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公开(公告)号：US20090294090A1
公开(公告)日：2009-12-03
申请号：US12539893
申请日：2009-08-12
申请人： Eric E. Bouchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
发明人： Eric E. Bouchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
IPC分类号： B22D11/126
CPC分类号： B23K3/08 , B23K2101/42
摘要： An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
摘要翻译： 一种用于去除在硅晶片上将焊料转移之前在注射模具的表面上遇到的多余焊料或污染物的装置。 更具体地，提供了一种用于去除可能存在于模具表面上的多余焊料的装置，而不去除位于模具中形成的空腔中的任何焊料，并且其中焊料通过注射成型焊接 处理。
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公开(公告)号：US20080156849A1
公开(公告)日：2008-07-03
申请号：US11619197
申请日：2007-01-03
申请人： Eric E. Bouchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
发明人： Eric E. Bouchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
IPC分类号： B23K3/00
CPC分类号： B23K3/08 , B23K2101/42
摘要： An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
摘要翻译： 用于去除在硅晶片上的焊料转移之前在注射模具的表面上遇到的多余的焊料或污染物的装置和方法。 更具体地，提供了可以存在于模具表面上的多余的焊料的去除，而不去除位于模具中形成的空腔中的任何焊料，并且其中通过注射成型焊接工艺施加焊料。
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公开(公告)号：US08162199B2
公开(公告)日：2012-04-24
申请号：US12539893
申请日：2009-08-12
申请人： Eric E. Bourchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
发明人： Eric E. Bourchard , Guy Brouillette , David H. Danovitch , Peter A. Gruber , Jean-Luc Landreville
CPC分类号： B23K3/08 , B23K2101/42
摘要： An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
摘要翻译： 一种用于去除在硅晶片上将焊料转移之前在注射模具的表面上遇到的多余焊料或污染物的装置。 更具体地，提供了一种用于去除可能存在于模具表面上的多余焊料的装置，而不去除位于模具中形成的空腔中的任何焊料，并且其中焊料通过注射成型焊接 处理。
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4.发明申请公开(公告)号：US20050263571A1
公开(公告)日：2005-12-01
申请号：US10857988
申请日：2004-05-30
申请人： Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
发明人： Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
CPC分类号： B23K3/0623 , H05K3/3457 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338 , H05K2203/1121
摘要： A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.
摘要翻译： 一种用于通过熔融焊料沉积形成焊料凸块的方法和装置，紧接在熔融焊料的固化之后，立即在形成的焊料凸块阵列中实现空腔体积的精确复制。 各种焊料填充问题，例如由表面张力和氧化作用引起的焊料填充问题，都是通过组合窄熔融焊料分配槽和分散的熔融焊料的固化来克服的。
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公开(公告)号：US06957794B2
公开(公告)日：2005-10-25
申请号：US10190948
申请日：2002-07-08
CPC分类号： F16M11/2085 , F16M11/24 , F16M13/00 , F16M2200/027 , G02B7/00 , G02B21/24 , Y10S248/91
摘要： An improved structure (stand) for providing flexibility for holding and mounting components, such as microscopes and cameras, in order to eliminate disruptions from undesirable vibrations and tilting of the mounted component. The stand uses a vertical stand member, and a horizontal arm member movably positioned in both vertical and horizontal orientations relative to the stand member. Adjustable brackets and associated clamps are utilized.
摘要翻译： 改进的结构（支架），用于提供用于保持和安装部件（例如显微镜和照相机）的灵活性，以便消除不期望的振动和安装部件倾斜的中断。 支架使用垂直支架构件和水平臂构件，其相对于支架构件可移动地定位在垂直和水平方向上。 利用可调支架和相关夹具。
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6.发明授权Piston reset apparatus for a multichip module and method for resetting pistons in the same 有权用于多芯片模块的活塞复位装置和用于复位活塞的活塞的方法公开(公告)号：US07405940B1
公开(公告)日：2008-07-29
申请号：US11739773
申请日：2007-04-25
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。
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公开(公告)号：US07066740B2
公开(公告)日：2006-06-27
申请号：US10604555
申请日：2003-07-30
CPC分类号： H01R12/57 , H01L23/49811 , H01L2224/16 , H01L2224/16235 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/16152 , H01L2924/3011 , H01L2924/3025 , H01R12/718 , H05K3/3426 , Y02P70/613
摘要： An area-array integrated circuit package assembly are provided with a plurality of electrically conductive connectors attached to the package I.O. pads, that are used to connect the package to a printed circuit card or other component. The connectors comprise at least two parallel conductors flexing together in the same direction, electrically insulated from each other for a portion of their length between the package and printed circuit card to provide for reduced interconnection inductance. The connection with the component contact pads can be achieved by mechanically pressing the package and circuit card together or with the use of bonding material.
摘要翻译： 区域阵列集成电路封装组件设置有多个连接到封装件I.O的导电连接器。 垫，用于将包装连接到印刷电路卡或其他组件。 连接器包括至少两个平行的导体，它们沿相同方向弯曲在一起，在封装和印刷电路卡之间的长度的一部分彼此电绝缘以提供减小的互连电感。 与元件接触焊盘的连接可以通过将封装和电路卡机械地压在一起或使用粘合材料来实现。
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公开(公告)号：US06302702B1
公开(公告)日：2001-10-16
申请号：US09516904
申请日：2000-03-01
IPC分类号： H01R100
CPC分类号： H01R12/57 , H01L23/49811 , H01L2224/16225 , H01L2224/16235 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H05K3/325 , H05K7/1061 , Y10T29/49149
摘要： An integrated circuit package having metallized contact pads is provided with electrically conducting devices permanently attached to each contact pad. The devices are flexed when so attached, and are aligned and assembled onto corresponding pads of a second electrical component (e.g., a printed circuit board) to provide electrical connection between the integrated circuit package and the second electrical component.
摘要翻译： 具有金属化接触焊盘的集成电路封装设置有永久地附接到每个接触焊盘的导电装置。 当这样安装时，这些装置被弯曲，并被对准并组装到第二电气部件（例如，印刷电路板）的相应焊盘上，以提供集成电路封装和第二电气部件之间的电连接。
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9.发明申请Mechanical Barrier Element for Improved Thermal Reliability of Electronic Components 审中-公开机械阻隔元件，用于提高电子部件的热可靠性公开(公告)号：US20110042784A1
公开(公告)日：2011-02-24
申请号：US12854973
申请日：2010-08-12
申请人： David L. Edwards , Jean-Luc Landreville , Kathryn R. Lange , Carl Savard , Kamla K. Sikka , Hilton T. Toy
发明人： David L. Edwards , Jean-Luc Landreville , Kathryn R. Lange , Carl Savard , Kamla K. Sikka , Hilton T. Toy
CPC分类号： H01L23/3675 , H01L21/563 , H01L21/565 , H01L23/293 , H01L23/296 , H01L23/3128 , H01L23/3135 , H01L23/42 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/00
摘要： Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.
摘要翻译： 本发明的实施例通常涉及集成电路器件的封装，更具体地涉及在操作期间放置用于冷却集成电路器件的散热膏。 屏障元件可以沿着集成电路芯片的至少一侧放置。 阻挡元件可以包含在包装部件膨胀和收缩期间泵出的热浆料到芯片附近的区域。 阻挡元件还可以形成储存器以补充在浆料的热泵送期间损失的热糊料。
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10.发明授权Piston reset apparatus for a multichip module and method for resetting pistons in the same 有权用于多芯片模块的活塞复位装置和用于复位活塞的活塞的方法公开(公告)号：US07826228B2
公开(公告)日：2010-11-02
申请号：US12143940
申请日：2008-06-23
IPC分类号： H05K7/20
CPC分类号： H05K7/1061 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： Disclosed is a piston reset apparatus for a multichip module that includes a base with multiple projections and two unit associating pegs extending from opposite ends of the base, a hat disposed upwardly of the base and including multiple adjustable pistons vertically adjustable within the hat, each of the plurality of adjustable pistons being disposed in alignment with one of the multiple projections, a mass equivalent plate disposed upwardly of the hat and being configured to hold a spring loaded sleeve, the spring loaded sleeve including a plurality of springs, each of the springs being aligned with and configured to apply pressure upon one of the multiple pistons, a spring loaded clamp disposed upwardly of the plate and including a spring loaded portion and a retaining portion, the retaining portion defining two cavities configured to fixedly associate with an associating groove defined by each of the unit associating pegs.
摘要翻译： 公开了一种用于多芯片模块的活塞复位装置，其包括具有多个突起的基座和从基座的相对端延伸的两个单元关联钉，帽子设置在基座的上方，并且包括在帽子内可垂直调节的多个可调节活塞， 所述多个可调节活塞与所述多个突起中的一个突起对准设置，所述质量当量板设置在所述帽子的上方并且被构造成保持弹簧加载的套筒，所述弹簧加载的套筒包括多个弹簧，每个所述弹簧为 对准并构造成在多个活塞中的一个上施加压力，弹簧加载的夹具，其设置在板的上方并且包括弹簧加载部分和保持部分，所述保持部分限定两个空腔，其被构造成与由 每个单位关联栓。
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