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公开(公告)号：US09352150B2
公开(公告)日：2016-05-31
申请号：US14864959
申请日：2015-09-25
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Steven W. Winn , Christine A. Frysz , Richard L. Brendel , Jason Woods , Dominick J. Frustaci , Xiaohong Tang , William C. Thiebolt
IPC: H01G4/35 , A61N1/375 , A61N1/08 , A61N1/05 , H01G2/10 , H01R43/00 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , C22C29/12
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
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12.发明申请HERMETICALLY SEALED FEEDTHROUGH WITH CO-FIRED FILLED VIA AND CONDUCTIVE INSERT FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权通过与激活的可植入医疗装置的通过和导电插入的共同密封进行密封公开(公告)号：US20150314131A1
公开(公告)日：2015-11-05
申请号：US14797123
申请日：2015-07-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/372 , A61N1/375 , B22F2998/10 , C22C29/12 , H01G2/103 , H01G4/35 , H01R43/00 , Y10T156/1052 , B22F1/0059 , B22F3/10
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
Abstract translation: 用于附接到有源可植入医疗装置的气密密封馈通包括构造成气密地密封到套圈或AIMD壳体的电介质衬底。 通孔通过电介质基板从体液侧设置到器件侧。 导电填料设置在通孔内，形成在体液侧和装置侧之间经过导电的填充通孔。 导电插入件至少部分地设置在导电填充物内。 然后，导电填充物和导电插入物与电介质基底共烧，以在体液侧和器件侧之间形成通过电介质基片的气密密封和导电通路。
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公开(公告)号：US20150207484A1
公开(公告)日：2015-07-23
申请号：US14669041
申请日：2015-03-26
Applicant: GREATBATCH LTD.
Inventor： Robert A. Stevenson , Robert Shawn Johnson , Kishore Kumar Kondabatni , Joseph E. Spaulding , Dominick J. Frustaci , Warren S. Dabney , Holly Noelle Moschiano
CPC classification number: H03H7/0123 , A61B5/042 , A61B5/055 , A61B18/1492 , A61B2018/00839 , A61B2090/374 , A61B2562/182 , A61B2562/222 , A61B2562/227 , A61N1/05 , A61N1/08 , A61N1/086 , A61N1/3718 , H03H1/0007 , H03H2001/0021 , H03H2007/013
Abstract: A composite RF current attenuator for a medical lead includes a conductor having a distal electrode contactable to biological cells, a bandstop filter in series with the lead conductor for attenuating RF currents flow through the lead conductor at a selected center frequency or across a range of frequencies about the center frequency, and a lowpass filter in series with the bandstop filter and forming a portion of the lead conductor. The bandstop filter has a capacitance in parallel with a first inductance. In a preferred form, the lowpass filter includes a second inductance in series with the bandstop filter, wherein the values of capacitance and inductances for the composite RF current attenuator are selected such that it attenuates MRI-induced RF current flow in an MRI environment.
Abstract translation: 用于医用引线的复合RF电流衰减器包括具有可与生物细胞接触的远端电极的导体，与引线导体串联的带阻滤波器，用于衰减RF电流以选定的中心频率或跨频率范围流过引线导体 关于中心频率，以及与带阻滤波器串联的低通滤波器，并形成引线导体的一部分。 带阻滤波器具有与第一电感并联的电容。 在优选形式中，低通滤波器包括与带阻滤波器串联的第二电感，其中复合RF电流衰减器的电容值和电感值被选择为使其在MRI环境中衰减MRI诱导的RF电流。
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14.发明申请RF FILTER FOR AN ACTIVE MEDICAL DEVICE (AMD) FOR HANDLING HIGH RF POWER INDUCED IN AN ASSOCIATED IMPLANTED LEAD FROM AN EXTERNAL RF FIELD 有权用于处理来自外部RF场的相关外延引线中感应的高RF功率的有源医疗设备（AMD）的射频滤波器公开(公告)号：US20140168850A1
公开(公告)日：2014-06-19
申请号：US14187297
申请日：2014-02-23
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Robert S. Johnson , Dominick J. Frustaci , Warren S. Dabney , Keith W. Seitz , Thomas Marzano , John E. Roberts , William C. Thiebolt , Christopher M. Williams , Buehl E. Truex
IPC: H01G4/35
CPC classification number: A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。
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15.发明申请CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权通过用于活性可植入医疗装置填充的氧化铝基底和铂填充物进行密封公开(公告)号：US20140161973A1
公开(公告)日：2014-06-12
申请号：US14182569
申请日：2014-02-18
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC: H01R43/00
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
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Patent Agency Ranking
16.发明授权Co-fired hermetically sealed feedthrough with alumina substrate and platinum filled via for an active implantable medical device 有权与氧化铝基底和铂填充通孔用于有源可植入医疗器械的共烧密封馈通公开(公告)号：US08653384B2
公开(公告)日：2014-02-18
申请号：US13743254
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Ricahrd L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基片从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
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公开(公告)号：US10881867B2
公开(公告)日：2021-01-05
申请号：US16708881
申请日：2019-12-10
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.
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18.发明申请公开(公告)号：US20200054881A1
公开(公告)日：2020-02-20
申请号：US16656775
申请日：2019-10-18
Applicant: Greatbatch Ltd.
Inventor： Dominick J. Frustaci , Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Richard L. Brendel , Jason Woods
Abstract: A hermetically sealed filtered feedthrough for an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first leadwire second end extending outwardly beyond the device side of an insulator hermetically sealed to a ferrule for the feedthrough. A circuit board supporting a chip capacitor is disposed adjacent to a device side of the insulator and has a circuit board passageway. The first leadwire first end resides in the circuit board passageway. A second conductive leadwire on the device side has a second leadwire first end disposed in the circuit board passageway with a second leadwire second end extending outwardly beyond the circuit board to be connectable to AIMD internal electronics. The second leadwire first end is connected to the first leadwire first end and a capacitor internal metallization in the circuit board passageway. The circuit board further comprises a ground electrode plate that is connected to the ground termination of the chip capacitor and to the ferrule.
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公开(公告)号：US09889306B2
公开(公告)日：2018-02-13
申请号：US14797123
申请日：2015-07-11
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/372 , A61N1/375 , B22F2998/10 , C22C29/12 , H01G2/103 , H01G4/35 , H01R43/00 , Y10T156/1052 , B22F1/0059 , B22F3/10
Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.
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20.发明授权EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device 有权EMI滤波的共同密封馈通，馈通电容器和用于有源可植入医疗装置的引线组件公开(公告)号：US09233253B2
公开(公告)日：2016-01-12
申请号：US13743276
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Thomas Marzano , Keith W. Seitz , Steven W. Winn , Christine A. Frysz , Richard L. Brendel , Jason Woods , Dominick J. Frustaci , Xiaohong Tang , William C. Thiebolt
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.
Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。
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