公开(公告)号：US20150187702A1

公开(公告)日：2015-07-02

申请号：US14645598

申请日：2015-03-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Mahbub RASHED ,  Yuansheng MA ,  Irene LIN ,  Jason STEPHENS ,  Yunfei DENG ,  Lei YUAN ,  Jongwook KYE ,  Rod AUGUR ,  Shibly AHMED ,  Subramani KENGERI ,  Suresh VENKATESAN

IPC: H01L23/538 ,  H01L27/092 ,  H01L27/02 ,  H01L29/78

CPC classification number: H01L23/5386 ,  H01L21/76895 ,  H01L21/823871 ,  H01L23/5384 ,  H01L27/0207 ,  H01L27/0924 ,  H01L29/7851 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An approach for providing MOL constructs using diffusion contact structures is disclosed. Embodiments include: providing a first diffusion region in a substrate; providing, via a first lithography process, a first diffusion contact structure; providing, via a second lithography process, a second diffusion contact structure; and coupling the first diffusion contact structure to the first diffusion region and the second diffusion contact structure. Embodiments include: providing a second diffusion region in the substrate; providing a diffusion gap region between the first and second diffusion regions; providing the diffusion contact structure over the diffusion gap region; and coupling, via the diffusion contact structure, the first and second diffusion regions.

Abstract translation: 公开了一种使用扩散接触结构提供MOL构造的方法。 实施例包括：在衬底中提供第一扩散区域; 经由第一光刻工艺提供第一扩散接触结构; 经由第二光刻工艺提供第二扩散接触结构; 以及将所述第一扩散接触结构耦合到所述第一扩散区和所述第二扩散接触结构。 实施例包括：在衬底中提供第二扩散区域; 在所述第一和第二扩散区之间提供扩散间隙区域; 在所述扩散间隙区域上提供所述扩散接触结构; 以及经由扩散接触结构耦合第一和第二扩散区域。

公开(公告)号：US20150028489A1

公开(公告)日：2015-01-29

申请号：US14513834

申请日：2014-10-14

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Lei YUAN ,  Jongwook KYE ,  Harry LEVINSON

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/49838 ,  H01L21/0337 ,  H01L21/308 ,  H01L21/31144 ,  H01L21/76816 ,  H01L21/76838 ,  H01L23/50 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for efficient off-track routing and the resulting device are disclosed. Embodiments include: providing a hardmask on a substrate; providing a plurality of first mandrels on the hardmask; providing a first spacer on each side of each of the first mandrels; providing a plurality of first non-mandrel regions of the substrate being separated from the first mandrels and between two of the first spacers, each of the first mandrels, first non-mandrel regions, and first spacers having a width equal to a distance; and providing a second mandrel having a width of at least twice the distance and being separated from one of the first non-mandrel regions by a second spacer.

Abstract translation: 公开了一种用于有效的非轨道路由的方法以及所得到的设备。 实施例包括：在基板上提供硬掩模; 在硬掩模上提供多个第一心轴; 在每个所述第一心轴的每一侧上提供第一间隔件; 提供所述基板的多个第一非心轴区域与所述第一心轴分开并且在所述第一间隔件中的两个之间，所述第一心轴，第一非心轴区域和第一间隔件中的每一个具有等于一定距离的宽度; 以及提供具有至少两倍距离的宽度的第二心轴，并且通过第二间隔件与第一非心轴区域之一分离。

公开(公告)号：US20140353765A1

公开(公告)日：2014-12-04

申请号：US14461745

申请日：2014-08-18

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Youngtag WOO ,  Jongwook KYE ,  Dinesh SOMASEKHAR

IPC: H01L27/11 ,  H01L21/8234

CPC classification number: H01L27/1108 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/823431 ,  H01L21/823821 ,  H01L27/0886 ,  H01L27/11

Abstract: Methodology enabling a generation of fins having a variable fin pitch less than 40 nm, and the resulting device are disclosed. Embodiments include: forming a hardmask on a substrate; providing first and second mandrels on the hardmask; providing a first spacer on each side of each of the first and second mandrels; removing the first and second mandrels; providing, after removal of the first and second mandrels, a second spacer on each side of each of the first spacers; and removing the first spacers.

Abstract translation: 公开了能够产生具有可变翅片间距小于40nm的翅片的方法，并且所得到的装置被公开。 实施例包括：在基板上形成硬掩模; 在硬掩模上提供第一和第二心轴; 在每个第一和第二心轴的每一侧上提供第一间隔件; 移除第一和第二心轴; 在移除所述第一和第二心轴之后，在每个所述第一间隔件的每一侧上提供第二间隔件; 并移除第一间隔物。

公开(公告)号：US20140282345A1

公开(公告)日：2014-09-18

申请号：US13838378

申请日：2013-03-15

Applicant: GLOBALFOUNDRIES INC.

Inventor： Lei YUAN ,  Jongwook KYE ,  Harry LEVINSON

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: A method and apparatus for insertion of a via improving a manufacturability of a resulting device while ensuring compliance with DRC rules are disclosed. Embodiments include: determining a layer of a substrate of an IC design having a first via and a plurality of routes, the plurality of routes extending horizontally on the substrate and placed on one of a plurality of equally spaced vertical positions; comparing a region of the layer extending vertically between a first set of the plurality of routes and extending horizontally between a second set of the plurality of the routes with one or more threshold values, the region being adjacent to the first via and being separated from the plurality of routes; and inserting a second via based on the comparison.

Abstract translation: 公开了一种用于插入通孔的方法和装置，其改善了所得到的装置的可制造性，同时确保符合DRC规则。 实施例包括：确定具有第一通孔和多个路线的IC设计的基板的层，所述多个路线在基板上水平延伸并且放置在多个等间隔的垂直位置中的一个上; 比较在多个路线的第一组之间垂直延伸并且在第二组多个路线之间水平延伸的层的区域与一个或多个阈值，所述区域与第一通孔相邻并且与第一通孔分离 多条路线; 以及基于所述比较来插入第二通孔。