Display devices
    11.
    发明授权

    公开(公告)号:US10446716B2

    公开(公告)日:2019-10-15

    申请号:US15968878

    申请日:2018-05-02

    Abstract: A display device includes a substrate, a first electrode, a second electrode, and a protective layer. The first electrode is disposed on the substrate. The second electrode has a first segment and a second segment. The first segment is located at a first side of the first electrode. The second segment is located at a second side of the first electrode. The second side is opposite to the first side. The protective layer overlaps the first segment and the second segment. The first segment has a length which is shorter than that of the second segment. The display device further includes a light-emitting element disposed on the substrate.

    Method for manufacturing light emitting device

    公开(公告)号:US12294038B2

    公开(公告)日:2025-05-06

    申请号:US18298343

    申请日:2023-04-10

    Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

    MANUFACTURING METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20250062151A1

    公开(公告)日:2025-02-20

    申请号:US18935636

    申请日:2024-11-03

    Abstract: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a plurality of semiconductor elements; performing a packaging process on the plurality of semiconductor elements to form a plurality of packaged semiconductor elements, wherein the packaging process includes disposing a plurality of filling material layers respectively on a sidewall of each of the plurality of semiconductor elements; providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes at least one first recess; and disposing the plurality of packaged semiconductor elements in the at least one first recess of each of the plurality of working areas through fluid transfer.

    Electronic device and manufacturing method thereof

    公开(公告)号:US12183721B2

    公开(公告)日:2024-12-31

    申请号:US18527381

    申请日:2023-12-04

    Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240096857A1

    公开(公告)日:2024-03-21

    申请号:US18527381

    申请日:2023-12-04

    CPC classification number: H01L25/0753 H01L22/22 H01L25/167

    Abstract: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

    Display device
    16.
    发明授权

    公开(公告)号:US11516919B2

    公开(公告)日:2022-11-29

    申请号:US17114917

    申请日:2020-12-08

    Abstract: A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.

    DISPLAY PANEL AND TILED DISPLAY DEVICE

    公开(公告)号:US20210257347A1

    公开(公告)日:2021-08-19

    申请号:US17169561

    申请日:2021-02-08

    Abstract: The disclosure provides a display panel and a tiled display device. The display panel has a tiling edge and includes a non-transparent part and a transparent part. The transparent part has a peripheral edge. At least a portion of the peripheral edge of the transparent part is overlapped with the tiling edge. The tiled display device includes a plurality of display panels tiled together by the tiling edges thereof.

    DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20210257343A1

    公开(公告)日:2021-08-19

    申请号:US17167107

    申请日:2021-02-04

    Abstract: A display device is provided in an embodiment in the disclosure, including a subpixel region, a spacer, a light-emitting element, and a driving circuit. The spacer separates the subpixel region into a first region and a second region. The light-emitting element is located in at least one of the first region or the second region. The driving circuit is electrically connected to the first region and the second region, so as to drive the light-emitting element. A manufacturing method of the display device is also disclosed.

    TFT touch display device and driving method thereof
    19.
    发明授权
    TFT touch display device and driving method thereof 有权
    TFT触摸显示装置及其驱动方法

    公开(公告)号:US09417721B2

    公开(公告)日:2016-08-16

    申请号:US14044917

    申请日:2013-10-03

    CPC classification number: G06F3/041 G06F3/0412 G06F3/042 G06F3/044

    Abstract: A TFT touch display device includes a plurality of mutually vertical control lines and sensor lines and a plurality of TFTs. Each TFT is disposed at an intersection of one of the plurality of control line and one of the plurality of sensor line. The TFT is connected to a corresponding control line, a corresponding sensor line, and a power source. When there is an object approaching to the TFT, the TFT is turned on and a back-channel current is generated. A control unit is connected to the plurality of control lines to respectively provide a control signal to the plurality of control lines. A current sensing unit is connected to the plurality of sensor lines to respectively sense a current generated by the TFTs.

    Abstract translation: TFT触摸显示装置包括多个相互垂直的控制线和传感器线以及多个TFT。 每个TFT设置在多个控制线之一和多个传感器线中的一个的交叉点处。 TFT连接到相应的控制线,相应的传感器线和电源。 当存在接近TFT的物体时,TFT导通,产生反向通道电流。 控制单元连接到多个控制线,以分别向多个控制线提供控制信号。 电流感测单元连接到多个传感器线以分别感测由TFT产生的电流。

    TILING ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250004510A1

    公开(公告)日:2025-01-02

    申请号:US18884047

    申请日:2024-09-12

    Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

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