MEASUREMENT SYSTEM AND MEASUREMENT METHOD
    1.
    发明公开

    公开(公告)号:US20240200935A1

    公开(公告)日:2024-06-20

    申请号:US18089547

    申请日:2022-12-27

    CPC classification number: G01B11/254 G01B11/2441

    Abstract: A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.

    HETEROGENEOUS INTEGRATION DETECTING METHOD AND HETEROGENEOUS INTEGRATION DETECTING APPARATUS

    公开(公告)号:US20230152086A1

    公开(公告)日:2023-05-18

    申请号:US17562019

    申请日:2021-12-27

    CPC classification number: G01B11/22 G01B9/02049 G01B9/0203

    Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

    Apparatus and method for inspecting light-emitting diode dies

    公开(公告)号:US12203971B2

    公开(公告)日:2025-01-21

    申请号:US18075431

    申请日:2022-12-06

    Abstract: A method for inspecting LED dies includes the following steps. First electrodes and second electrodes of LED dies to be inspected are short-circuited via a conductive layer on an inspection substrate, or an inspection bias voltage is applied between the first electrodes and the second electrodes of the LED dies. An excitation light is irradiated on the LED dies to be inspected on the inspection substrate such that the LED dies to be inspected emit a secondary light. When the first electrodes and the second electrodes of the LED dies to be inspected are open, short-circuited, and/or subjected to the inspection bias voltage, the secondary light is captured via an optical sensor. An output of the optical sensor is received via a computer and a spectrum difference of the secondary light is calculated to determine whether the LED dies are abnormal or to classify the LED dies to be inspected.

    Method for inspecting light-emitting diodes and inspection apparatus

    公开(公告)号:US11474144B2

    公开(公告)日:2022-10-18

    申请号:US16907120

    申请日:2020-06-19

    Abstract: An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

    Heterogeneous integration detecting method and heterogeneous integration detecting apparatus

    公开(公告)号:US12007221B2

    公开(公告)日:2024-06-11

    申请号:US17562019

    申请日:2021-12-27

    CPC classification number: G01B11/22 G01B9/0203 G01B9/02049

    Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

    APPARATUS AND METHOD FOR INSPECTING LIGHT-EMITTING DIODE DIES

    公开(公告)号:US20230184819A1

    公开(公告)日:2023-06-15

    申请号:US18075431

    申请日:2022-12-06

    CPC classification number: G01R31/2635 G06T7/0004 G06T2207/30148

    Abstract: A method for inspecting LED dies includes the following steps. First electrodes and second electrodes of LED dies to be inspected are short-circuited via a conductive layer on an inspection substrate, or an inspection bias voltage is applied between the first electrodes and the second electrodes of the LED dies. An excitation light is irradiated on the LED dies to be inspected on the inspection substrate such that the LED dies to be inspected emit a secondary light. When the first electrodes and the second electrodes of the LED dies to be inspected are open, short-circuited, and/or subjected to the inspection bias voltage, the secondary light is captured via an optical sensor. An output of the optical sensor is received via a computer and a spectrum difference of the secondary light is calculated to determine whether the LED dies are abnormal or to classify the LED dies to be inspected.

    Optical measurement system for obtaining and analyzing surface topography of object

    公开(公告)号:US11507020B2

    公开(公告)日:2022-11-22

    申请号:US17028012

    申请日:2020-09-22

    Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.

    METHOD FOR INSPECTING LIGHT-EMITTING DIODES AND INSPECTION APPARATUS

    公开(公告)号:US20200371152A1

    公开(公告)日:2020-11-26

    申请号:US16907120

    申请日:2020-06-19

    Abstract: An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

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