Abstract:
A thermoelectric generation apparatus includes a heat absorbing surface configured to absorb heat from an internal combustion engine, a heat generating surface bonded to the heat absorbing surface by a semiconductor and configured to discharge the heat to the outside, and a conductive converting part interposed between the heat absorbing surface and the internal combustion engine. The conductive converting part is configured to allow the heat to be conducted from the internal combustion engine to the heat absorbing surface when a temperature of the internal combustion engine is equal to or greater than a specific value.
Abstract:
A system for controlling thermal conductivity of a housing of an electronic part is provided. In particular, liquid is disposed within a hollow portion formed between an external wall body and an internal wall body of the housing and a magnetic field generating member is attached to an outer surface of the internal wall body. Insulating magnetic particles are dispersed in the liquid, and an orientation of the insulating magnetic particles is changed according to a direction of a magnetic field applied by the magnetic field generating member. This, as a result, controls the thermal conductivity of the housing.
Abstract:
A heat dissipation device for electronic controllers, is provided and includes a housing that has a hollow portion into which a working fluid for heat transfer and dissipation is filled. The housing of the electronic controller is formed to have the hollow portion using the material containing the heat-conductive filler and the heat transfer working fluid is filled in the hollow portion, to improve the cooling efficiency and achieving the weight reduction. By forming the condensation unit that condenses the vaporized working fluid in the upper end portion relative to the working fluid filled in the hollow portion of the housing, the heat exchange effect of the working fluid may be maximized.