中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

116 records (took 0.017 seconds)

    Apparatus and method for the deep cryogenic treatment of materials
    13.
    发明授权
    Apparatus and method for the deep cryogenic treatment of materials 失效
    深层处理材料的设备和方法

    公开(公告)号：US4739622A

    公开(公告)日：1988-04-26

    申请号：US077801

    申请日：1987-07-27

    Applicant: James A. Smith

    Inventor： James A. Smith

    IPC: C22F1/04 ,  C21D1/18 ,  C21D6/04 ,  F17C13/02 ,  F25D3/10 ,  F25D29/00 ,  F24F3/16

    CPC classification number: F25D29/001 ,  F17C13/026 ,  F25D3/10

    Abstract: Apparatus and methodology for the ultralow temperature processing of metallic, carbide, ceramic and plastic parts and items to materially increase their wear, abrasion, erosion and corrosion resistivity, stabilize their strength characteristics, improve their machinability and provide stress relief. The cryogenic treatment processing is carried out in an insulated box-like treatment chamber which includes a perforated platform extending parallel to and spaced above the bottom of the chamber. Parts and items to be treated are supported on the platform and cryogenic liquid is introduced to the chamber below the platform in accordance with a time-temperature program which reduces the temperature of the parts and items in stages to -320.degree. F. by initial cooling of the parts and items by evaporating vapors from the cryogenic liquid pool in the space below the platform and thereafter by partial or substantial submersion of the parts and items in the cryogenic liquid. After a soak period at the -320.degree. F. temperature level, the temperature of the parts and items in the treatment chamber is raised to ambient by controlled evaporation of the cryogenic liquid therein. Temperature and liquid level monitoring devices are mounted in the treatment chamber and information derived therefrom is utilized by a process controller to direct the supply of cryogenic liquid to the treatment chamber in accordance with the desired temperature descent and ascent profiles for the weight of the parts within the chamber.

    Method and a support assembly for supporting an air ring in a regenerator in a fluid catalytic cracking unit
    15.
    发明授权
    Method and a support assembly for supporting an air ring in a regenerator in a fluid catalytic cracking unit 失效
    方法和用于在流化催化裂化装置中的再生器中支撑空气环的支撑组件

    公开(公告)号：US4101288A

    公开(公告)日：1978-07-18

    申请号：US820189

    申请日：1977-07-29

    Applicant: James A. Smith ,  John P. MacLean ,  Thomas W. DeBoise

    Inventor： James A. Smith ,  John P. MacLean ,  Thomas W. DeBoise

    IPC: B01J8/00 ,  B23K37/04 ,  F16M7/00 ,  B01J8/24 ,  B23K28/00 ,  F16M13/02

    CPC classification number: F16M7/00 ,  B01J8/005 ,  B23K37/04 ,  Y10S248/901 ,  Y10T29/49345 ,  Y10T29/49357 ,  Y10T29/49826

    Abstract: The method comprises basically (1) fixedly securing, as by welding, an air inlet header between an air ring at a predetermined location point and the bottom of the regenerator for a primary support, (2) connecting other elongated supports under the air ring as secondary supports, (3) pivotally mounting slip rings on parallel pivot pins on opposite ends of each of the secondary supports and inserting them into corresponding pairs of sleeves mounted oppositely on the air ring and regenerator, (4) aligning each support so that its corresponding pivot pin is normal to a line between each pin and the predetermined location point, and (5) welding the slip rings in their respective sleeves with the supports so aligned to provide pivotal movement about the slip ring pins for eliminating any bending stresses due to thermal expansion or contraction when operating in the 1,100.degree. F.-1,400.degree. F. heat range of a regenerator in a fluid catalytic cracking unit. A support assembly assembled by the above or similar method is disclosed.

    Abstract translation: 该方法基本上包括（1）通过焊接固定地固定在预定位置点处的空气环之间的空气入口集管和用于主要支撑件的再生器的底部之间的空气入口集管，（2）将空气环之下的其它细长支撑件连接为 （3）将滑动环枢轴安装在每个次要支撑件的相对端上的平行枢轴销上，并将它们插入到相对安装在空气环和再生器上的相应套管中，（4）使每个支撑件对准 枢轴销垂直于每个销和预定位置点之间的一条线，并且（5）将其相应套筒中的滑环焊接成与对准的支撑件一起以提供围绕滑环销的枢转运动，以消除由于热而产生的任何弯曲应力 在流化催化裂化装置中的再生器的1,100°F-1,400°F热范围内操作时的膨胀或收缩。 公开了通过上述或类似方法组装的支撑组件。

    Crossover tool, method of making a crossover tool and two parts of a two-part crossover tool
    16.
    发明授权
    Crossover tool, method of making a crossover tool and two parts of a two-part crossover tool 有权

    公开(公告)号：US10233733B2

    公开(公告)日：2019-03-19

    申请号：US14490997

    申请日：2014-09-19

    Applicant: James A. Smith ,  Robert S. O'Brien

    Inventor： James A. Smith ,  Robert S. O'Brien

    IPC: E21B43/04 ,  E21B43/26 ,  E21B43/14 ,  E21B41/00

    Abstract: A cross over tool includes, a first tubular forming part of a structure having a channel formed radially through a wall thereof and having a passageway formed longitudinally through the wall. The tool includes a second tubular forming part of a tool string, the second tubular is positionable radially of the first tubular, and has a port through a wall thereof, the port is alignable with the channel. The crossover tool is configured such that while the a port is aligned with the a channel fluid can flow through an inside of the tool string radially through the a port and the a channel and back into the inside of the tool string and through the a passageway and through an annular space defined between the tool string and the structure.

    Downhole system having selective locking apparatus and method
    17.
    发明授权
    Downhole system having selective locking apparatus and method 有权

    公开(公告)号：US09932823B2

    公开(公告)日：2018-04-03

    申请号：US14489694

    申请日：2014-09-18

    Applicant: Zachary S. Silva ,  James A. Smith

    Inventor： Zachary S. Silva ,  James A. Smith

    IPC: E21B23/00 ,  E21B47/09

    CPC classification number: E21B47/09 ,  E21B23/004 ,  E21B23/006

    Abstract: A selective locking apparatus for an indicating tool, the selective locking apparatus includes a mandrel having a rotational collet finger receiving area including a plurality of unlocked-position tracks alternatingly arranged with a plurality of locked-position detents. A rotational collet rotatably supported on the mandrel, the rotational collet including a j-track on an outer periphery of the rotational collet, the rotational collet further including a plurality of rotational collet fingers having heads engageable within the rotational collet finger receiving area of the mandrel. An indicating collet supported on the mandrel, the indicating collet including a plurality of indicating collet fingers; and, at least one pin fixedly mounted on the indicating collet for receipt within the j-track of the rotational collet; wherein longitudinal movement of the mandrel with respect to the indicating collet cycles the rotational collet via j-track interaction and selectively places the heads of the rotational collet fingers into either the plurality of unlocked-position tracks or the plurality of locked-position detents. A method of selectively locking an indicating tool.

    Systems and Methods for Detecting Defects on a Wafer
    18.
    发明申请
    Systems and Methods for Detecting Defects on a Wafer 有权
    用于检测晶片缺陷的系统和方法

    公开(公告)号：US20120268735A1

    公开(公告)日：2012-10-25

    申请号：US13541579

    申请日：2012-07-03

    Applicant: Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/95

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

    Systems and methods for detecting defects on a wafer
    19.
    发明授权
    Systems and methods for detecting defects on a wafer 有权
    用于检测晶片缺陷的系统和方法

    公开(公告)号：US08223327B2

    公开(公告)日：2012-07-17

    申请号：US12359476

    申请日：2009-01-26

    Applicant: Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    Inventor： Lu Chen ,  Jason Kirkwood ,  Mohan Mahadevan ,  James A. Smith ,  Lisheng Gao ,  Junqing (Jenny) Huang ,  Tao Luo ,  Richard Wallingford

    IPC: G01N21/00

    CPC classification number: G01N21/9501 ,  G01N2021/887 ,  H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括通过使用检查系统的第一和第二光学状态的检查系统扫描晶片来产生晶片的输出。 第一和第二光学状态由检查系统的至少一个光学参数的不同值来定义。 该方法还包括使用使用第二光学状态产生的输出使用第一光学状态产生的输出和晶片的第二图像数据为晶片产生第一图像数据。 此外，该方法包括将第一图像数据和对应于晶片上基本相同位置的第二图像数据组合，从而产生用于晶片的附加图像数据。 该方法还包括使用附加图像数据检测晶片上的缺陷。

Patent Agency Ranking