公开(公告)号：US10797394B2

公开(公告)日：2020-10-06

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US11729902B2

公开(公告)日：2023-08-15

申请号：US16268318

申请日：2019-02-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William James Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01F5/04 ,  H04B1/40 ,  H01L25/16

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  G06F1/163 ,  G06F1/1626 ,  G06F2200/1631 ,  H01L25/16 ,  H04B1/40 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US11664596B2

公开(公告)日：2023-05-30

申请号：US17373926

申请日：2021-07-13

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

CPC classification number: H01Q9/0407 ,  H01Q1/085 ,  H01Q1/2283 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US10672693B2

公开(公告)日：2020-06-02

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H05K1/18 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20190372229A1

公开(公告)日：2019-12-05

申请号：US16000795

申请日：2018-06-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/08 ,  H01Q1/22

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US20190304887A1

公开(公告)日：2019-10-03

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H05K1/18

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.