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公开(公告)号：US5949132A
公开(公告)日：1999-09-07
申请号：US434137
申请日：1995-05-02
IPC分类号： B29C45/14 , B29C45/46 , H01L21/56 , H01L23/495 , H01L23/50
CPC分类号： B29C45/463 , B29C45/14655 , H01L21/565 , H01L21/566 , H01L23/49541 , H01L23/49558 , B29C2045/14663 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/00015 , H01L2924/01019 , H01L2924/01046 , H01L2924/12043 , H01L2924/14
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly using dambarless leadframes. Dambarless leadframe 191 is formed having leads 193 that are widened in the region near the package edge such that the interlead spacing between adjacent leads is less than a predetermined minimum distance. Lower and upper mold release films 67 and 65 are stretched over a plurality of die cavities formed in bottom and top mold chases 179 and 173. The release films can be further stretched into the die cavities by a vacuum. Leadframe strip assemblies containing the dambarless leadframes, each holding integrated circuit dies 189, are placed such that the integrated circuit dies are each centered over a bottom mold die cavity 63 and over the bottom mold release films 65. When the top and bottom mold chases are superimposed, the mold release films 67 and 65 are clamped together, and an interface is formed at the edges of the top and bottom mold cavities and between the leads of the dambarless leadframe. The mold compound is forced into the cavities by pressure. The interface between the top and bottom release films prevents the mold compound from forming mold flash between the leads of the dambarless leadframe. The dambarless leadframe includes a specific support tape 197 for the internal leads and a specialized open gate design.
摘要翻译： 一种用于使用无阻挡引线框封装集成电路管芯和引线框架组件的方法和装置。 无引线框架191形成为具有在封装边缘附近的区域中加宽的引线193，使得相邻引线之间的交错间隔小于预定的最小距离。 下部和上部脱模膜67和65在形成在底部和顶部模具179和173中的多个模腔上拉伸。剥离膜可以通过真空进一步拉伸到模具腔中。 每个保持集成电路模具189的包含无铅引线框架的引线框架组件被放置成使得集成电路模具分别位于底部模具模腔63和底部模具脱模膜65之上。当顶部和底部模具追逐是 将脱模膜67和65夹紧在一起，并且在顶部和底部模具腔的边缘以及在无铅引线框架的引线之间形成界面。 模具化合物通过压力被迫进入空腔。 顶部和底部剥离膜之间的界面防止模具化合物在无阻挡引线框架的引线之间形成模具闪光。 无铅引线框架包括用于内部引线的专用支撑带197和专门的开放门设计。
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12.发明授权Method for manufacturing prepackaged molding compound for component encapsulation 失效用于制造用于组件封装的预包装模塑料的方法
公开(公告)号：US5888443A
公开(公告)日：1999-03-30
申请号：US641982
申请日：1996-05-02
CPC分类号： B29C45/463
摘要： A method and apparatus for providing a prepackaged mold compound for use in encapsulating integrated circuit die and leadframe assemblies. A piece of mold compound 71 is placed in a receptacle 91 in a bottom mold chase 83. The receptacle 91 is coupled to a group of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 83 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 93 is placed over the bottom mold chase and the prepackaged mold compound 71. The prepackaged mold compound 71 is a piece of mold compound 73 packaged in a plastic film which has sealed edges 77. The edges are peelable seals, which are released during the molding process. The mold compound 73 is then forced through the seals during the molding process by the pressure applied by a plunger 101. The plunger 101 can be applied using variable speed and pressure to control the rate the mold compound 73 fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于提供用于封装集成电路管芯和引线框架组件的预包装模具化合物的方法和装置。 一块模具化合物71放置在底部模具追逐83中的容器91中。容器91通过流道87连接到一组模腔85.引线框架组件包含引线框架，集成电路管芯和连接线 引线框架和模具放置在底模追逐83之上，使得集成电路模具均位于底模模腔85的上方。顶模追逐93放置在底模追逐和预包装模具复合材料71上。预包装模具 复合物71是封装在具有密封边缘77的塑料膜中的一块模塑料73.边缘是在模制过程中释放的可剥离密封件。 然后，通过由柱塞101施加的压力，模制化合物73在模制过程中被迫通过密封件。可以使用可变速度和压力来施加柱塞101，以控制模具化合物73填充顶部和底部中的空腔的速率 模具追逐，从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的线扫。
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公开(公告)号：US5885506A
公开(公告)日：1999-03-23
申请号：US642245
申请日：1996-05-02
CPC分类号： B29C45/463 , B29C45/14655 , B29C70/72
摘要： A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.
摘要翻译： 一种用于封装集成电路管芯和引线框架组件的方法和装置。 将预先包装的模具复合插入件71放置在底部模具追逐器81中的矩形插座91中。插座通过流道87连接到多个模具空腔85.引线框架组件包含引线框架，集成电路模具和联接线 引线框架和模具放置在底部模具81上方，使得集成电路模具均位于底部模具模腔85的上方。顶部模具追逐90放置在底部模具追逐器81和模具复合封装件71上。顶部 模具追逐装置90具有对应于底部模具追逐件81中的模具腔体95.模具化合物插入件71被封装在具有热密封边缘77的塑料膜75中。模具化合物被迫通过包装75和热封77 通过由矩形柱塞101施加的压力的模制过程。使用可变速度和压力来施加柱塞以控制模具化合物填充顶部和机器人的空腔的速率 从而避免完成的包装中的空隙并且最小化集成电路组件的接合线的电线扫掠。
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公开(公告)号：US4890725A
公开(公告)日：1990-01-02
申请号：US222361
申请日：1988-07-20
CPC分类号： B29C43/361 , B23Q7/1426 , B29C33/36 , B29C43/06 , B29C43/18 , B29C45/0433 , B29C2043/046 , B29C2043/3444 , B29C2043/3615 , B29C31/006 , B29C70/72 , B29L2031/3406
摘要： An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.
摘要翻译： 一种自动连续循环模制系统，其中多个模具组以预定的定时循环通过一系列工作站运输，其中完成各种模制，固化和工件处理操作，并且其中模具组再循环移动通过系统以重复 用法。
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公开(公告)号：US4710094A
公开(公告)日：1987-12-01
申请号：US798679
申请日：1985-11-15
IPC分类号： B23Q7/14 , B29C31/00 , B29C33/36 , B29C43/06 , B29C43/18 , B29C43/36 , B29C45/04 , B65G25/00
CPC分类号： B29C43/361 , B23Q7/1426 , B29C33/36 , B29C43/06 , B29C43/18 , B29C45/0433 , B29C2043/046 , B29C2043/3444 , B29C2043/3615 , B29C31/006 , B29C70/72 , B29L2031/3406
摘要： An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.
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公开(公告)号：US4575328A
公开(公告)日：1986-03-11
申请号：US586855
申请日：1984-03-06
IPC分类号： B29C45/02 , B23Q7/14 , B29C31/00 , B29C33/36 , B29C43/06 , B29C43/18 , B29C43/36 , B29C45/04 , B29C45/06 , B29C45/14 , B29C45/17 , B29K101/10 , B29L31/34 , H01L21/56 , B29D31/00
CPC分类号： B29C43/361 , B23Q7/1426 , B29C33/36 , B29C43/06 , B29C43/18 , B29C45/0433 , B29C2043/046 , B29C2043/3444 , B29C2043/3615 , B29C31/006 , B29C70/72 , B29L2031/3406
摘要： An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are recirculatingly moved through the system for repeated usage.
摘要翻译： 一种自动连续循环模制系统，其中多个模具组以预定的定时循环通过一系列工作站运输，其中完成各种模制，固化和工件处理操作，并且其中模具组再循环移动通过系统以重复 用法。
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公开(公告)号：US4534921A
公开(公告)日：1985-08-13
申请号：US586853
申请日：1984-03-06
CPC分类号： H01L21/67126 , B29C33/72 , C23G5/00 , H01L21/67028 , H01L2924/0002
摘要： A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor circuits. After the molds are separated and the large pieces of excess plastic are broken away, they are transported to a vacuum chamber and electrically coupled as, or at least proximate, the cathode. The vacuum chamber is evacuated and an inert ionizable gas such as argon is admitted. An electrical field is established between the anode and cathode to create a plasma or glow discharge causing the gas to ionize. The positive ions are accelerated by the electrical field toward the cathode and bombard at least selected areas of the mold portion to be cleaned for removing surface contaminates and producing an extremely clean surface to enable the mold portion to be used again and again in a continuous cyclical or in-line process. Portions of the mold surface which are not to be bomdarded by ions, may be masked or shielded during the reverse sputtering operation.
摘要翻译： 一种用于清洁模具装置的至少选定表面以除去塑料残留物和表面污染物和杂质的方法和装置，以使得模具能够以连续的在线式方法用于封装引线框架组件或类似的半导体电路。 在模具分离并且大块过剩的塑料被破坏之后，它们被输送到真空室并且电耦合到阴极或至少接近阴极。 真空室被抽真空并且允许惰性的可电离气体如氩气。 在阳极和阴极之间建立电场以产生等离子体或辉光放电，导致气体电离。 正离子通过电场朝向阴极加速并且轰击待清洁的模具部分的至少一些选定区域以除去表面污染物并产生非常干净的表面，以使得模具部分可以一次又一次地以连续的周期性 或在线过程。 不会被离子轰击的模具表面的部分可能在反溅射操作期间被掩蔽或屏蔽。
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