公开(公告)号：US11522291B2

公开(公告)日：2022-12-06

申请号：US16230636

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Omkar G. Karhade ,  William James Lambert ,  Xiaoqian Li ,  Nitin A. Deshpande ,  Debendra Mallik

IPC: H01Q9/04

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include a plurality of antenna patches coupled to a dielectric material and a plurality of pedestals extending from a face of the dielectric material and at least partially embedded in the dielectric material.

公开(公告)号：US20210344116A1

公开(公告)日：2021-11-04

申请号：US17373926

申请日：2021-07-13

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

公开(公告)号：US11107757B2

公开(公告)日：2021-08-31

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20200251411A1

公开(公告)日：2020-08-06

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/56 ,  H05K7/02 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H05K1/18 ,  H01L21/48 ,  H01L23/31

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20190260110A1

公开(公告)日：2019-08-22

申请号：US15939139

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Trang Thai ,  Raanan Sover ,  Noam Kogan ,  Jonathan Jensen ,  Richard Perry ,  William James Lambert ,  Omer Asaf ,  Ralph Winzenburg ,  Daniel R. Cox ,  Josef Hagn ,  Sidharth Dalmia

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.

公开(公告)号：US20210351116A1

公开(公告)日：2021-11-11

申请号：US17379724

申请日：2021-07-19

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20210066265A1

公开(公告)日：2021-03-04

申请号：US16553544

申请日：2019-08-28

Applicant: Intel Corporation

Inventor： Feras Eid ,  Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Johanna M. Swan ,  Sivakumar Nagarajan ,  Nitin A. Deshpande ,  Omkar G. Karhade ,  William James Lambert

IPC: H01L25/16 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H03F3/213 ,  H01G2/06 ,  H01G2/10

Abstract: Disclosed herein are tunable capacitor arrangements in integrated circuit (IC) package substrates, as well as related methods and devices. For example, in some embodiments, an IC package substrate may include a first embedded capacitor, a second embedded capacitor, and a fuse electrically coupled between the first embedded capacitor and the second embedded capacitor such that when the fuse is in a closed state, the first embedded capacitor and the second embedded capacitor are connected in parallel, and when the fuse is in an open state, the first embedded capacitor and the second embedded capacitor are not connected in parallel.

公开(公告)号：US20200253040A1

公开(公告)日：2020-08-06

申请号：US16268318

申请日：2019-02-05

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William James Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  H05K1/18 ,  G06F1/16 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/50

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US11804426B2

公开(公告)日：2023-10-31

申请号：US17379724

申请日：2021-07-19

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

CPC classification number: H01L23/49816 ,  H01L21/4832 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H05K1/181 ,  H05K7/023

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US11121468B2

公开(公告)日：2021-09-14

申请号：US17014081

申请日：2020-09-08

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai ,  William James Lambert ,  Zhichao Zhang ,  Jiwei Sun

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/08 ,  H01Q11/14

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.