公开(公告)号：USD874456S1

公开(公告)日：2020-02-04

申请号：US29591964

申请日：2017-01-25

Applicant: Intel Corporation

Designer： Sameer Sharma ,  Douglas Satzger ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Daniel Clifton ,  Philip J. Houdek, II ,  Stanislav Moiseyenko ,  Nathan Isaiah Jauvtis

公开(公告)号：US10073495B2

公开(公告)日：2018-09-11

申请号：US15414708

申请日：2017-01-25

Applicant: Intel Corporation

Inventor： Sameer Sharma ,  Douglas Satzger ,  Gadi Amit ,  Yoshikazu Hoshino ,  Chadwick Harber ,  Daniel Clifton ,  Philip J. Houdek, II ,  Stanislav Moiseyenko ,  Nathan Isaiah Jauvtis

IPC: G06F1/16 ,  E05D7/00 ,  E05D11/00

CPC classification number: G06F1/1681 ,  E05D7/00 ,  E05D11/0081 ,  E05Y2900/606 ,  G06F1/1616 ,  G06F1/1633 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1669 ,  G06F1/1679 ,  G06F1/1683 ,  G06F1/189 ,  G06F21/31 ,  H01R24/58 ,  H01R43/16 ,  H01R2107/00

Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.