公开(公告)号：US20110175132A1

公开(公告)日：2011-07-21

申请号：US13077186

申请日：2011-03-31

Applicant: Ki-hwan KWON ,  Kyu-ho SHIN ,  Soon-cheol KWEON ,  Chang-youl MOON ,  Arthur DARBINIAN ,  Seung-tae CHOI ,  Su-ho SHIN

Inventor： Ki-hwan KWON ,  Kyu-ho SHIN ,  Soon-cheol KWEON ,  Chang-youl MOON ,  Arthur DARBINIAN ,  Seung-tae CHOI ,  Su-ho SHIN

IPC: H01L33/58 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/12041 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract translation: 提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上​​金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。 下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。 保护盖包围并保护上下金属板的暴露表面。