公开(公告)号：US20180094875A1

公开(公告)日：2018-04-05

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H05K7/20 ,  H01L23/473

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20180018000A1

公开(公告)日：2018-01-18

申请号：US15546050

申请日：2015-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John P. Franz ,  David A. Moore

IPC: G06F1/20 ,  G05B19/4099 ,  H05K7/20

CPC classification number: G06F1/20 ,  B29C64/393 ,  B33Y50/02 ,  B33Y80/00 ,  G05B19/4099 ,  G05B2219/35134 ,  G05B2219/49007 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20772

Abstract: Example implementations relate to an integrated liquid cooling of a server system. For example, a method for integrated liquid cooling of a server system can include creating a liquid cooling component that includes creating a three dimensional (3D) design based on a server system, where the 3D design includes customized angle geometry. Further, the method for integrated liquid cooling of a server system can include forming the liquid cooling component based on the 3D design, where the liquid cooling component includes a plurality of liquid flow passages for delivering cooling resources to the server system, and delivering the cooling resources to the server system via the liquid cooling component.

公开(公告)号：US11705652B2

公开(公告)日：2023-07-18

申请号：US16949372

申请日：2020-10-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

CPC classification number: H01R12/707 ,  H01R12/716 ,  H01R13/113 ,  H05K1/181 ,  H05K2201/10189

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US11435298B2

公开(公告)日：2022-09-06

申请号：US16937782

申请日：2020-07-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  Jonathon Hughes ,  Michael L. Mixon ,  Gretchen La Fontaine Otero ,  Niysaan E. Vlasak

IPC: G01N21/956 ,  G01N21/95

Abstract: In some examples, a system receives a first image of a circuit board produced by a first production stage, and compares the first image to a second image of the circuit board acquired at a second production stage for the circuit board. The system indicates an anomaly with the circuit board based on the comparing.

公开(公告)号：US20180321977A1

公开(公告)日：2018-11-08

申请号：US15772348

申请日：2015-10-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  Zhikui Wang ,  Charles W. Cochran ,  Tahir Cader ,  Andrew Brown ,  John P. Franz ,  Christopher L. Holmes

IPC: G06F9/50 ,  G06F11/07

CPC classification number: G06F9/505 ,  G06F9/50 ,  G06F11/008 ,  G06F11/0751 ,  G06F11/0769 ,  G06F11/079 ,  G06F11/0793 ,  G06F11/321

Abstract: In one example, a system for fault representation of computing infrastructures includes an infrastructure engine to determine a fault relationship between a first element and a second element within a computing infrastructure, wherein the fault relationship represents an ability of the first element and the second element to function, a representation engine to generate a fault representation of the computing infrastructure based on the determined fault relationship between the first element and the second element within the computing infrastructure, and a workload engine to assign workloads to the computing infrastructure based on the fault representation of the computing infrastructure.

公开(公告)号：US20180067524A1

公开(公告)日：2018-03-08

申请号：US15562063

申请日：2015-04-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David A. Moore ,  John p. Franz ,  Wade D. Vinson

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/467 ,  H01L23/40

CPC classification number: G06F1/20 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/40 ,  H01L23/467 ,  H01L2023/4062 ,  H05K7/20736

Abstract: In one implementation, a system for supplemental air cooling includes a heat sink mounted to a computing device, a supplemental cooling device coupled to the heat sink by a number of heat pipes, and a fan coupled to the supplemental cooling device.

公开(公告)号：US10833438B1

公开(公告)日：2020-11-10

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/11 ,  H01R12/71

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US20200350714A1

公开(公告)日：2020-11-05

申请号：US16400540

申请日：2019-05-01

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Jian Miremadi ,  David A. Moore ,  John Norton ,  Eduardo F. Velazquez

IPC: H01R12/70 ,  H05K1/18 ,  H01R12/71 ,  H01R13/11

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

公开(公告)号：US10458724B2

公开(公告)日：2019-10-29

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F27/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US10330395B2

公开(公告)日：2019-06-25

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F7/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.