公开(公告)号：US10830812B2

公开(公告)日：2020-11-10

申请号：US16115322

申请日：2018-08-28

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee

IPC: G01R31/28 ,  H01R13/405 ,  H01R13/6461 ,  H01R43/20 ,  H01R43/24 ,  G01R1/067 ,  G01R1/073 ,  H01R13/24 ,  H01R13/504 ,  H01R13/506

Abstract: A manufacturing process for an electrical contact assembly that uses an assembly jig with a middle horizontal lip adapted to fit into a plurality of C-shaped inner contact pins, as well as top and bottom guide teeth that guide top and bottom parts of the inner pins as they are being assembled. An inner holder then covers the inner pins, at which point epoxy is applied, which when cured, secures the inner holder to the plurality of inner pins. Outer contact pins in turn cover the outside of the inner holder, and an outer holder covers the outer contact pins. Epoxy is also applied between the outer holder and outer pins, which when cured, secures the outer holder to the plurality of outer pins. A heat curing process is also employed to assist with the curing of the epoxy, during which a clamp temporarily holds the assembly in place.

公开(公告)号：US10018653B2

公开(公告)日：2018-07-10

申请号：US15422690

申请日：2017-02-02

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee

IPC: G01R31/20 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01R3/00 ,  H01R101/00 ,  B29C31/00

CPC classification number: G01R1/06727 ,  B29C31/00 ,  G01R1/06722 ,  G01R1/07357 ,  G01R31/2886 ,  H01R3/00 ,  H01R2101/00

Abstract: An electrical Kelvin contact assembly for testing IC testing apparatus that uses an assembly design that reduces the tolerance to a near negligible range. The assembly does not use any screws, dowel pins, adhesives or welding to fasten the electrical contacts to the housing. The design of the assembly uses rows of contacts with specially designed protrusions that sit snugly in openings located on three plate-like layers. These layers contain the contacts in the horizontal plane by securing the protrusions in the opening, as well as in the vertical plane by means of a sandwich between three separate layers. A second contact is slid into back slits formed by the three layers.

公开(公告)号：US10578645B2

公开(公告)日：2020-03-03

申请号：US16026000

申请日：2018-07-02

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee

IPC: G01R1/04 ,  G01R1/067 ,  G01R31/28

Abstract: An electrical contact for use in an integrated circuit testing apparatus having an elongated electrically conductive contact pin with a contact tip facing upwards at an inner end of the contact pin, a curved bottom surface that allows the contact pin to rock and slide from side to side during testing. An elongated compressible member with a “P-shaped” cross section, with a “vertical portion” which is the upper, curved part of the so-called letter “P” shape adapted to fit snugly within an upward-facing recess on a top part of the contact pin, and a “horizontal portion” which is the trunk or vertical line of the so-called letter “P” shape positions in between and in contact with a lower top surface of the contact pin and a socket roof.

公开(公告)号：US10466300B2

公开(公告)日：2019-11-05

申请号：US15984023

申请日：2018-05-18

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee ,  Mei Chen Chin

IPC: G01R31/28 ,  G01R1/073 ,  G01R1/067

Abstract: A top housing having a back slot and a front slot parallel with each other, and both stacked on top of a row of lower slots, which is perpendicular to the back and front slots. In this way, the juxtaposition of the back and front slots and the row of lower slots forms two rows of virtual rectangular through-openings. The back of these rows receives a row of first contacts extended through them. The front of these rows receives a row of second contacts extended through them. The through-openings thus guide the contacts at a position of the contacts that is very close to where they contact the lead of the DUT. Hence, there is a very high amount of precision and control of the contact tip that contacts the lead of the DUT.

公开(公告)号：US09658253B2

公开(公告)日：2017-05-23

申请号：US14971604

申请日：2015-12-16

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee

IPC: G01R31/00 ,  G01R3/00 ,  G01R1/073

CPC classification number: G01R3/00 ,  G01R1/07307 ,  G01R1/07371

Abstract: An electrical contact assembly for use in an integrated circuit testing apparatus having a plurality of electrical contact pins and electrical insulators that are each fashioned with through-openings that match a cross-section of a rigid shaft so that the rigid shaft can be threaded through the contact pins and insulators. This ensures that the position of each contact pin is substantially aligned in a single datum with other contact pins following the datum of the rigid shaft. The electrical insulators are placed between each contact pin to prevent electrical connection between contact pins. Further, four rigid shafts assembled in this manner may be interlocked with each other to form a rectangular assembly, which can be inserted into an appropriate housing of the testing apparatus.

公开(公告)号：US09140721B2

公开(公告)日：2015-09-22

申请号：US14609076

申请日：2015-01-29

Applicant: JF MICROTECHNOLOGY SDN. BHD.

Inventor： Wei Kuong Foong ,  Kok Sing Goh ,  Shamal Mundiyath ,  Eng Kiat Lee

IPC: G01R1/04 ,  H01R13/24

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  H01R13/24 ,  H01R13/2407

Abstract: An electrical test contact electrically connects a test terminal of an Integrated Circuit (IC) test assembly with an IC terminal of an IC device in an electrical interconnect assembly. The test contact is formed of electrically conductive material and includes a head portion and a foot portion. The head portion includes a first electrical contacting portion for electrically engaging an IC terminal of an IC device during use, and the foot portion includes a second electrical contacting portion for electrically engaging a test terminal of a test assembly during use. The head portion includes a head receiving portion that receives a first resiliently biasing member to retain the first resiliently biasing member in contact with the test contact. The first resiliently biasing member biases the first electrical contacting portion against the IC terminal of the IC device during use. An electrical interconnect assembly having multiple test contacts is also disclosed.