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公开(公告)号：US09847174B2
公开(公告)日：2017-12-19
申请号：US14964120
申请日：2015-12-09
Applicant: General Electric Company
Inventor： Lili Zhang , Daniel Qi Tan , Jeffrey S Sullivan
Abstract: A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.
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Patent Agency Ranking
公开(公告)号：US20170178817A1
公开(公告)日：2017-06-22
申请号：US15397135
申请日：2017-01-03
Applicant: General Electric Company
Inventor： Norberto Silvi , Jeffrey S. Sullivan , Daniel Qi Tan , Kevin Warner Flanagan
CPC classification number: C08G73/1071 , B29C55/12 , B29C55/146 , H01G4/015 , H01G4/18 , H01G4/32 , Y02T10/7022
Abstract: A dielectric film that includes a sheet fabricated from a dielectric material. The sheet has a thickness of less than about 5 microns, wherein the dielectric material includes an amorphous polymer, and wherein the dielectric material is substantially free of a solvent.
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公开(公告)号：US20170169948A1
公开(公告)日：2017-06-15
申请号：US14964120
申请日：2015-12-09
Applicant: General Electric Company
Inventor： Lili Zhang , Daniel Qi Tan , Jeffrey S Sullivan
Abstract: A capacitor assembly is disclosed. The capacitor assembly includes a housing. The capacitor assembly further includes a plurality of capacitors disposed within the housing. Furthermore, the capacitor assembly includes a thermally conductive article disposed about at least a portion of a capacitor body of the capacitors, and in thermal contact with the capacitor body. Moreover, the capacitor assembly also includes a heat sink disposed within the housing and in thermal contact with at least a portion of the housing and the thermally conductive article such that the heat sink is configured to remove heat from the capacitor in a radial direction of the capacitor assembly. Further, a method of forming the capacitor assembly is also presented.
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公开(公告)号：US20170140875A1
公开(公告)日：2017-05-18
申请号：US14943433
申请日：2015-11-17
Applicant: General Electric Company
Inventor： Daniel Qi Tan , Lili Zhang , Joseph Lucian Smolenski , Jeffrey S. Sullivan
Abstract: A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.
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15.发明申请MANUFACTURING PROCESSES FOR FORMING METALLIZED FILM CAPACITORS AND RELATED METALLIZED FILM CAPACITORS 审中-公开用于形成金属化膜电容器和相关金属化膜电容器的制造工艺公开(公告)号：US20170062144A1
公开(公告)日：2017-03-02
申请号：US14842426
申请日：2015-09-01
Applicant: General Electric Company
Inventor： Daniel Qi Tan , Ri-an Zhao , Jeffrey S. Sullivan , Lili Zhang , Kevin Warner Flanagan
Abstract: A process for forming a capacitor is presented. The process includes providing a laminate including a dielectric layer disposed on a sacrificial substrate, forming a free-standing metallized dielectric layer and packaging the free-standing metallized dielectric layer to form a capacitor. The dielectric layer includes a polyetherimide. The step of forming the free-standing metallized dielectric layer is performed by: (a) disposing a metal layer on the dielectric layer to form a metalized laminate such that a metalized dielectric layer is formed on the sacrificial substrate, and removing the sacrificial substrate to form the free-standing metallized dielectric layer; or (b) removing the sacrificial substrate from the laminate to form a free-standing dielectric layer, and disposing a metal layer on the free-standing dielectric layer to form the free-standing metallized dielectric layer. A capacitor formed by the process is presented. A process for forming a capacitor by a roll-to-roll processing technique is also presented.
Abstract translation: 提出了一种形成电容器的工艺。 该方法包括提供包括设置在牺牲衬底上的介电层的层压体，形成独立的金属化介电层并封装自立式金属化介电层以形成电容器。 电介质层包括聚醚酰亚胺。 通过以下步骤进行形成独立的金属化介电层的步骤：（a）在电介质层上设置金属层以形成金属化层压体，使得在牺牲基板上形成金属化介电层，并将牺牲基板去除 形成独立的金属化介电层; 或（b）从层压体中去除牺牲基板以形成独立的电介质层，并在自支撑电介质层上设置金属层以形成独立的金属化介质层。 提出了一种通过该过程形成的电容器。 还提出了通过卷对卷处理技术形成电容器的方法。
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公开(公告)号：US20170011820A1
公开(公告)日：2017-01-12
申请号：US14796005
申请日：2015-07-10
Applicant: General Electric Company
Inventor： Weijun Yin , Ming Yin , David Gilles Gascoyne , Slawomir Rubinsztajn , Venkat Subramaniam Venkataramani , Daniel Qi Tan
CPC classification number: H01B7/0216 , H01B3/12 , H01B3/46 , H02K3/30 , H02K3/40 , H02K15/08 , Y02E10/725
Abstract: An insulated winding is provided, wherein the insulated winding includes (a) an electrically conductive core; (b) an electrically insulating non-porous ceramic coating disposed on the conductive core; and (c) a composite silicone coating including a plurality of electrically insulating filler particles disposed on the ceramic coating. Further, a method of making an insulated winding is also provided.
Abstract translation: 提供绝缘绕组，其中绝缘绕组包括（a）导电芯; （b）设置在导电芯上的电绝缘的无孔陶瓷涂层; 和（c）复合硅氧烷涂层，其包括设置在陶瓷涂层上的多个电绝缘填料颗粒。 此外，还提供了制造绝缘绕组的方法。
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