公开(公告)号：US20180081203A1

公开(公告)日：2018-03-22

申请号：US15272856

申请日：2016-09-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tsung-Ching Huang ,  Chin-Hui Chen ,  Marco Fiorentino ,  Raymond G. Beausoleil

IPC: G02F1/01 ,  H03K5/06 ,  G02F1/025

CPC classification number: G02F1/0121 ,  G02F1/025 ,  G02F1/3132 ,  H03K5/06 ,  H03K5/14 ,  H03K2005/00019 ,  H04B10/2507 ,  H04B10/69

Abstract: Examples described herein relate to a driver circuit. In an example, the circuit includes a first input for receiving a first signal and a second input for receiving a second signal that is an inverse of the first signal. The circuit also includes a first driver array electrically coupling the first input to a first DC isolator and a first delay tap line electrically coupling the second input to the first DC isolator. The circuit further includes a second driver array electrically coupling the second input to a second DC isolator and a second delay tap line electrically coupling the first input to the second DC isolator. A carrier controller of the circuit is electrically coupled between the first DC isolator and the second DC isolator.

公开(公告)号：US20240295695A1

公开(公告)日：2024-09-05

申请号：US18116696

申请日：2023-03-02

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/136 ,  G02B6/122

CPC classification number: G02B6/136 ,  G02B6/122 ,  G02B2006/12097 ,  G02B2006/12173

Abstract: One aspect can provide a method for fabricating a photonic integrated circuit (PIC) with an embedded optical power monitor. The method can include creating a photomask based on a design of the PIC, the photomask comprising a pattern defining an optical waveguide for embedding the optical power monitor. Creating the photomask can include introducing a predetermined level of roughness along at least one edge of the pattern defining the optical waveguide. The method can further include fabricating the PIC, which can include using the photomask to create the optical waveguide with the introduced roughness on a sidewall corresponding to the edge of the pattern, thereby allowing light absorbed by the roughness to create free carriers for detection by the optical power monitor.

公开(公告)号：US11201449B2

公开(公告)日：2021-12-14

申请号：US16527352

申请日：2019-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel Morris ,  Di Liang ,  Raymond G. Beausoleil ,  Ashkan Seyedi

IPC: H01S3/00 ,  H01S5/00 ,  H04B10/50 ,  H04B10/572

Abstract: Processes and apparatuses described herein provide for an efficient cyclical fiber-optic connection between a source component and multiple destination components in a computing environment. A comb laser generates a laser signal that includes laser light of a first frequency that is red-shifted from a carrier frequency. The comb laser concurrently transmits the laser signal to four ring resonators via an optical waveguide. Three of the ring resonators are initially configured for optical resonance at a second frequency that is blue-shifted from the carrier frequency, while one of the ring resonators is initially configured for optical resonance at the first frequency. The laser signal is modulated to communicate data to a first target location associated with the ring resonator that is initially configured for optical resonance at the first frequency.

公开(公告)号：US20210036481A1

公开(公告)日：2021-02-04

申请号：US16527352

申请日：2019-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel Morris ,  Di Liang ,  Raymond G. Beausoleil ,  Ashkan Seyedi

IPC: H01S3/081 ,  H01S5/10

Abstract: Processes and apparatuses described herein provide for an efficient cyclical fiber-optic connection between a source component and multiple destination components in a computing environment. A comb laser generates a laser signal that includes laser light of a first frequency that is red-shifted from a carrier frequency. The comb laser concurrently transmits the laser signal to four ring resonators via an optical waveguide. Three of the ring resonators are initially configured for optical resonance at a second frequency that is blue-shifted from the carrier frequency, while one of the ring resonators is initially configured for optical resonance at the first frequency. The laser signal is modulated to communicate data to a first target location associated with the ring resonator that is initially configured for optical resonance at the first frequency.

公开(公告)号：US20200350991A1

公开(公告)日：2020-11-05

申请号：US16399176

申请日：2019-04-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Thomas Van Vaerenbergh ,  Raymond G. Beausoleil ,  Kevin B. Leigh ,  Di Liang ,  Terrel Morris ,  Paolo Faraboschi

IPC: H04B10/25 ,  H04J14/02 ,  G02B6/42 ,  G02F1/01 ,  H04B10/50 ,  H04B10/66

Abstract: Examples herein relate to optical systems. In particular, implementations herein relate to an optical system including a bidirectional optical link such as an optical fiber. The optical system includes first and second optical modules coupled to opposing ends of the optical fiber. The first optical module is configured to transmit optical signals across the optical fiber in a first direction and the second optical module is configured to transmit optical signals across the optical fiber in a second direction opposite the first direction. Each of the first and second optical modules includes a multi-wavelength optical source configured to emit light. Respective channel spacing of the multi-wavelength optical sources of the first and second optical modules are offset from each other such that the respective wavelengths of the emitted light transmitted across the optical fiber from the first and second optical sources do not overlap.

公开(公告)号：US10680408B2

公开(公告)日：2020-06-09

申请号：US16108399

申请日：2018-08-22

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Geza Kurczveil ,  Chong Zhang ,  Di Liang ,  Raymond G. Beausoleil

IPC: H01S5/10 ,  H01S5/50 ,  H01S5/34 ,  H01S5/343 ,  H01S5/065 ,  H01S5/14 ,  H01S5/022

Abstract: A quantum dot comb laser includes a body defining a lasing cavity and an extension defining an external cavity, the FSR of the lasing cavity being an inverse of an integer multiple of the FSR of the external cavity.

公开(公告)号：US20200067273A1

公开(公告)日：2020-02-27

申请号：US16671303

申请日：2019-11-01

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Geza Kurczveil ,  Di Liang ,  Raymond G. Beausoleil

IPC: H01S5/10 ,  H01S5/34 ,  H01S5/065 ,  H01S5/06 ,  H01S5/22 ,  H01S5/02

Abstract: Examples disclosed herein relate to multi-wavelength semiconductor lasers. In some examples disclosed herein, a multi-wavelength semiconductor laser may include a silicon-on-insulator (SOI) substrate and a quantum dot (QD) layer above the SOI substrate. The QD layer may include and active gain region and may have at least one angled junction at one end of the QD layer. The SOI substrate may include a waveguide in an upper silicon layer and a mode converter to facilitate optical coupling of a lasing mode to the waveguide.

公开(公告)号：US10551577B2

公开(公告)日：2020-02-04

申请号：US16023596

申请日：2018-06-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ashkan Seyedi ,  Marco Fiorentino ,  Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/34 ,  G02B6/42 ,  G02B6/32 ,  G02B6/30 ,  G02B6/124 ,  G02B6/12 ,  H01S5/0683

Abstract: Processes and apparatuses described herein reduce the manufacturing time, the cost of parts, and the cost of assembly per laser for photonic interconnects incorporated into computing systems. An output side of a laser assembly is placed against an input side of a silicon interposer (SiP) such that each pad in a plurality of pads positioned on the output side of the laser assembly is in contact with a respective solder bump that is also in contact with a corresponding pad positioned on the input side of the SiP. The laser assembly is configured to emit laser light from the output side into an input grating of the SiP. The solder bumps are heated to a liquid phase. Capillary forces of the solder bumps realign the laser assembly and the SiP while the solder bumps are in the liquid phase. The solder bumps are then allowed to cool.

公开(公告)号：US20190331854A1

公开(公告)日：2019-10-31

申请号：US15963570

申请日：2018-04-26

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Di Liang ,  Geza Kurczveil ,  Raymond G. Beausoleil

IPC: G02B6/122 ,  H01S3/063 ,  H01S3/23 ,  H01S5/10 ,  H01S5/20 ,  H01S5/02 ,  G02B6/12 ,  G02B6/13

Abstract: A hybrid grating comprises a first grating layer composed of a first solid-state material, and a second grating layer over the first grating layer and composed of a second solid-state material, the second solid state-material being different than the first solid-state material and having a monocrystalline structure.

公开(公告)号：US10396521B2

公开(公告)日：2019-08-27

申请号：US15720493

申请日：2017-09-29

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Geza Kurczveil ,  Raymond G. Beausoleil ,  Di Liang ,  Chong Zhang ,  David Kielpinski

IPC: H01S3/10 ,  H01S5/06 ,  H01S5/12 ,  H01S3/098 ,  H01S3/13 ,  H01S3/30 ,  H01S3/00 ,  H01S5/10

Abstract: A laser includes a traveling wave laser cavity with an active section, a pulse stretcher, and a pulse compressor. The pulse stretcher is coupled to the waveguide before the active section and the pulse compressor is coupled to the waveguide after the active section.