Sacrificial Layers for Bio-Compatible Devices
    12.
    发明申请
    Sacrificial Layers for Bio-Compatible Devices 有权
    生物兼容设备的牺牲层

    公开(公告)号:US20150065820A1

    公开(公告)日:2015-03-05

    申请号:US14011478

    申请日:2013-08-27

    Applicant: Google Inc.

    Abstract: A method may involve: forming a sacrificial layer on a working substrate; forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer; forming a conductive pattern on the first bio-compatible layer; mounting an electronic component to the conductive pattern; forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern; and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.

    Abstract translation: 一种方法可以包括:在工作衬底上形成牺牲层; 在所述牺牲层上形成第一生物相容层,使得所述第一生物相容层附着于所述牺牲层; 在所述第一生物相容层上形成导电图案; 将电子部件安装到所述导电图案上; 在所述第一生物相容层,所述电子部件和所述导电图案上形成第二生物相容层; 以及去除所述牺牲层以从所述工作衬底释放所述生物相容性装置。 第一生物相容层限定生物相容装置的第一侧。 第二生物相容层限定生物相容装置的第二侧。

    Methods for Forming a Channel Through a Polymer Layer Using One or More Photoresist Layers
    13.
    发明申请
    Methods for Forming a Channel Through a Polymer Layer Using One or More Photoresist Layers 有权
    通过使用一个或多个光刻胶层的聚合物层形成通道的方法

    公开(公告)号:US20150004058A1

    公开(公告)日:2015-01-01

    申请号:US13931086

    申请日:2013-06-28

    Applicant: Google Inc.

    Abstract: A method may involve forming one or more photoresist layers over a sensor located on a structure, such that the sensor is covered by the one or more photoresist layers. The sensor is configured to detect an analyte. The method may involve forming a first polymer layer. Further, the method may involve positioning the structure on the first polymer layer. Still further, the method may involve forming a second polymer layer over the first polymer layer and the structure, such that the structure is fully enclosed by the first polymer layer, the second polymer layer, and the one or more photoresist layers. The method may also involve removing the one or more photoresist layers to form a channel through the second polymer layer, wherein the sensor is configured to receive the analyte via the channel.

    Abstract translation: 方法可以包括在位于结构上的传感器上形成一个或多个光致抗蚀剂层,使得传感器被一个或多个光致抗蚀剂层覆盖。 传感器被配置为检测分析物。 该方法可以包括形成第一聚合物层。 此外,该方法可以包括将结构定位在第一聚合物层上。 此外,该方法可以包括在第一聚合物层和结构上形成第二聚合物层,使得该结构被第一聚合物层,第二聚合物层和一个或多个光致抗蚀剂层完全包围。 该方法还可以包括去除一个或多个光致抗蚀剂层以形成通过第二聚合物层的通道,其中传感器经配置以经由通道接收分析物。

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