公开(公告)号：US20110042784A1

公开(公告)日：2011-02-24

申请号：US12854973

申请日：2010-08-12

申请人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

发明人： David L. Edwards ,  Jean-Luc Landreville ,  Kathryn R. Lange ,  Carl Savard ,  Kamla K. Sikka ,  Hilton T. Toy

IPC分类号： H01L23/29 ,  H01L21/50 ,  H01L23/52

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L21/565 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/00

摘要： Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.

摘要翻译： 本发明的实施例通常涉及集成电路器件的封装，更具体地涉及在操作期间放置用于冷却集成电路器件的散热膏。 屏障元件可以沿着集成电路芯片的至少一侧放置。 阻挡元件可以包含在包装部件膨胀和收缩期间泵出的热浆料到芯片附近的区域。 阻挡元件还可以形成储存器以补充在浆料的热泵送期间损失的热糊料。

公开(公告)号：US20080156849A1

公开(公告)日：2008-07-03

申请号：US11619197

申请日：2007-01-03

申请人： Eric E. Bouchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

发明人： Eric E. Bouchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

IPC分类号： B23K3/00

CPC分类号： B23K3/08 ,  B23K2101/42

摘要： An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.

摘要翻译： 用于去除在硅晶片上的焊料转移之前在注射模具的表面上遇到的多余的焊料或污染物的装置和方法。 更具体地，提供了可以存在于模具表面上的多余的焊料的去除，而不去除位于模具中形成的空腔中的任何焊料，并且其中通过注射成型焊接工艺施加焊料。

公开(公告)号：US08162199B2

公开(公告)日：2012-04-24

申请号：US12539893

申请日：2009-08-12

申请人： Eric E. Bourchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

发明人： Eric E. Bourchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

IPC分类号： B23K3/00 ,  B41F15/44

CPC分类号： B23K3/08 ,  B23K2101/42

摘要： An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.

摘要翻译： 一种用于去除在硅晶片上将焊料转移之前在注射模具的表面上遇到的多余焊料或污染物的装置。 更具体地，提供了一种用于去除可能存在于模具表面上的多余焊料的装置，而不去除位于模具中形成的空腔中的任何焊料，并且其中焊料通过注射成型焊接 处理。