyridine-based repeating unit, a polystyrene-based repeating unit, a polydiene-based repeating unit and a polylactone-based repeating unit; conducting orientation of the hard segments and soft segments in a lamellar or cylindrical form in the block copolymer thin film; selectively removing the soft segments; adsorbing a metal precursor onto the hard segments; and removing the hard segments.

公开(公告)号：US20170243672A1

公开(公告)日：2017-08-24

申请号：US15054568

申请日：2016-02-26

申请人： Purdue Research Foundation

发明人： Gary J. Cheng ,  Qiong Nian ,  Michael Callahan ,  John S. Bailey

IPC分类号： H01B5/14 ,  G06F3/044 ,  C09D5/24 ,  C09D11/52 ,  H01B1/08 ,  H01B13/00

CPC分类号： H01B5/14 ,  B29K2101/12 ,  B32B37/06 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/414 ,  B32B2310/0843 ,  B32B2457/208 ,  C09D5/24 ,  C09D11/52 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/08 ,  H01B13/0016 ,  H01B13/003

摘要： A composite transparent conducting film (TCF) on a substrate that includes a first region extending to a first depth of the TCF and having a higher density (lower porosity) than a second region of the TCF located at a different depth of the TCF. A method of forming the composite TCF includes applying a transparent conducting layer onto a substrate or onto a second layer previously formed on the substrate, and rapidly heating the transparent conducting layer resulting in a first region extending to a first depth of the transparent conducting layer that is at least partially melted and of a higher density (lower porosity) than a second region located at a different depth of the transparent conducting layer that is not melted, thereby forming a composite TCF that has a change of porosity in a thickness direction of the composite TCF.

公开(公告)号：US20170163020A1

公开(公告)日：2017-06-08

申请号：US15441349

申请日：2017-02-24

申请人： YAZAKI CORPORATION

发明人： Akihiro TAKI ,  Yuji TSUCHIYA

IPC分类号： H02G5/02 ,  H01B7/02 ,  H01B13/24

CPC分类号： H02G5/02 ,  H01B7/0275 ,  H01B13/003 ,  H01B13/145 ,  H01B13/24 ,  H02G5/00

摘要： A busbar includes: an elongated busbar body which is composed of an electrically conductive material; and an insulating coating which covers the circumference of the busbar body. The cross section of the busbar body orthogonal to the longitudinal direction is substantially rectangular. The insulating coating is composed of a light curing resin which has an elongation percentage of not less than 50% after being cured and a Young's modulus of not more than 900 MPa. And the insulating coating is formed by applying the light curing resin onto the surface of the busbar body and then curing the applied light curing resin. The light curing resin has a viscosity of 10 to 1000 Pa·s at 25° C.

公开(公告)号：US09251935B2

公开(公告)日：2016-02-02

申请号：US14399849

申请日：2013-05-08

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

发明人： Andrea Illiberi ,  Frank Theodoor Johannes Grob ,  Paulus Willibrordus George Poodt ,  Gerardus Johan Jozef Winands ,  Pieter Jan Bolt

IPC分类号： H01L21/44 ,  H01B13/00 ,  C09C3/06 ,  C09C1/00 ,  C09C1/04 ,  H01B1/08 ,  H01B13/22 ,  H01L31/0392 ,  H01L31/18

CPC分类号： H01B13/003 ,  C09C1/00 ,  C09C1/043 ,  C09C3/063 ,  H01B1/08 ,  H01B13/0016 ,  H01B13/22 ,  H01L31/03923 ,  H01L31/18

摘要： The present invention relates to a method for enhancing the conductivity of an undoped transparent metal oxide to obtain a transparent conductive oxide (TCO) electrode. More in particular it relates to such a method comprising the steps of providing a transparent metal oxide, applying a UV transparent barrier layer on the transparent metal oxide, and irradiating the transparent metal oxide with UV radiation after applying the barrier layer.

摘要翻译： 本发明涉及增加未掺杂的透明金属氧化物的导电性以获得透明导电氧化物（TCO）电极的方法。 更具体地，涉及这样的方法，其包括以下步骤：提供透明金属氧化物，在透明金属氧化物上施加UV透明阻挡层，以及在施加阻挡层之后用UV辐射照射透明金属氧化物。

公开(公告)号：US20150200034A1

公开(公告)日：2015-07-16

申请号：US14669319

申请日：2015-03-26

申请人： Commissariat A L'Energie Atomique Et Aux Energies Alternatives

发明人： Abdelkader ALIANE ,  Philippe CORONEL

IPC分类号： H01B1/04 ,  H01B13/00 ,  H05K1/09

CPC分类号： H01B1/04 ,  H01B13/003 ,  H01B13/0036 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/09 ,  H05K2201/0323 ,  H01L2924/00

摘要： An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.

摘要翻译： 接口装置包括用于电连接两个电子电路的金属电极彻底交叉的材料层。 根据本发明，材料层包括石墨烯层，电极各自包括横跨石墨烯层的厚度形成的中心导电元件和介于中心元件和石墨烯层之间的电绝缘外围层 。

公开(公告)号：US20150194235A1

公开(公告)日：2015-07-09

申请号：US14665435

申请日：2015-03-23

申请人： FUJIFILM Corporation

发明人： Toshihiro KARIYA ,  Hiroshi OHTA

IPC分类号： H01B1/22 ,  H01B13/00

CPC分类号： H01B1/22 ,  H01B13/003 ,  H05K1/092 ,  H05K3/1283 ,  H05K2203/1157

摘要： A conductive film manufacturing method includes a coating formation step of forming a coating by applying onto a thermoplastic resin substrate a conductive film-forming composition including copper oxide particles (A), copper particles (B), and an organic polymer (C), a ratio of a copper particle (B) content to a copper oxide particle (A) content as expressed by B/A being 10 to 50 wt %, and a reduction step of reducing the copper oxide particles (A) through irradiation of the coating with pulsed light, thereby forming a copper-containing conductive film. The conductive film obtained by irradiation with pulsed light according to this method has good adhesion to the thermoplastic resin substrate.

摘要翻译： 导电膜制造方法包括：涂布形成步骤，通过将包含氧化铜颗粒（A），铜颗粒（B）和有机聚合物（C）的导电膜形成组合物施加到热塑性树脂基材上形成涂层， 由B / A表示的铜颗粒（B）含量与氧化铜颗粒（A）含量的比例为10〜50重量％，还原步骤是通过照射涂布来还原氧化铜颗粒（A） 脉冲光，从而形成含铜导电膜。 根据该方法通过用脉冲光照射获得的导电膜对热塑性树脂基材具有良好的粘合性。

公开(公告)号：US20150192853A1

公开(公告)日：2015-07-09

申请号：US14665615

申请日：2015-03-23

申请人： FUJIFILM Corporation

发明人： Takashi WAKUI ,  Hideyasu ISHIBASHI ,  Osamu SHIMAZAKI

IPC分类号： G03F7/20 ,  H01B13/00

CPC分类号： G03F7/20 ,  H01B13/003 ,  H05K9/0086

摘要： Disclosed is a method for manufacturing a conductive film in which a mesh pattern comprising a wire material is provided on a base material. Also disclosed are a conductive film and a recording medium. Image data representing a mesh pattern is created on the basis of a plurality of selected positions. On the basis of said image data, an evaluation value which quantifies noise characteristics of the mesh pattern is computed. On the basis of the computed evaluation value and prescribed evaluation conditions, one image datum is chosen as an output image datum.

摘要翻译： 公开了一种制造导电膜的方法，其中在基材上设置包括线材的网状图案。 还公开了导电膜和记录介质。 基于多个选定位置创建表示网格图案的图像数据。 基于所述图像数据，计算量化网格图案的噪声特性的评估值。 根据计算出的评估值和规定的评价条件，选择一个图像基准作为输出图像基准。