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Patent Agency Ranking
公开(公告)号：US09752866B2
公开(公告)日：2017-09-05
申请号：US14983053
申请日：2015-12-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Chun Wei , Yi-Sha Ku , Chia-Hung Cho , Chieh-Yu Wu , Chun-Wei Lo , Chih-Hsiang Liu
CPC classification number: G01B11/22 , G01B11/0616 , G01B11/2441 , G01B2210/56 , H01L22/12
Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.
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公开(公告)号：US12270638B2
公开(公告)日：2025-04-08
申请号：US18089547
申请日：2022-12-27
Applicant: Industrial Technology Research Institute
Inventor： Hsiang-Chun Wei , Chun-Wei Lo , Chung-Lun Kuo , Chih-Hsiang Liu
Abstract: A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.
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公开(公告)号：US11656181B2
公开(公告)日：2023-05-23
申请号：US17135874
申请日：2020-12-28
Applicant: Industrial Technology Research Institute
Inventor： Yan-Rung Lin , Chih-Hsiang Liu , Chung-Lun Kuo , Hsiang-Chun Wei , Yeou-Sung Lin , Chieh-Yi Lo
CPC classification number: G01N21/66 , G01N21/8806 , G01N2201/062
Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.
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公开(公告)号：US11248903B2
公开(公告)日：2022-02-15
申请号：US16717425
申请日：2019-12-17
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hung Cho , Po-Yi Chang , Yi-Sha Ku , Kai-Ping Chuang , Chih-Hsiang Liu , Fu-Cheng Yang
Abstract: A three-dimension measurement device includes a moving device, a projecting device, a surface-type image-capturing device and a processing device. The moving device carries an object, and moves the object to a plurality of positions. The projecting device generates a first light to the object. The surface-type image-capturing device senses a second light generated by the object in response to the first light to generate a phase image on each of the positions. The processing device is coupled to the surface-type image-capturing device and receives the phase images. The processing device performs a region-of-interest (ROI) operation for the phase images to generate a plurality of ROI images. The processing device performs a multi-step phase-shifting operation for the ROI images to calculate the surface height distribution of the object.
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公开(公告)号：US20210231570A1
公开(公告)日：2021-07-29
申请号：US17135874
申请日：2020-12-28
Applicant: Industrial Technology Research Institute
Inventor： Yan-Rung Lin , Chih-Hsiang Liu , Chung-Lun Kuo , Hsiang-Chun Wei , Yeou-Sung Lin , Chieh-Yi Lo
Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.
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