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    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS
    11.
    发明申请
    AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS 审中-公开
    数据中心服务器机架的空气流量分配系统

    公开(公告)号：US20150181770A1

    公开(公告)日：2015-06-25

    申请号：US14473395

    申请日：2014-08-29

    Applicant: INERTECH IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell

    IPC: H05K7/20 ,  F21V33/00

    CPC classification number: H05K7/20745 ,  F21V33/0092 ,  F21W2131/40

    Abstract: An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

    Abstract translation: 用于冷却服务器机架的气流分配系统包括至少一个部分地限定热通道和冷通道的服务器机架，设置在服务器机架上方的第一气垫和设置在第一气翼上方的第二气箔。 第一气翼和第二气翼被构造成从热通道接收空气，并在冷通道中形成湍流尾迹图案，其部分地由服务器机架限定。 气流分配系统可以包括在第二气翼上方的凸顶件。 相应的方法包括使空气被引导到设置在服务器机架上方的第一空气箔和设置在第一空气箔之上的第二空气箔，以在冷通道中形成湍流尾流图案。 电气外壳组件包括插座和构造为空气箔的盖构件。

    COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID
    12.
    发明申请
    COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID 有权

    公开(公告)号：US20240384936A1

    公开(公告)日：2024-11-21

    申请号：US18616132

    申请日：2024-03-25

    Applicant: INERTECH IP LLC

    Inventor： Ming Zhang ,  Ken Nguyen ,  Doron Shapiro ,  John Costakis

    IPC: F28D7/00 ,  B23K1/00 ,  B23P15/26 ,  F28D1/047 ,  F28D1/053 ,  F28F1/02 ,  F28F1/12 ,  F28F9/013 ,  F28F9/02 ,  F28F21/08 ,  G06F1/20 ,  H05K7/20

    Abstract: A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

    MODULAR AIR COOLING AND DISTRIBUTION SYSTEMS AND METHODS
    13.
    发明申请
    MODULAR AIR COOLING AND DISTRIBUTION SYSTEMS AND METHODS 有权

    公开(公告)号：US20240381588A1

    公开(公告)日：2024-11-14

    申请号：US18634783

    申请日：2024-04-12

    Applicant: Inertech IP LLC

    Inventor： John Costakis ,  Ken Nguyen ,  Ming Zhang ,  Doron Shapiro

    IPC: H05K7/20

    Abstract: Modular air cooling and distribution systems include a fan and heat exchanger cooling assembly and a controller which controls the fan speed based on temperature and velocity measurements. The cooling assembly includes a fluid-to-air heat exchanger and a variable speed fan. The fluid in the fluid-to-air heat exchanger may be propylene glycol or water. The heat exchanger minimizes pressure drop and maximizes heat transfer. The quantity of cooling assemblies is selected to match the indoor cooling requirements. The cooling assemblies are easily assembled together, stacked vertically, and/or connected horizontally, to match the cooling load. If additional cooling capacity is needed in the future, more cooling assemblies can easily be added, and the cooling assemblies may be expanded vertically and/or horizontally. The speed of the fans of the fan and heat exchanger assemblies are controlled based on fluid temperature and fluid velocity measurements, which may be obtained by an anemometer.

    COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID
    14.
    发明申请
    COOLING SYSTEMS AND METHODS USING SINGLE-PHASE FLUID 有权

    公开(公告)号：US20230031815A1

    公开(公告)日：2023-02-02

    申请号：US17856654

    申请日：2022-07-01

    Applicant: INERTECH IP LLC

    Inventor： Ming Zhang ,  Ken Nguyen ,  Doron Shapiro ,  John Costakis

    IPC: F28D7/00 ,  H05K7/20 ,  F28D1/047 ,  F28F1/02 ,  G06F1/20 ,  F28F9/013 ,  F28F1/12 ,  F28D1/053 ,  F28F21/08 ,  B23K1/00 ,  B23P15/26 ,  F28F9/02

    Abstract: A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

    Cooling systems and methods using single-phase fluid
    15.
    发明授权
    Cooling systems and methods using single-phase fluid 有权

    公开(公告)号：US11384989B2

    公开(公告)日：2022-07-12

    申请号：US15697445

    申请日：2017-09-06

    Applicant: Inertech IP LLC

    Inventor： Ming Zhang ,  Ken Nguyen ,  Doron Shapiro ,  John Costakis

    IPC: F28D7/00 ,  H05K7/20 ,  F28D1/047 ,  F28F1/02 ,  G06F1/20 ,  F28F9/013 ,  F28F1/12 ,  F28D1/053 ,  F28F21/08 ,  B23K1/00 ,  B23P15/26 ,  F28F9/02

    Abstract: A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

    Systems and assemblies for cooling server racks
    16.
    发明授权
    Systems and assemblies for cooling server racks 有权

    公开(公告)号：US10448539B2

    公开(公告)日：2019-10-15

    申请号：US15590596

    申请日：2017-05-09

    Applicant: INERTECH IP LLC

    Inventor： Earl Keisling ,  John Costakis ,  Gerald McDonnell ,  Michael Welch

    IPC: H05K7/20 ,  H05K5/02

    Abstract: A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

    Systems and methods for cooling electrical equipment
    19.
    发明授权
    Systems and methods for cooling electrical equipment 有权

    公开(公告)号：US12146691B2

    公开(公告)日：2024-11-19

    申请号：US18097055

    申请日：2023-01-13

    Applicant: INERTECH IP LLC

    Inventor： Ming Zhang ,  John Costakis

    IPC: F25B25/00 ,  F25B7/00 ,  F25B49/02 ,  H05K7/20

    Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

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