公开(公告)号：US20180219272A1

公开(公告)日：2018-08-02

申请号：US15419225

申请日：2017-01-30

Applicant: Infineon Technologies AG

Inventor： Ashutosh Baheti ,  Saverio Trotta ,  Werner Reiss

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/52

CPC classification number: H01Q1/2283 ,  H01L2223/6677 ,  H01Q1/521 ,  H01Q1/523 ,  H01Q9/0407 ,  H01Q9/0457

Abstract: A semiconductor device package includes a radio frequency front end circuit configured to process radio frequency signals, a first antenna, an antenna substrate, and a first conductive barrier. The first antenna is configured to transmit/receive a first radio frequency signal. The antenna substrate includes the first antenna. The antenna substrate is configured to transfer the first radio frequency signal between the radio frequency front end circuit and the first antenna. The first conductive barrier is configured to electromagnetically and electrostatically isolate the first antenna.

公开(公告)号：US09935065B1

公开(公告)日：2018-04-03

申请号：US15387307

申请日：2016-12-21

Applicant: Infineon Technologies AG

Inventor： Ashutosh Baheti ,  Saverio Trotta ,  Werner Reiss

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/31 ,  H01L21/50 ,  H01L21/56 ,  H01L23/528 ,  H01L21/60

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5286 ,  H01L2021/60022 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/73204

Abstract: A semiconductor device package includes an integrated circuit chip comprising a radio frequency device. The radio frequency device includes active circuitry at a first surface of the integrate circuit chip. An antenna substrate is disposed over the first surface of the integrated circuit. The antenna substrate includes a first conductive layer disposed over the first surface of the integrated circuit chip. The first conductive layer includes a first transmission line electrically coupled to the integrated circuit chip. A first laminate layer is disposed over the first conductive layer. The first laminate layer overlaps a first part of the first transmission line. A second conductive layer is disposed over the first laminate layer. The second conductive layer includes a first opening overlapping a second part of the first transmission line. A second laminate layer is disposed over the second conductive layer. A first antenna is disposed over the second laminate layer and overlaps the first opening, the second part of the first transmission line, and the integrated circuit chip.