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公开(公告)号：US11692871B2
公开(公告)日：2023-07-04
申请号：US17530838
申请日：2021-11-19
Applicant: General Electric Company
Inventor： Guanghua Wang , Naveenan Thiagarajan , Todd Garrett Wetzel , Jason Edward Dees , Bernard Patrick Bewlay
CPC classification number: G01J1/0252 , F02C7/12 , G01J5/0088 , G01J5/042 , G01J5/046 , G01J5/049 , G01J5/061 , G05B13/00 , F05D2260/207 , F05D2270/112 , F05D2270/804 , G01J2005/0077
Abstract: An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.
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公开(公告)号：US10830060B2
公开(公告)日：2020-11-10
申请号：US15368076
申请日：2016-12-02
Applicant: General Electric Company
Inventor： Emily Rosette Clark , Julienne LaChance , William Robb Stewart , Todd Garrett Wetzel
Abstract: An apparatus for cooling an engine component such as a turbine engine airfoil, including a wall bounding an interior extending axially between a leading edge and a trailing edge and radially between a root and a tip. A cooling circuit it located within the interior of the airfoil can include a flow enhancer permitting a volume of fluid, such as air, to pass around the flow enhancer.
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公开(公告)号：US10660236B2
公开(公告)日：2020-05-19
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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公开(公告)号：US20150001311A1
公开(公告)日：2015-01-01
申请号：US14490755
申请日：2014-09-19
Applicant: General Electric Company
Inventor： Todd Garrett Wetzel , Thomas Elliot Stecher , Charles Erklin Seeley , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar , Bryan Patrick Whalen
CPC classification number: B05B17/0607 , F15D1/00 , F15D1/025 , F15D1/08 , Y10T29/49401
Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.
Abstract translation: 公开了一种用于降低合成射流致动器的结构固有频率的系统和方法。 提供合成射流致动器，其包括第一板，与第一板间隔开并平行布置的第二板，以及间隔元件，其构造成将第一板与第二板隔开并且与第一板和第一板一起限定腔室 第二盘。 间隔元件包括形成在其中的至少一个孔，使得腔室与腔室外部的环境流体连通，并且间隔元件构造成响应于第一和第二腔中的至少一个的偏转而在弯曲运动中变形 和第二盘。
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公开(公告)号：US12206080B2
公开(公告)日：2025-01-21
申请号：US16615885
申请日：2018-05-30
Applicant: GENERAL ELECTRIC COMPANY
IPC: H01M10/60 , H01M10/617 , H01M10/6552 , H01M10/657 , H01M50/204 , H01M50/242
Abstract: A modular energy storage system including an enclosure having at least one thermally conductive sidewall; a battery module housed inside of the enclosure and including a plurality of battery submodules, each battery submodule including a plurality of battery cells, at least some of the plurality of battery cells being electrically interconnected to each other; at least one heat pipe thermally coupled to the plurality of battery cells of at least one of the plurality of battery submodules to channel heat from the plurality of battery cells thermally coupled thereto to the at least one thermally conductive sidewall of the enclosure; and a cooling mechanism thermally coupled to the at least one thermally conductive sidewall of the enclosure to cool the at least one heat pipe.
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Patent Agency Ranking
公开(公告)号：US12150279B2
公开(公告)日：2024-11-19
申请号：US16845381
申请日：2020-04-10
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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公开(公告)号：US20200281095A1
公开(公告)日：2020-09-03
申请号：US16845381
申请日：2020-04-10
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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公开(公告)号：US09592523B2
公开(公告)日：2017-03-14
申请号：US14490755
申请日：2014-09-19
Applicant: General Electric Company
Inventor： Todd Garrett Wetzel , Thomas Elliot Stecher , Charles Erklin Seeley , Charles Franklin Wolfe, Jr. , Yogen Vishwas Utturkar , Bryan Patrick Whalen
CPC classification number: B05B17/0607 , F15D1/00 , F15D1/025 , F15D1/08 , Y10T29/49401
Abstract: A system and method for lowering the structural natural frequency of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a spacer element configured to space the first plate apart from the second plate and define a chamber along with the first and second plates. The spacer element includes at least one orifice formed therein such that the chamber is in fluid communication with an environment external to the chamber, and the spacer element is constructed to deform in a bending motion in response to a deflection of at least one of the first and second plates.
Abstract translation: 公开了一种用于降低合成射流致动器的结构固有频率的系统和方法。 提供合成射流致动器，其包括第一板，与第一板间隔开并平行布置的第二板，以及间隔元件，其构造成将第一板与第二板隔开并且与第一板和第一板一起限定腔室 第二盘。 间隔元件包括形成在其中的至少一个孔，使得腔室与腔室外部的环境流体连通，并且间隔元件构造成响应于第一和第二腔中的至少一个的偏转而在弯曲运动中变形 和第二盘。
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9.发明申请公开(公告)号：US20150289413A1
公开(公告)日：2015-10-08
申请号：US14592387
申请日：2015-01-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
IPC: H05K7/20
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
Abstract translation: 根据一个实施例，一种用于电子设备的热管理系统，包括加热框架，保形槽部分，底架框架和散热片，其中加热框架，保形槽，底架框架和散热片整体形成为一体结构 通过添加剂制造。 在另一示例中，存在用于电子部件的模块化蒸汽组件，其具有包括部件表面的蒸气室和具有形成在其间的蒸气通道的顶表面，其具有至少一个液体容器，并且在至少一个液体容器的至少一部分的内部具有芯结构 组件表面。 在操作中，存在电路卡，其中至少一些电子部件耦合到蒸气室部件表面，并且芯结构将至少一些液体从容器转移到电子部件，其中液体转变为蒸汽， 朝向插座移动。
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公开(公告)号：US20250048594A1
公开(公告)日：2025-02-06
申请号：US18919998
申请日：2024-10-18
Applicant: General Electric Company
Inventor： Brian Magann Rush , William Dwight Gerstler , Stefano Angelo Mario Lassini , Todd Garrett Wetzel
Abstract: According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle.
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