公开(公告)号：US20240318961A1

公开(公告)日：2024-09-26

申请号：US18123984

申请日：2023-03-21

Applicant: HRL Laboratories, LLC

Inventor： Logan SORENSON ,  Raviv Perahia ,  Matthew Pelliccione ,  Hung Nguyen ,  David Chang

IPC: G01C21/16

CPC classification number: G01C21/16

Abstract: A corner bracket comprising a volume of matter having n pairs of parallel faces, where n is an integer larger than 2; each face of each pair of parallel faces comprising an opening; the openings in the faces of each pair of parallel faces being joined by a cylindrical recess having a longitudinal axis perpendicular to the faces joined by the cylindrical recess; the longitudinal axis of the cylindrical recesses being arranged such that the cylindrical recesses do not intersect each other. The number n can be 3 and the volume of matter can be a cube.

公开(公告)号：US11237000B1

公开(公告)日：2022-02-01

申请号：US16395601

申请日：2019-04-26

Applicant: HRL Laboratories, LLC

Inventor： Raviv Perahia ,  Lian X. Huang ,  Logan D. Sorenson ,  Hung Nguyen ,  David T. Chang

IPC: G01C19/5684 ,  H03H9/125 ,  H03H9/24

Abstract: A sensor comprising a resonator structure arranged for resonating along a first plane; and at least one sensing electrode arranged on a second plane parallel to said first plane at a predetermined distance of said resonator structure along a direction normal to said first plane.

公开(公告)号：US11137249B2

公开(公告)日：2021-10-05

申请号：US16102565

申请日：2018-08-13

Applicant: HRL Laboratories, LLC

Inventor： Lian X. Huang ,  Logan D. Sorenson ,  Chia-Ming “Gavin” Chang ,  Raviv Perahia ,  Hung Nguyen ,  David T. Chang

IPC: G01C19/5677 ,  G01C19/5684

Abstract: A resonant structure comprising at least two coaxial rings, wherein adjacent coaxial rings have adjacent peripheries and are attached together by a plurality of connection structures regularly arranged along said adjacent peripheries; and wherein a first ring has a first ring portion with a first radial thickness and a second ring, portion, in a vicinity of a first connection structure, with a second radial thickness smaller than said first radial thickness.

公开(公告)号：US11060865B1

公开(公告)日：2021-07-13

申请号：US16389462

申请日：2019-04-19

Applicant: HRL Laboratories, LLC

Inventor： Lian X. Huang ,  Hung Nguyen ,  Raviv Perahia ,  Logan D. Sorenson ,  Patrick J. Webb ,  David T. Chang

IPC: G01C19/5712

Abstract: Dimensions of a disk resonator gyroscope along the radial line of a resonator can be varied to engineer radial stiffness. An apparatus may comprise: a resonator comprising a plurality of concentric circumferential segments and a plurality of slots formed between the concentric circumferential segments; and at least one support supporting the resonator, wherein a width, in a radial direction, of each of the concentric circumferential segments is varied depending on a distance from the at least one support to the each of the concentric circumferential segments. The apparatus may further comprise radial segments connecting between the concentric circumferential segments. The concentric circumferential segments may have a ring shape.

公开(公告)号：US10655964B2

公开(公告)日：2020-05-19

申请号：US16003010

申请日：2018-06-07

Applicant: HRL Laboratories, LLC

Inventor： Lian X. Huang ,  Logan D. Sorenson ,  Raviv Perahia ,  Hung Nguyen ,  David T. Chang

IPC: G01C19/5684 ,  G01C19/5677 ,  G01C19/5712

Abstract: A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

公开(公告)号：US10436587B2

公开(公告)日：2019-10-08

申请号：US16004310

申请日：2018-06-08

Applicant: HRL Laboratories, LLC

Inventor： Logan D. Sorenson ,  Hung Nguyen ,  Raviv Perahia ,  Lian X. Huang ,  David T. Chang

IPC: G01C19/5684 ,  G01C19/02 ,  G01C19/5712

Abstract: An angular sensor, comprising a Coriolis vibratory gyroscope (CVG) resonator, capable of oscillating along a first pair of normal n=1 modes comprising a first normal mode and a second normal mode; and a second pair of normal n=2 modes comprising a third normal mode and a fourth normal mode; the sensor further comprising one drive electrode and one sense electrode aligned along an anti-nodal axis of each mode; and a pair of bias tune electrodes aligned with an anti-nodal axis of each mode if no drive and sense electrode pair is aligned with said anti-nodal axis.

公开(公告)号：US10329897B2

公开(公告)日：2019-06-25

申请号：US15881700

申请日：2018-01-26

Applicant: HRL Laboratories, LLC

Inventor： Keerti S. Kona ,  Logan D. Sorenson ,  Raviv Perahia ,  Hung Nguyen ,  David Chang

IPC: E21B47/04 ,  E21B47/06 ,  E21B47/18 ,  E21B47/022

Abstract: Described is a system for estimating measured depth of a borehole. The system comprises a drilling fluid pulse telemetry system positioned in a borehole and processors connected with the drilling fluid pulse telemetry system. Time series measures are obtained from an environmental sensor package. Initial estimates of a time delay and path attenuation amplitude are determined. An error for the initial estimates is determined, and iterative minimization of the error is performed until source signal parameters converge, resulting in a least squares estimate of the source signal and the reflected signals. The least squares estimate is used to obtain time delay values, which are then used to continuously generate an estimate of a measured depth of the borehole.

公开(公告)号：US20190049247A1

公开(公告)日：2019-02-14

申请号：US16003010

申请日：2018-06-07

Applicant: HRL Laboratories, LLC

Inventor： Lian X HUANG ,  Logan D. Sorenson ,  Raviv Perahia ,  Hung Nguyen ,  Hung Nguyen ,  David T. Chang

IPC: G01C19/5712

Abstract: A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.

公开(公告)号：US20180371894A1

公开(公告)日：2018-12-27

申请号：US16018695

申请日：2018-06-26

Applicant: HRL LABORATORIES, LLC

Inventor： Shuoqin Wang ,  Logan D. Sorenson ,  David L. Walter ,  Adour V. Kabakian ,  Hung Nguyen ,  Raviv Perahia ,  David T. Chang

IPC: E21B47/022 ,  E21B47/06 ,  E21B7/04 ,  E21B47/024

Abstract: A method for generating an output of a downhole inertial measurement unit (IMU) includes: generating a trajectory between a plurality of survey points of a planned well data as a function of time, wherein the planned well data includes a plurality of three-dimensional coordinates corresponding to the survey points of an underground planned well are used to generate a trajectory comprising a plurality of trajectory coordinates between the consecutive ones of the survey points; generating sensor data for each of the trajectory coordinates as a function of time based on the geodetic reference parameters, the generated sensor data comprising: generated accelerometer output; generated gyroscopic output; and generated magnetometer output; and outputting the generated accelerometer output; the generated gyroscopic output; and the generated magnetometer output as a function of time as a generated output of the downhole IMU.

公开(公告)号：US09985198B1

公开(公告)日：2018-05-29

申请号：US14286419

申请日：2014-05-23

Applicant: HRL LABORATORIES LLC.

Inventor： David T. Chang ,  Frederic P. Stratton ,  Hung Nguyen ,  Randall L. Kubena

IPC: H01L41/311 ,  H01L41/053 ,  H01L41/047 ,  H01L41/23 ,  H01L41/29 ,  H01L41/332

CPC classification number: H01L41/311 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/23 ,  H01L41/29 ,  H01L41/332

Abstract: High-yield fabrication methods are provided for making quartz resonators having thicknesses ranging from one micrometer to several hundred micrometers and thus covering the frequency range from HF to UHF. Plasma dry etching is used to form arbitrary resonator geometries. The quartz resonator structure and the through-quartz vias are formed concurrently. The method includes bonding a quartz device wafer to a quartz handle wafer with a temporary adhesive. Mesa structures formed by plasma dry etching enable the resonators to achieve high-Q operation with energy trapping/mode confinement. A thermo-compression bond integrates the quartz resonators to a host wafer (e.g., an oscillator ASIC) to form oscillators. Silicon cap wafers are bonded over the resonators to the ASIC to provide wafer scale hermetic encapsulation of the quartz oscillators.