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    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20250079412A1

    公开(公告)日：2025-03-06

    申请号：US18954408

    申请日：2024-11-20

    Applicant: Innolux Corporation

    Inventor： Jian-Jung Shih ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng

    IPC: H01L25/075 ,  H01L21/66 ,  H01L25/16

    Abstract: An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.

    Semiconductor devices and methods for manufacturing the same
    3.
    发明授权
    Semiconductor devices and methods for manufacturing the same 有权

    公开(公告)号：US11063086B2

    公开(公告)日：2021-07-13

    申请号：US16419101

    申请日：2019-05-22

    Applicant: InnoLux Corporation

    Inventor： Shu-Ming Kuo ,  Jian-Jung Shih

    IPC: H01L27/15 ,  H01L33/60 ,  H01L33/50

    Abstract: A semiconductor device is provided. The semiconductor device includes a first substrate. The semiconductor device also includes a first light-emitting diode on the first substrate. The semiconductor device further includes a first insulating layer on the first substrate and adjacent to the first light-emitting diode. In addition, the semiconductor device includes an adhesive structure on the first insulating layer. The adhesive structure includes a first side facing the first light-emitting diode and a second side opposite to the first side. The semiconductor device also includes a second substrate disposed on the adhesive structure. The semiconductor device further includes an optical structure in contact with at least one of the first side and the second side.

    ELECTRONIC PANEL, TILING ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    ELECTRONIC PANEL, TILING ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220206546A1

    公开(公告)日：2022-06-30

    申请号：US17542506

    申请日：2021-12-06

    Applicant: Innolux Corporation

    Inventor： Wan-Ling Huang ,  Jian-Jung Shih ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

    IPC: G06F1/18 ,  G09F9/302

    Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

    TILING ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    8.
    发明公开
    TILING ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20240094787A1

    公开(公告)日：2024-03-21

    申请号：US18522044

    申请日：2023-11-28

    Applicant: Innolux Corporation

    Inventor： Wan-Ling Huang ,  Jian-Jung Shih ,  Jui-Feng Ko ,  Tsau-Hua Hsieh

    IPC: G06F1/18 ,  G09F9/302

    CPC classification number: G06F1/189 ,  G06F1/182 ,  G09F9/3026

    Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

    METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
    9.
    发明公开
    METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20230246121A1

    公开(公告)日：2023-08-03

    申请号：US18298343

    申请日：2023-04-10

    Applicant: Innolux Corporation

    Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

    IPC: H01L33/00 ,  H01L25/075

    CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0066

    Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220216367A1

    公开(公告)日：2022-07-07

    申请号：US17702818

    申请日：2022-03-24

    Applicant: Innolux Corporation

    Inventor： Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Tzu-Min Yan

    IPC: H01L33/00 ,  H01L25/075

    Abstract: The disclosure discloses a method for manufacturing light-emitting diode (LED) chips. The manufacturing method includes: providing a plurality of LED elements; randomly mixing the plurality of LED elements; performing a mesa process on the plurality of LED elements; and forming at least one pair of electrodes on the plurality of LED elements. An electronic device includes the LED chips.

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