公开(公告)号：US20140144512A1

公开(公告)日：2014-05-29

申请号：US13687906

申请日：2012-11-28

Applicant: INTERMOLECULAR, INC.

Inventor： Satbir Kahlon ,  Aaron T. Francis ,  Chi-I Lang ,  Gregory P. Lim ,  Jeffrey Chih-Hou Lowe ,  Robert Anthony Sculac

IPC: B65D83/00

CPC classification number: H01L21/00 ,  H01L21/67017 ,  H01L21/6715 ,  Y10T137/0318 ,  Y10T137/0424 ,  Y10T137/86493 ,  Y10T137/87249 ,  Y10T137/87281

Abstract: Provided are methods and systems for dispensing different chemicals used for high productivity combinatorial processing. A dispense panel may include multiple inlet lines for supplying different chemicals. Each inlet line is connected to its own three-way valve that either allows the supplied chemical to flow from the inlet line towards a dispense valve connected to a dispense manifold (during dispensing of the supplied chemical) or allows another chemical to flow from the dispense valve to a waste manifold (during priming of the dispense manifold with this other chemical). Specifically, during priming a chemical supplied from its inlet line and is passed through a corresponding three-way valve and is directed to its dispense valve and then into the dispense manifold. Other dispense valves and three-way valves of the dispense panel allow this chemical to flow out of the dispense manifold, thereby priming remaining parts of the panel.

Abstract translation: 提供了用于分配用于高生产率组合处理的不同化学品的方法和系统。 分配面板可以包括用于供应不同化学品的多个入口管线。 每个入口管路连接到其自己的三通阀，其允许供应的化学品从入口管线流向连接到分配歧管的分配阀（在分配供应的化学品期间）或允许另一种化学品从分配流出 阀门到废液歧管（在使用这种其他化学品的分配歧管启动期间）。 具体来说，在从其入口管线引入化学物质并通过相应的三通阀时，被引导到其分配阀然后进入分配歧管。 分配面板的其他分配阀和三通阀允许该化学品流出分配歧管，从而引发面板的剩余部分。

公开(公告)号：US20140087490A1

公开(公告)日：2014-03-27

申请号：US13626649

申请日：2012-09-25

Applicant: INTERMOLECULAR, INC.

Inventor： Satbir Kahlon

IPC: H01L21/66

CPC classification number: H01L22/10 ,  H01L21/6719

Abstract: A method for combinatorially processing a substrate is provided. The method includes providing a substrate disposed on a substrate support. The method further includes rigidly locking a top portion of a sleeve to a bottom portion of a process head of a combinatorial processing device, where the combinatorial processing device is operable to concurrently process different regions of the substrate differently. The method includes raising the substrate and the substrate support to contact a sealing surface of the sleeve with a surface of the substrate and combinatorially processing the different regions of the substrate.

Abstract translation: 提供了一种用于组合处理衬底的方法。 该方法包括提供设置在基板支撑件上的基板。 该方法还包括将套筒的顶部刚性地锁定到组合处理装置的过程头部的底部，其中组合处理装置可操作以不同地同时处理衬底的不同区域。 该方法包括升高衬底和衬底支撑件以使衬套的密封表面与衬底的表面接触并且组合地处理衬底的不同区域。

公开(公告)号：US08663397B1

公开(公告)日：2014-03-04

申请号：US13657261

申请日：2012-10-22

Applicant: Intermolecular, Inc.

Inventor： Satbir Kahlon ,  Jeffrey Chih-Hou Lowe ,  Frank C. Ma ,  Sandeep Mariserla ,  Robert Anthony Sculac

IPC: B08B3/04

CPC classification number: H01L21/02041 ,  B08B3/04 ,  C11D11/0047 ,  C11D11/0064 ,  C11D11/007 ,  H01L21/67028 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719

Abstract: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

Abstract translation: 实施例描述了用于控制在旋转冲洗干燥器（SRD）模块中清洁和干燥晶片时产生的颗粒的方法。 在一些实施例中，通过在衬底的表面上分配去离子（DI）水来冷却衬底表面，同时衬底搁置在SRD卡盘上。 此外，提供了一种用于控制在夹持操作期间或当衬套从衬底表面移除时在处理模块或SRD中的套筒接触衬底表面时产生的颗粒的方法。 在夹紧/松开操作期间，套筒的底部边缘或/或与晶片接触的晶片表面被润湿。 或者，在夹紧/松开操作之前可以润湿基底。