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1.发明授权公开(公告)号：US12007221B2
公开(公告)日：2024-06-11
申请号：US17562019
申请日：2021-12-27
Applicant: Industrial Technology Research Institute
Inventor： Hsiang-Chun Wei , Chih-Hsiang Liu , Yi-Sha Ku , Chung-Lun Kuo , Chun-Wei Lo , Chieh-Yi Lo
IPC: G01B11/22 , G01B9/02 , G01B9/02015
CPC classification number: G01B11/22 , G01B9/0203 , G01B9/02049
Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.
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公开(公告)号：US12099053B2
公开(公告)日：2024-09-24
申请号：US17563701
申请日：2021-12-28
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Chun Wei , Chih-Hsiang Liu , Chung-Lun Kuo , Chun-Wei Lo , Chia-Hung Cho , Wei-Hsiung Tsai
CPC classification number: G01N33/505 , G01N15/1433 , G03H1/0005 , G03H1/0443 , G03H1/0866 , G06T7/0012 , G03H2001/0033 , G03H2001/005 , G06T2207/10056 , G06T2207/10064 , G06T2207/20081 , G06T2207/20084 , G06T2207/30024
Abstract: A method of training AI for label-free cell viability determination includes a step of providing a cell sample, a step of obtaining a fluorescence image and a DHM image of the cell sample, a step of determining a first cell viability of the cell sample according to the fluorescence image of the cell sample, a step of labeling the DHM image of the cell sample as a model specifying the first cell viability, and a step of performing AI training by using the model containing the DHM image of the cell sample.
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公开(公告)号：US20240200935A1
公开(公告)日：2024-06-20
申请号：US18089547
申请日：2022-12-27
Applicant: Industrial Technology Research Institute
Inventor： Hsiang-Chun Wei , Chun-Wei Lo , Chung-Lun Kuo , Chih-Hsiang Liu
CPC classification number: G01B11/254 , G01B11/2441
Abstract: A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.
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4.发明公开公开(公告)号：US20230152086A1
公开(公告)日：2023-05-18
申请号：US17562019
申请日：2021-12-27
Applicant: Industrial Technology Research Institute
Inventor： Hsiang-Chun Wei , Chih-Hsiang Liu , Yi-Sha Ku , Chung-Lun Kuo , Chun-Wei Lo , Chieh-Yi Lo
IPC: G01B11/22 , G01B9/02 , G01B9/02015
CPC classification number: G01B11/22 , G01B9/02049 , G01B9/0203
Abstract: A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.
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Patent Agency Ranking
公开(公告)号：US11507020B2
公开(公告)日：2022-11-22
申请号：US17028012
申请日：2020-09-22
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Chun Wei , Chung-Lun Kuo , Chia-Hung Cho , Chun-Wei Lo , Chih-Hsiang Liu
IPC: G03H1/04 , G06T15/08 , G01B9/02091 , G03H1/00
Abstract: An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.
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公开(公告)号：US09752866B2
公开(公告)日：2017-09-05
申请号：US14983053
申请日：2015-12-29
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Chun Wei , Yi-Sha Ku , Chia-Hung Cho , Chieh-Yu Wu , Chun-Wei Lo , Chih-Hsiang Liu
CPC classification number: G01B11/22 , G01B11/0616 , G01B11/2441 , G01B2210/56 , H01L22/12
Abstract: A measurement system is configured to measure a surface structure of a sample. The surface of the sample has a thin film and a via, the depth of the via is larger than the thickness of the thin film. The measurement system includes a light source, a first light splitter, a first aperture stop, a lens assembly, a second aperture stop, a spectrum analyzer and an analysis module. The first light splitter disposed in the light emitting direction of the light source. The first aperture stop disposed between the light source and the first light splitter. The lens assembly is disposed between the first light splitter and the sample. The second aperture stop is disposed between the lens assembly and the first light splitter. The spectrum analyzer is disposed to at a side of the first light splitter opposite to the sample.
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公开(公告)号：US12270638B2
公开(公告)日：2025-04-08
申请号：US18089547
申请日：2022-12-27
Applicant: Industrial Technology Research Institute
Inventor： Hsiang-Chun Wei , Chun-Wei Lo , Chung-Lun Kuo , Chih-Hsiang Liu
Abstract: A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.
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公开(公告)号：US11656181B2
公开(公告)日：2023-05-23
申请号：US17135874
申请日：2020-12-28
Applicant: Industrial Technology Research Institute
Inventor： Yan-Rung Lin , Chih-Hsiang Liu , Chung-Lun Kuo , Hsiang-Chun Wei , Yeou-Sung Lin , Chieh-Yi Lo
CPC classification number: G01N21/66 , G01N21/8806 , G01N2201/062
Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.
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公开(公告)号：US20210231570A1
公开(公告)日：2021-07-29
申请号：US17135874
申请日：2020-12-28
Applicant: Industrial Technology Research Institute
Inventor： Yan-Rung Lin , Chih-Hsiang Liu , Chung-Lun Kuo , Hsiang-Chun Wei , Yeou-Sung Lin , Chieh-Yi Lo
Abstract: An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.
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