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公开(公告)号：US11428475B2
公开(公告)日：2022-08-30
申请号：US16923080
申请日：2020-07-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Daniel Jason Erno , Thomas Adcock , Stefano Angelo Mario Lassini
IPC: F28D15/00 , F28D15/04 , B33Y80/00 , B64G1/50 , H01L23/427 , B23K26/342 , B33Y10/00 , F28D21/00
Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.
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公开(公告)号：US20220185446A1
公开(公告)日：2022-06-16
申请号：US17120674
申请日：2020-12-14
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Corey Bourassa , Douglas Carl Hofer , Gregory Alexander Natsui , Brian Magann Rush
IPC: B64C1/38
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a dual-modal cooling structure can enhance heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.
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公开(公告)号：US11112839B2
公开(公告)日：2021-09-07
申请号：US16271220
申请日：2019-02-08
Applicant: General Electric Company
Inventor： Brian Magann Rush , Corey Bourassa , William Dwight Gerstler , Gary Mandrusiak
Abstract: A multi-domain cooling assembly configured to be coupled with one or more heat sources includes a body having an outer surface and at least one cooling chamber disposed inside the body. The at least one cooling chamber extends in at least two orthogonal dimensions and includes a working fluid to extract thermal energy from the one or more heat sources. The assembly includes a cooling channel disposed within the body and fluidly coupled with a passageway that carries cooling fluid into and out of the cooling channel. At least a portion of the cooling fluid is a liquid phase, a gas phase, or a liquid-gas mix phase. The cooling channel is fluidly separate from the at least one cooling chamber. The cooling channel is thermally coupled with the at least one cooling chamber. The at least one cooling chamber transfers thermal energy from the working fluid to the cooling fluid.
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公开(公告)号：US20210147087A1
公开(公告)日：2021-05-20
申请号：US16685586
申请日：2019-11-15
Applicant: General Electric Company
Inventor： William Dwight Gerstler , Nicholas William Rathay , Brian Magann Rush , Pazhayannur R. Subramanian
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. The leading edge assembly includes a plurality of structural layers and a plurality compliant layers alternately stacked with each other to facilitate thermal expansion and movement between the plurality of structural layers, while also providing a thermal break between the plurality of structural layers.
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公开(公告)号：US20200281095A1
公开(公告)日：2020-09-03
申请号：US16845381
申请日：2020-04-10
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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Patent Agency Ranking
公开(公告)号：US10386127B2
公开(公告)日：2019-08-20
申请号：US14848860
申请日：2015-09-09
Applicant: GENERAL ELECTRIC COMPANY
Abstract: A thermal management system including a first vapor housing configured to receive a fluid that absorbs thermal energy from a first heat source, and a phase change material (PCM) housing thermally coupled to the first vapor housing, wherein the PCM housing is configured to receive a PCM that absorbs thermal energy from the first vapor housing, wherein the first vapor housing and the PCM housing are one-piece.
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17.发明申请公开(公告)号：US20150289413A1
公开(公告)日：2015-10-08
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
IPC: H05K7/20
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
Abstract translation: 根据一个实施例，一种用于电子设备的热管理系统，包括加热框架，保形槽部分，底架框架和散热片，其中加热框架，保形槽，底架框架和散热片整体形成为一体结构 通过添加剂制造。 在另一示例中，存在用于电子部件的模块化蒸汽组件，其具有包括部件表面的蒸气室和具有形成在其间的蒸气通道的顶表面，其具有至少一个液体容器，并且在至少一个液体容器的至少一部分的内部具有芯结构 组件表面。 在操作中，存在电路卡，其中至少一些电子部件耦合到蒸气室部件表面，并且芯结构将至少一些液体从容器转移到电子部件，其中液体转变为蒸汽， 朝向插座移动。
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公开(公告)号：US11427330B2
公开(公告)日：2022-08-30
申请号：US16685541
申请日：2019-11-15
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Gregory Alexander Natsui , Brian Magann Rush
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal energy storage reservoir positioned within the vapor chamber contains a phase change material for absorbing thermal energy.
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公开(公告)号：US20220177111A1
公开(公告)日：2022-06-09
申请号：US17114908
申请日：2020-12-08
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Gregory Alexander Natsui , Brian Magann Rush
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to manage thermal loads experienced at the leading edges during high speed or hypersonic operation. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. The outer wall may define a vapor chamber and a capillary structure within the vapor chamber for circulating a working fluid in either liquid or vapor form to cool the leading edge. In addition, a thermal enhancement feature can enhance a heat transfer from the outer wall at the leading edge to the outer wall within the condenser section of the vapor chamber.
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公开(公告)号：US11260953B2
公开(公告)日：2022-03-01
申请号：US16685527
申请日：2019-11-15
Applicant: General Electric Company
Inventor： Nicholas William Rathay , Brian Magann Rush , Narendra Digamber Joshi , Timothy John Sommerer , Gregory Alexander Natsui , Brian Gene Brzek , Douglas Carl Hofer
Abstract: A hypersonic aircraft includes one or more leading edge assemblies that are designed to cool the leading edge of certain portions of the hypersonic aircraft that are exposed to high thermal loads, such as extremely high temperatures and/or thermal gradients. Specifically, the leading edge assemblies may include an outer wall tapered to a leading edge or stagnation point. A coolant supply provides a flow of cooling fluid to a porous tip that is joined to the forward end of the outer wall and defines variable porosity and/or internal barriers to direct a flow of cooling fluid to the regions of the leading edge experiencing the highest thermal loading.
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