公开(公告)号：US20150115442A1

公开(公告)日：2015-04-30

申请号：US14068170

申请日：2013-10-31

Applicant: Infineon Technologies AG

Inventor： Georg MEYER-BERG ,  Reinhard Pufall

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L24/03 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L2224/02317 ,  H01L2224/02373 ,  H01L2224/0401 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

Abstract: A redistribution layer for a chip is provided, wherein the redistribution layer comprises at least one electrical conductor path connecting two connection points with each other, wherein the at least one electrical conductor path is arranged on a planar supporting layer and wherein the electrical conductor path comprises copper and at least one other further electrical conductive material in an amount of more than 0.04 mass percent.

Abstract translation: 提供了一种用于芯片的再分配层，其中再分配层包括将两个连接点彼此连接的至少一个电导体路径，其中至少一个电导体路径被布置在平面支撑层上，并且其中电导体路径包括 铜和至少一种其它导电材料，其量大于0.04质量％。

公开(公告)号：US20150014845A1

公开(公告)日：2015-01-15

申请号：US13939248

申请日：2013-07-11

Applicant: Infineon Technologies AG

Inventor： Georg Meyer-Berg ,  Reinhard Pufall ,  Michael Goroll ,  Rainer Dudek

IPC: H01L23/498 ,  G06F17/50 ,  H01L23/00

CPC classification number: H01L23/04 ,  G06F17/5068 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/10 ,  H01L2224/01 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83447 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/35121 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A semiconductor package includes a support substrate having opposing first and second main surfaces and sides between the first and second main surfaces, a semiconductor die attached to one of the main surfaces of the support substrate, and an encapsulation material at least partly covering the support substrate and the semiconductor die. A protrusion extends outward from a side of the support substrate and terminates in the encapsulation material. The protrusion forms an interlocked connection with the encapsulation material. The interlocked connection increases the tensile strength of the interface between the encapsulation material and the side of the support substrate with the protrusion.

Abstract translation: 半导体封装包括具有相对的第一和第二主表面以及第一和第二主表面之间的侧面的支撑衬底，附接到支撑衬底的一个主表面的半导体管芯以及至少部分地覆盖支撑衬底的封装材料 和半导体管芯。 突起从支撑基板的一侧向外延伸并终止在封装材料中。 突起形成与封装材料的互锁连接。 互锁连接通过突起增加了封装材料与支撑基板侧面之间的界面的拉伸强度。