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    FLUID ANALYSIS WITH CHANNELS FORMED IN LIDS
    15.
    发明申请
    FLUID ANALYSIS WITH CHANNELS FORMED IN LIDS 有权

    公开(公告)号：US20220080414A1

    公开(公告)日：2022-03-17

    申请号：US17417609

    申请日：2019-05-07

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Silam J. Choy ,  Alexander Govyadinov ,  Erik D. Torniainen ,  Tod Woodford

    IPC: B01L3/00 ,  G01N21/64

    Abstract: In one example in accordance with the present disclosure, a fluid analysis device is described. The device includes a substrate, a die adhered to the substrate, and at least one fluid analysis element disposed on the die. A lid is adhered to the substrate and includes a channel formed thereinto be seated over the die. The device also includes an inlet port to the channel and an outlet from the channel. The inlet port and the outlet port are formed on at least one of the substrate and the lid. A number of electrical traces couple the die to a controller.

    MOLDED PRINTHEAD
    19.
    发明申请
    MOLDED PRINTHEAD 审中-公开
    模制打印

    公开(公告)号：US20160009086A1

    公开(公告)日：2016-01-14

    申请号：US14770608

    申请日：2013-09-27

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Silam J. Choy ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2002/14491 ,  B41J2202/19 ,  B41J2202/20

    Abstract: In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding.

    Abstract translation: 在一个示例中，打印头包括：打印头芯片，其具有可以从模具分配流体的前表面，模具模制成具有通道的整体模制件，流体可以通过该通道直接传递到模具的后部， 裸露在模具外部的模具的前表面和除了通道之外的由模制物覆盖的模具的后部; 暴露在模制件外部以连接到打印头外部的电路的电触头; 模制到模制品中的印刷电路板，印刷电路板具有与裸露的前表面共面并且围绕裸露的前表面的暴露的前表面和与触点电连接的导体; 以及在模具和完全封装在模制件中的印刷电路板导体之间的电连接。

    MICROFLUIDIC DEVICES
    20.
    发明申请
    MICROFLUIDIC DEVICES 有权

    公开(公告)号：US20220072540A1

    公开(公告)日：2022-03-10

    申请号：US17417362

    申请日：2019-05-15

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Silam J. Choy ,  Hilary Ely

    IPC: B01L3/00 ,  B01L7/00

    Abstract: A microfluidic device includes a semiconductor microchip including fluid active circuitry and transistor circuitry, wherein the transistor circuitry provides onboard logic at the semiconductor microchip to control the fluid active circuitry. The microfluidic device further includes a microfluidic chamber fluidly coupled to an inlet port and an outlet port, wherein the microfluidic chamber is defined in part by a microchip surface with the active circuitry positioned to interact with fluid introduced into the microfluidic chamber and partially defined by an enclosing surface. The microchip surface, the enclosing surface, or both include a chemically-modified microfluidic chamber surface that is selectively interactive with a target component of the fluid.

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