公开(公告)号：US20090231424A1

公开(公告)日：2009-09-17

申请号：US12379645

申请日：2009-02-26

申请人： Toshifumi Honda ,  Yuuji Takagi

发明人： Toshifumi Honda ,  Yuuji Takagi

IPC分类号： H04N7/18

CPC分类号： G06T7/0006 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hotspot searching apparatus manufactures a small number of chips or regions on a semiconductor wafer under respectively different manufacturing process conditions, compares SEM images of their external appearances to output a point having large differences as a narrow process window, that is, a process monitoring point that should be managed in mass production, the narrow process window having a narrow manufacturing process condition (exposure condition) in the manufacturing of the semiconductor wafer, and sets the point as a measurement point by a CD-SEM apparatus, such that it extracts and determines plural circuit pattern parts having a narrow manufacturing process margin as the process monitoring point in a short time and a process monitoring point monitoring performs shape inspection or shape length measurement in detail at high resolution.

摘要翻译： 热点搜索装置分别在不同的制造工艺条件下制造半导体晶片上的少量芯片或区域，比较其外观的SEM图像以输出具有较大差异的点作为窄工艺窗口，即处理监视点 应在大规模生产中进行管理，在半导体晶片的制造中具有窄制造工艺条件（曝光条件）的窄工艺窗口，并且通过CD-SEM装置将点设定为测量点，使得其提取和 在短时间内确定具有窄制造工艺余量的多个电路图形部分作为处理监视点，并且处理监视点监视以高分辨率详细地进行形状检查或形状长度测量。

公开(公告)号：US06792366B2

公开(公告)日：2004-09-14

申请号：US10015276

申请日：2001-12-11

申请人： Naoki Hosoya ,  Yuuji Takagi ,  Hisae Shibuya ,  Kenji Obara

发明人： Naoki Hosoya ,  Yuuji Takagi ,  Hisae Shibuya ,  Kenji Obara

IPC分类号： H01L2100

CPC分类号： H01L22/20 ,  G06T7/0002 ,  G06T7/0004 ,  G06T7/41 ,  G06T2200/24 ,  G06T2207/30148

摘要： In a wafer inspection and sampling system, wafer defects are detected and stored in a data store as defect data. Information is also provided, representative of clusters of defects on the wafer. A statistically based sampling of the defects is made to obtain a set of sampled defects. Subsequent detailed inspection and analysis of the sampled defects produces additional data which facilitate an understanding of process errors.

公开(公告)号：US20060289752A1

公开(公告)日：2006-12-28

申请号：US11415286

申请日：2006-05-02

申请人： Munenori Fukunishi ,  Toshifumi Honda ,  Yuuji Takagi

发明人： Munenori Fukunishi ,  Toshifumi Honda ,  Yuuji Takagi

IPC分类号： G21K7/00

CPC分类号： H01J37/28 ,  H01J2237/2817

摘要： The present invention relates to high-speed acquisition of both a perpendicular observation image and a tilt observation image, in observation using a scanning electron microscope. An electron-beam observation apparatus includes: a first electro-optical system which scans a converged electron beam from a substantially perpendicular direction to a defect on a target wafer to be observed, and acquires a defect image signal with perpendicular observation by detecting a secondary electron image or a reflected electron image generated from the defect; and a second electro-optical system which scans a converged electron beam from a tilt direction to the defect, and acquires a defect image signal with tilt observation by detecting a secondary electron image or a reflected electron image generated from the defect.

公开(公告)号：US06792367B2

公开(公告)日：2004-09-14

申请号：US10115815

申请日：2002-03-28

申请人： Naoki Hosoya ,  Yuuji Takagi ,  Hisae Shibuya ,  Kenji Obara

发明人： Naoki Hosoya ,  Yuuji Takagi ,  Hisae Shibuya ,  Kenji Obara

IPC分类号： G06F1900

CPC分类号： H01L22/20 ,  G06T7/0002 ,  G06T7/0004 ,  G06T7/41 ,  G06T2200/24 ,  G06T2207/30148

摘要： In a wafer inspection and sampling system, wafer defects are detected and stored in a data store as defect data. Information is also provided, representative of clusters of defects on the wafer. A statistically based sampling of the defects is made to obtain a set of sampled defects. Subsequent detailed inspection and analysis of the sampled defects produces additional data which facilitate an understanding of process errors.

摘要翻译： 在晶片检查和采样系统中，晶片缺陷被检测并存储在数据存储器中作为缺陷数据。 还提供了信息，代表晶片上的缺陷簇。 进行基于统计学的缺陷采样，以获得一组采样缺陷。 随后对采样缺陷的详细检查和分析会产生额外的数据，有助于了解过程错误。

公开(公告)号：US5134575A

公开(公告)日：1992-07-28

申请号：US631983

申请日：1990-12-21

申请人： Yuuji Takagi

发明人： Yuuji Takagi

IPC分类号： G01B11/24 ,  G05B19/408 ,  G06T7/00 ,  H05K13/04 ,  H05K13/08

CPC分类号： G06T7/0004 ,  G05B19/4083 ,  H05K13/08 ,  G06T2207/30141 ,  G06T2207/30152

摘要： Predetermined NC data for inspection including data of a predetermined location of an electronic component to be mounted on a PCB is stored in a microcomputer. A signal representing the image of the PCB on which no electronic component is yet mounted is obtained by using a television camera. From the obtained image signal of the PCB, the patterns of pads for mounting electronic components on the PCB is extracted. On the basis of the extracted pad patterns, the optimum location of the electronic component to be mounted is specified. The NC data of the electronic component location which is stored in the microcomputer is corrected according to the result of the specification.

摘要翻译： 用于检查的预定NC数据包括要安装在PCB上的电子部件的预定位置的数据被存储在微型计算机中。 通过使用电视摄像机获得表示其上没有安装电子部件的PCB的图像的信号。 从所获得的PCB的图像信号中，提取用于在PCB上安装电子部件的焊盘的图案。 基于提取的焊盘图案，指定要安装的电子部件的最佳位置。 存储在微型计算机中的电子元件位置的NC数据根据说明书的结果被校正。