公开(公告)号：US20140198435A1

公开(公告)日：2014-07-17

申请号：US13934222

申请日：2013-07-02

Applicant: Industrial Technology Research Institute

Inventor： Shu-Tang Yeh ,  Chia-Hao Tsai ,  Mei-Ru Lin

IPC: H05K5/02

CPC classification number: H05K1/0274 ,  H05K1/183 ,  H05K5/064

Abstract: A package structure of an electronic device includes a first substrate, a second substrate, an electronic device and a first barrier structure. The first substrate includes a first light-transmitting portion and a periphery portion. The second substrate includes a second light-transmitting portion and two covering portions located on two sides of the second light-transmitting portion. The first light-transmitting portion is disposed corresponding to the second light-transmitting portion, and a device disposition region exists therebetween. The covering portions cover the periphery portion of the first substrate and two opposite side surfaces of the first substrate. The electronic device is disposed on the first or second substrate, and is located in the device disposition region. The first barrier structure disposed on the first substrate or the second substrate is disposed corresponding to the periphery portion and disposed on at least one side of the device disposition region.

Abstract translation: 电子器件的封装结构包括第一衬底，第二衬底，电子器件和第一屏障结构。 第一基板包括第一透光部分和周边部分。 第二基板包括第二透光部分和位于第二光透射部分两侧的两个覆盖部分。 第一光透射部分对应于第二光透射部分设置，并且在其间存在器件配置区域。 覆盖部分覆盖第一基板的周边部分和第一基板的两个相对的侧表面。 电子设备设置在第一或第二基板上，并且位于设备配置区域中。 设置在第一基板或第二基板上的第一阻挡结构相对于周边部分设置并设置在装置配置区域的至少一侧。

公开(公告)号：US10985297B2

公开(公告)日：2021-04-20

申请号：US16423131

申请日：2019-05-27

Applicant: Industrial Technology Research Institute ,  Intellectual Property Innovation Corporation

Inventor： Yen-Ching Kuo ,  Chien-Chang Hung ,  Jane-Hway Liao ,  Yi-Hsiang Huang ,  Shu-Tang Yeh ,  Hong-Ming Dai ,  Hung-Yi Chen

IPC: H01L33/56 ,  H01L33/50 ,  H01L33/60

Abstract: A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

公开(公告)号：US09510459B2

公开(公告)日：2016-11-29

申请号：US14098551

申请日：2013-12-06

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Shu-Tang Yeh ,  Sheng-Wei Chen ,  Kuang-Jung Chen

IPC: H05K3/30 ,  H01L51/52 ,  G02F1/1333

CPC classification number: H05K3/30 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2202/28 ,  H01L51/5246 ,  H01L51/5259 ,  Y10T29/49128

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract translation: 提供了包括第一基板，第二基板，环境敏感电子设备，侧壁阻挡结构，第一粘合剂和第二粘合剂的环境敏感的电子设备封装。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一基底上。 侧壁阻挡结构位于第一粘合剂上，并且侧壁阻挡结构通过第一粘合剂粘附到第一基底。 第二粘合剂位于侧壁阻挡结构上。 侧壁阻挡结构通过第二粘合剂粘附到第二基板，并且侧壁阻挡结构，第一粘合剂和第二粘合剂位于第一基板和第二基板之间。 还提供了一种环境敏感电子设备封装的制造方法。

公开(公告)号：US08878226B2

公开(公告)日：2014-11-04

申请号：US13744207

申请日：2013-01-17

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Shu-Tang Yeh ,  Chih-Chieh Hsu ,  Chen-Wei Lin ,  Kuang-Jung Chen

IPC: H01L33/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/5228 ,  H01L27/3244

Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.

Abstract translation: 发光器件包括衬底和设置在其上的多个发光结构。 每个发光结构包括设置在基板上的辅助电极，设置在基板上并覆盖辅助电极的第一绝缘层，设置在第一绝缘层上的电极，设置在第一绝缘层上的第二绝缘层， 暴露电极的第一开口，设置在第一开口中的有机发光层，设置在有机发光层上的阴极，至少穿过第一绝缘层和第二绝缘层的导电结构，以及闭环结构 设置在第二绝缘层上并围绕阴极，其中闭环结构的厚度大于阴极的厚度。

公开(公告)号：US20140175405A1

公开(公告)日：2014-06-26

申请号：US14091341

申请日：2013-11-27

Applicant: Industrial Technology Research Institute

Inventor： Shu-Tang Yeh ,  Jia-Chong Ho

IPC: H01L23/26 ,  H01L51/52

CPC classification number: H01L51/5259 ,  H01L51/0097 ,  H01L51/5256 ,  Y02E10/549 ,  Y02P70/521

Abstract: A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.

Abstract translation: 提供电子设备的封装结构。 这种封装结构的基板具有至少一个嵌入的气体阻隔结构，其保护安装在其上的电子设备并提供良好的阻气能力，以延长电子设备的寿命。

公开(公告)号：US20130193843A1

公开(公告)日：2013-08-01

申请号：US13753449

申请日：2013-01-29

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Chih-Chieh Hsu ,  Chen-Wei Lin ,  Shu-Tang Yeh ,  Ping-I Shih

IPC: H05B33/22

CPC classification number: H05B33/22 ,  H01L27/3211 ,  H01L27/322 ,  H01L27/3267 ,  H01L51/5218 ,  H01L51/5234

Abstract: A double-side light emitting display panel includes a substrate, a plurality of top emission pixel structures and a plurality of bottom emission pixel structures. The top emission pixel structures are disposed on the substrate, and the bottom emission pixel structures are disposed on the substrate. The top emission pixel structures and the bottom emission pixel structures are arranged alternatively on the substrate.

Abstract translation: 双面发光显示面板包括基板，多个顶部发射像素结构和多个底部发射像素结构。 顶部发射像素结构设置在衬底上，并且底部发射像素结构设置在衬底上。 顶部发射像素结构和底部发射像素结构交替地布置在衬底上。