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Patent Agency Ranking
公开(公告)号：US11547363B2
公开(公告)日：2023-01-10
申请号：US16262933
申请日：2019-01-31
Applicant: Industrial Technology Research Institute
Inventor： Ming-Huan Yang , Kuang-Ching Fan , Yen-Ting Wu , Yi-Cheng Lu , Jui-Chang Chuang
Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.
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公开(公告)号：US11262482B2
公开(公告)日：2022-03-01
申请号：US16039336
申请日：2018-07-19
Inventor： Jui-Chang Chuang , Chen-Chu Tsai , Kai-Ming Chang , Chih-Chia Chang , Ting-Hsun Cheng
Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
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公开(公告)号：US10964912B2
公开(公告)日：2021-03-30
申请号：US16379815
申请日：2019-04-10
Inventor： Yung-Hui Yeh , Jui-Chang Chuang , Li-Ching Wang , Cheng-Yueh Chang , Chyi-Ming Leu , Shih-Ming Chen
Abstract: Provided is a protective structure including an auxiliary layer and a hard coating layer. The auxiliary layer has a first surface and a second surface opposite to the first surface. The hard coating layer is located on the second surface of the auxiliary layer. The Young's modulus of the auxiliary layer is gradually increased from the second surface to the first surface. An electronic device with the same is also provided.
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公开(公告)号：US20190246987A1
公开(公告)日：2019-08-15
申请号：US16262933
申请日：2019-01-31
Applicant: Industrial Technology Research Institute
Inventor： Ming-Huan Yang , Kuang-Ching Fan , Yen-Ting Wu , Yi-Cheng Lu , Jui-Chang Chuang
IPC: A61B5/00 , A61B5/0205 , A61B5/0424 , A61B5/024
CPC classification number: A61B5/721 , A61B5/0002 , A61B5/02055 , A61B5/02405 , A61B5/02438 , A61B5/04004 , A61B5/04012 , A61B5/0424 , A61B5/08 , A61B5/6833 , A61B5/688 , A61B5/743
Abstract: A physiological sensor device and system, and a correction method are provided. The physiological sensor device includes a physiological signal sensor, a first compensation sensor, and a signal processing device. The physiological signal sensor is attached to an object to be detected to sense a physiological signal value. The first compensation sensor is disposed on the physiological signal sensor. The signal processing device is coupled to the physiological signal sensor and the first compensation sensor. The signal processing device obtains through the first compensation sensor a failure region of the physiological signal sensor partially detached from the object to be detected and obtains a first failure compensation value according to the failure region, so as to compensate the physiological signal value sensed by the physiological signal sensor.
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公开(公告)号：US20190049630A1
公开(公告)日：2019-02-14
申请号：US16039336
申请日：2018-07-19
Inventor： Jui-Chang Chuang , Chen-Chu Tsai , Kai-Ming Chang , Chih-Chia Chang , Ting-Hsun Cheng
Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.
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