公开(公告)号：US20140174481A1

公开(公告)日：2014-06-26

申请号：US14189014

申请日：2014-02-25

申请人： Intermolecular, Inc.

发明人： Satbir Kahlon ,  Jeffrey Chih-Hou Lowe ,  Frank C. Ma ,  Sandeep Mariserla ,  Robert Anthony Sculac

IPC分类号： H01L21/02

CPC分类号： H01L21/02041 ,  B08B3/04 ,  C11D11/0047 ,  C11D11/0064 ,  C11D11/007 ,  H01L21/67028 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719

摘要： The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

摘要翻译： 实施例描述了用于控制在旋转冲洗干燥器（SRD）模块中清洁和干燥晶片时产生的颗粒的方法。 在一些实施例中，通过在衬底的表面上分配去离子（DI）水来冷却衬底表面，同时衬底搁置在SRD卡盘上。 此外，提供了一种用于控制在夹持操作期间或当衬套从衬底表面移除时在处理模块或SRD中的套筒接触衬底表面时产生的颗粒的方法。 在夹紧/松开操作期间，套筒的底部边缘或/或与晶片接触的晶片表面被润湿。 或者，在夹紧/松开操作之前可以润湿基底。

公开(公告)号：US08663397B1

公开(公告)日：2014-03-04

申请号：US13657261

申请日：2012-10-22

申请人： Intermolecular, Inc.

发明人： Satbir Kahlon ,  Jeffrey Chih-Hou Lowe ,  Frank C. Ma ,  Sandeep Mariserla ,  Robert Anthony Sculac

IPC分类号： B08B3/04

CPC分类号： H01L21/02041 ,  B08B3/04 ,  C11D11/0047 ,  C11D11/0064 ,  C11D11/007 ,  H01L21/67028 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719

摘要： The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

摘要翻译： 实施例描述了用于控制在旋转冲洗干燥器（SRD）模块中清洁和干燥晶片时产生的颗粒的方法。 在一些实施例中，通过在衬底的表面上分配去离子（DI）水来冷却衬底表面，同时衬底搁置在SRD卡盘上。 此外，提供了一种用于控制在夹持操作期间或当衬套从衬底表面移除时在处理模块或SRD中的套筒接触衬底表面时产生的颗粒的方法。 在夹紧/松开操作期间，套筒的底部边缘或/或与晶片接触的晶片表面被润湿。 或者，在夹紧/松开操作之前可以润湿基底。

公开(公告)号：US09174323B2

公开(公告)日：2015-11-03

申请号：US13671478

申请日：2012-11-07

申请人： Intermolecular, Inc.

发明人： Kim Van Berkel ,  Aaron T. Francis ,  Frank C. Ma ,  George Mirth

IPC分类号： B24B37/26 ,  B24B37/10

CPC分类号： B24B37/26 ,  B24B37/10

摘要： Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

摘要翻译： 抛光和清洁技术被组合处理和评估。 抛光系统可以包括具有多个反应室的反应器组件，其中至少一个反应室包括可旋转的抛光头，浆料和化学分布，化学和水冲洗以及淤浆和流体的去除。 可以向抛光头施加不同的向下的力以评估最佳工艺条件。 抛光垫中的通道可以将浆料和化学品重新分配到抛光区域。

公开(公告)号：US20140127974A1

公开(公告)日：2014-05-08

申请号：US13671478

申请日：2012-11-07

申请人： INTERMOLECULAR, INC.

发明人： Kim Van Berkel ,  Aaron T. Francis ,  Frank C. Ma ,  George Mirth

IPC分类号： B24B37/00 ,  B24B37/10 ,  B24B37/26

CPC分类号： B24B37/26 ,  B24B37/10

摘要： Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

摘要翻译： 抛光和清洁技术被组合处理和评估。 抛光系统可以包括具有多个反应室的反应器组件，其中至少一个反应室包括可旋转的抛光头，浆料和化学分布，化学和水冲洗以及淤浆和流体的去除。 可以向抛光头施加不同的向下的力以评估最佳工艺条件。 抛光垫中的通道可以将浆料和化学品重新分配到抛光区域。