公开(公告)号：US20220270985A1

公开(公告)日：2022-08-25

申请号：US17582285

申请日：2022-01-24

申请人： Infineon Technologies AG

发明人： Sergey Ananiev ,  Andreas Bauer ,  Michael Goroll ,  Maria Heidenblut ,  Stefan Kaiser ,  Gunther Mackh ,  Kabula Mutamba ,  Reinhard Pufall ,  Georg Reuther

IPC分类号： H01L23/00

摘要： A semiconductor chip having a crack stop structure is disclosed. The crack stop structure includes one or more recesses formed in the semiconductor chip. The one or more recesses extend adjacent to and along a periphery of the semiconductor chip. The one or more recesses are filled with a metal material. The metal material has an intrinsic tensile stress at room temperature that induces compressive stress in at least a region of the periphery of the semiconductor chip.

公开(公告)号：US10090216B2

公开(公告)日：2018-10-02

申请号：US15442084

申请日：2017-02-24

申请人： Infineon Technologies AG

发明人： Georg Meyer-Berg ,  Reinhard Pufall ,  Michael Goroll ,  Rainer Dudek

IPC分类号： H01L23/04 ,  H05K1/18 ,  H01L25/10

摘要： A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an encapsulation material at least partly covering the block. One or both of the main surfaces of the block has recessed regions. The recessed regions do not extend completely through the block from one main surface to the other main surface. The encapsulation material fills the recessed regions to form an interlocked connection between the block and the encapsulation material. Additional semiconductor package embodiments are provided.

公开(公告)号：US20170170082A1

公开(公告)日：2017-06-15

申请号：US15442084

申请日：2017-02-24

申请人： Infineon Technologies AG

发明人： Georg Meyer-Berg ,  Reinhard Pufall ,  Michael Goroll ,  Rainer Dudek

IPC分类号： H01L23/04 ,  H01L25/10 ,  H05K1/18

CPC分类号： H01L23/04 ,  G06F17/5068 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/10 ,  H01L2224/01 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83447 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/35121 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an encapsulation material at least partly covering the block. One or both of the main surfaces of the block has recessed regions. The recessed regions do not extend completely through the block from one main surface to the other main surface. The encapsulation material fills the recessed regions to form an interlocked connection between the block and the encapsulation material. Additional semiconductor package embodiments are provided.

公开(公告)号：US09627305B2

公开(公告)日：2017-04-18

申请号：US13939248

申请日：2013-07-11

申请人： Infineon Technologies AG

发明人： Georg Meyer-Berg ,  Reinhard Pufall ,  Michael Goroll ,  Rainer Dudek

IPC分类号： H01L23/498 ,  G06F17/50 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/04 ,  G06F17/5068 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/10 ,  H01L2224/01 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83447 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/35121 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package includes a support substrate having opposing first and second main surfaces and sides between the first and second main surfaces, a semiconductor die attached to one of the main surfaces of the support substrate, and an encapsulation material at least partly covering the support substrate and the semiconductor die. A protrusion extends outward from a side of the support substrate and terminates in the encapsulation material. The protrusion forms an interlocked connection with the encapsulation material. The interlocked connection increases the tensile strength of the interface between the encapsulation material and the side of the support substrate with the protrusion.

公开(公告)号：US20150014845A1

公开(公告)日：2015-01-15

申请号：US13939248

申请日：2013-07-11

申请人： Infineon Technologies AG

发明人： Georg Meyer-Berg ,  Reinhard Pufall ,  Michael Goroll ,  Rainer Dudek

IPC分类号： H01L23/498 ,  G06F17/50 ,  H01L23/00

CPC分类号： H01L23/04 ,  G06F17/5068 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49811 ,  H01L24/81 ,  H01L25/10 ,  H01L2224/01 ,  H01L2224/291 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83447 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/35121 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor package includes a support substrate having opposing first and second main surfaces and sides between the first and second main surfaces, a semiconductor die attached to one of the main surfaces of the support substrate, and an encapsulation material at least partly covering the support substrate and the semiconductor die. A protrusion extends outward from a side of the support substrate and terminates in the encapsulation material. The protrusion forms an interlocked connection with the encapsulation material. The interlocked connection increases the tensile strength of the interface between the encapsulation material and the side of the support substrate with the protrusion.

摘要翻译： 半导体封装包括具有相对的第一和第二主表面以及第一和第二主表面之间的侧面的支撑衬底，附接到支撑衬底的一个主表面的半导体管芯以及至少部分地覆盖支撑衬底的封装材料 和半导体管芯。 突起从支撑基板的一侧向外延伸并终止在封装材料中。 突起形成与封装材料的互锁连接。 互锁连接通过突起增加了封装材料与支撑基板侧面之间的界面的拉伸强度。