摘要:
A embodiment of a stand includes a base, a support, and a biasing member. The biasing member provides a biasing force to urge the support to a first position relative to the base from a second position relative to the base. When in the second position the support is allowed to rotate on a pivot, and when in the first position the support is prevented from rotating on the pivot.
摘要:
A projection screen includes a member that functions as a support for holding the screen upright when the screen is in an open-position and as a fastener for holding the screen shut when the screen is in a closed-position.
摘要:
An asynchronous camera/projector system includes a projection screen, having a key color, a projector, oriented to provide a sequenced background image to the screen, and a camera, located in front of the screen, and oriented to capture a sequenced image of the screen and a real object positioned in front of the screen. The camera and projector operate out of phase, so that the camera does not record the background image.
摘要:
An asynchronous camera/projector system includes a projection screen, having a key color, a projector, oriented to provide a sequenced background image to the screen, and a camera, located in front of the screen, and oriented to capture a sequenced image of the screen and a real object positioned in front of the screen. The camera and projector operate out of phase, so that the camera does not record the background image.
摘要:
A lens cover that may be secured to a case of a projector is herein disclosed. The lens cover has incorporated therein a lens that may be aligned with a lens of the projector to modify the throw ratio of the projector lens.
摘要:
A multimedia display device includes a housing, an image projector supported within the housing, a media player supported within the housing, a speaker supported within the housing, and a vibration isolation assembly provided between the speaker and the housing.
摘要:
A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.