POWER MODULES WITH ELEVATED INDUCTORS AND CAPACITORS ARRANGED UNDER THE INDUCTORS

    公开(公告)号:US20240203630A1

    公开(公告)日:2024-06-20

    申请号:US18590577

    申请日:2024-02-28

    Applicant: Google LLC

    CPC classification number: H01F17/0006 H05K5/0069

    Abstract: The disclosure relates to power modules that include elevated inductors with capacitors disposed under the inductors. In one aspect, a power module includes a first circuit board having a first surface and a second surface opposite the first surface. One or more inductors are mounted on the first surface. Each of the one or more inductors includes a top surface and a bottom surface opposite the top surface and that faces the first surface of the first circuit board. Each inductor is elevated above the first surface of the first circuit board such that at least a portion of the bottom surface of the inductor does not contact the first surface of the first circuit board. The first circuit board includes capacitors arranged in an area below the portion of the bottom surface of the inductor that does not contact the first surface of the first circuit board.

    Power modules with elevated inductors and capacitors arranged under the inductors

    公开(公告)号:US11948716B1

    公开(公告)日:2024-04-02

    申请号:US16800776

    申请日:2020-02-25

    Applicant: Google LLC

    CPC classification number: H01F17/0006 H05K5/0069

    Abstract: The disclosure relates to power modules that include elevated inductors with capacitors disposed under the inductors. In one aspect, a power module includes a first circuit board having a first surface and a second surface opposite the first surface. One or more inductors are mounted on the first surface. Each of the one or more inductors includes a top surface and a bottom surface opposite the top surface and that faces the first surface of the first circuit board. Each inductor is elevated above the first surface of the first circuit board such that at least a portion of the bottom surface of the inductor does not contact the first surface of the first circuit board. The first circuit board includes capacitors arranged in an area below the portion of the bottom surface of the inductor that does not contact the first surface of the first circuit board.

    Power sequencing in an active silicon interposer

    公开(公告)号:US11552634B2

    公开(公告)日:2023-01-10

    申请号:US16921571

    申请日:2020-07-06

    Applicant: Google LLC

    Abstract: An apparatus that includes an interposer, first power connectors that are disposed on a first surface and that receive respective power inputs from one or more power sources, second power connectors that are disposed on the second surface and that receive a respective third power connecter of an integrated circuit when the integrated circuit is mounted on the second surface of the interposer, a plurality of switches formed within the interposer, control circuitry formed within the interposer, and a sequencer circuit coupled to the control input of the control circuitry and that generates a different values for a control input signal that causes the control logic of the control circuitry to generate a corresponding set of switch signals, and the plurality of different values for the control input signal are generated according to a predefined sequence to provide power to the integrated circuit according to power up sequence.

    Programmable System TDP With ASIC Power Capping

    公开(公告)号:US20220269297A1

    公开(公告)日:2022-08-25

    申请号:US17744025

    申请日:2022-05-13

    Applicant: Google LLC

    Abstract: A programmable thermal dissipation power (TDP) system with integrated circuits is provided. The programmable TDP system includes a software interface, a monitoring circuit, and a controller circuit. The monitoring circuit may provide for the instantaneous input power supplied to the system. The controller circuit may monitor both the target TDP information specified from upstream and the input power readings. The controller circuit may generate a pulse-width modulation (PWM) signal that corresponds to a gap between the two power levels and sends the signal to the integrated circuits on the system. The integrated circuit may respond to the change in the input PWM signal and may adjust its power consumption. For example, the integrated circuit may adjust the clock frequency, adjust the instruction rate, skip a number of clock cycles, etc.

    Programmable system TDP with ASIC power capping

    公开(公告)号:US11334103B2

    公开(公告)日:2022-05-17

    申请号:US16996405

    申请日:2020-08-18

    Applicant: Google LLC

    Abstract: A programmable thermal dissipation power (TDP) system with integrated circuits is provided. The programmable TDP system includes a software interface, a monitoring circuit, and a controller circuit. The monitoring circuit may provide for the instantaneous input power supplied to the system. The controller circuit may monitor both the target TDP information specified from upstream and the input power readings. The controller circuit may generate a pulse-width modulation (PWM) signal that corresponds to a gap between the two power levels and sends the signal to the integrated circuits on the system. The integrated circuit may respond to the change in the input PWM signal and may adjust its power consumption. For example, the integrated circuit may adjust the clock frequency, adjust the instruction rate, skip a number of clock cycles, etc.

    Power balancer for series-connected load zones of an integrated circuit

    公开(公告)号:US10985652B1

    公开(公告)日:2021-04-20

    申请号:US16806521

    申请日:2020-03-02

    Applicant: Google LLC

    Abstract: This disclosure relates to power balancer circuits that enable multiple load zones of an IC to be powered in series while maintaining balanced voltage at each load zone. In one aspect, a circuit includes load zones that are powered in series. The circuit includes a power balancer for balancing a voltage across each load zone. The power balancer includes an equivalent DC transformer array that includes, for each load zone, an equivalent DC transformer connected in parallel with the load zone. The power balancer includes, for each load zone, a bus capacitor connected in parallel with the load zone. Each equivalent DC transformer is electrically connected to each other equivalent DC transformer providing an electrical path for each bus capacitor to discharge current to each other bus capacitor when a voltage across a bus capacitor is greater than a voltage across another bus capacitor.

    Power sequencing in an active silicon interposer

    公开(公告)号:US10742211B1

    公开(公告)日:2020-08-11

    申请号:US16527569

    申请日:2019-07-31

    Applicant: Google LLC

    Abstract: An apparatus that includes an interposer, first power connectors that are disposed on a first surface and that receive respective power inputs from one or more power sources, second power connectors that are disposed on the second surface and that receive a respective third power connector of an integrated circuit when the integrated circuit is mounted on the second surface of the interposer, a plurality of switches formed within the interposer, control circuitry formed within the interposer, and a sequencer circuit coupled to the control input of the control circuitry and that generates a different values for a control input signal that causes the control logic of the control circuitry to generate a corresponding set of switch signals, and the plurality of different values for the control input signal are generated according to a predefined sequence to provide power to the integrated circuit according to power up sequence.

    DC-DC converter
    19.
    发明授权

    公开(公告)号:US10211733B1

    公开(公告)日:2019-02-19

    申请号:US15796488

    申请日:2017-10-27

    Applicant: Google LLC

    Inventor: Shuai Jiang Xin Li

    Abstract: An apparatus that includes a resonant DC-DC converter with switching frequencies based on stray inductances of the physical components used to construct the apparatus. This results in a relatively high efficiency and high density DC-DC converter that, in some implementations, does not require a discrete inductor component.

    Methods for Multi-Source Configuration of Mobile Applications

    公开(公告)号:US20180239602A1

    公开(公告)日:2018-08-23

    申请号:US15956716

    申请日:2018-04-18

    Applicant: Google LLC

    CPC classification number: G06F8/71 G06F8/70 G06F9/44505

    Abstract: Disclosed are apparatus and methods for processing configuration data sets. A computing device can retrieve configuration data set(s) from data storage. A configuration data set can include key-value pairs related to configuring a software application, where a key-value pair can include a key name and an associated value. The computing device can merge the configuration data set(s) into a merged configuration data set by at least: determining whether multiple key-value pairs of the configuration data set(s) are in conflict; after determining that multiple key-value pairs of the configuration data set(s) are in conflict, determining a representative key-value pair to represent the multiple key-value pairs; and adding the representative key-value pair to the merged configuration data set. The computing device can provide the merged configuration data set to the software application.

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