摘要:
A heat exchange assembly for use in cooling an electrical component is described herein. The heat assembly includes a casing that includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section along a longitudinal axis. The casing is configured to bend along a bending axis oriented with respect to the transport section. The casing also includes at least one sidewall that includes at least one fluid chamber extending between the evaporator section and the condenser section to channel a working fluid between the evaporator section and the condenser section. A plurality of fluid channels are defined within the inner surface to channel liquid fluid from the condenser section to the evaporator section. At least one vapor channel is defined within the inner surface to channel gaseous fluid from the evaporator section to the condenser section.
摘要:
The present invention provides method of scribing a multilayer panel. The method comprises (a) providing a multilayer panel comprising a substrate layer, a transparent conductive layer disposed thereupon, a first semiconducting layer disposed upon the transparent conductive layer; (b) configuring the multilayer panel relative to a laser machining device, the machining device comprising a laser head and an optical sensor; (c) inducing a motion of the laser head relative to the multilayer panel such that a laser beam contacts the panel along a transverse line across the panel, the laser beam incident upon the panel having sufficient energy to ablate one or more layers of the multilayer panel within a zone irradiated by the laser beam irradiated to provide a scribed panel; (d) simultaneously irradiating the scribed panel with a first light source; and (e) detecting the light emerging from the scribed panel at the optical sensor in real time. Also provided is a system for scribing a multilayer panel.
摘要:
Briefly, in accordance with one or more embodiments, one or more thermal forming treatments may be predicted to achieve a desired shape and/or microstructure in a workpiece.
摘要:
Briefly in accordance with one embodiment, the present technique provides a liquid core waveguide photon energy material processing system. The system includes a photon energy source configured to generate a high intensity photon beam for material processing. The system also includes a liquid core waveguide configured to transmit the high intensity photon beam towards at least one object for material processing. The liquid core waveguide in-turn includes a liquid core having a first refractive index and a cladding element having a second refractive index and configured to guide the liquid core, wherein the first refractive index is higher than the second refractive index. The system further includes a liquid source configured to generate the liquid core. The liquid core includes a liquid solution.
摘要:
A hybrid metal forming system includes a die cavity defined by a first die and a second die and a press adapted to apply a static pressure over the first die to deform a workpiece against the second die. The hybrid forming system also includes a dynamic loading system coupled to and positioned between, the press and the die cavity.
摘要:
A process and system are provided for forming shaped air holes, such as for use in turbine blades. Aspects of the disclosure relate to forming shaped portions of air holes using a short pulse laser, forming a metered hole corresponding to each shaped portion, and separately finishing the shaped portion using a short-pulse laser. In other embodiments, the order of these operations may be varied, such as to form the shaped portions and to finish the shaped portions using the short-pulse laser prior to forming the corresponding metered holes.
摘要:
A laser processing system includes a laser source configured to transmit a laser beam. A hollow focusing device is configured to focus the laser beam to a work piece. A pressure source is coupled to the hollow focusing device and configured to feed a pressurized liquid through the hollow focusing device. A liquid container is configured to receive a portion of the pressurized liquid from the hollow focusing device. The laser beam is transmitted through the pressurized liquid in the hollow focusing device to the work piece disposed in the portion of the pressurized liquid in the liquid container.
摘要:
A liquid core waveguide photon energy material processing system is provided. The system includes a photon energy source configured to generate a high intensity photon beam for material processing. The system also includes a liquid core waveguide configured to transmit the high intensity photon beam towards at least one object for material processing. The liquid core waveguide in-turn includes a liquid core having a first refractive index and a cladding element having a second refractive index and configured to guide the liquid core, wherein the first refractive index is higher than the second refractive index. The system further includes a liquid source configured to generate the liquid core. The liquid core includes a liquid solution.
摘要:
A method for thermal forming includes determining a process window for initiating cooling, locally heating at least one region on a specimen to achieve a pre-selected geometry deformation, initiating active cooling of the heated region within the process window to control at least one material property of the specimen at the heated region and actively cooling the heated region to a pre-selected temperature. A system for thermal forming includes a thermal source for heating the region on the specimen to achieve a pre-selected geometry deformation, an active cooling module for cooling the region to a pre-selected temperature and a control module to control at least one of the thermal source and active cooling module in accordance with a process window to initiate active cooling to control at least one material property of the specimen at the heated region. The process window has an upper time limit for initiating cooling.
摘要:
A system for producing at least one trench to improve film cooling in a sample is provided. The system includes at least one laser source outputting at least one pulsed laser beam. The pulsed laser beam includes a pulse duration including a range less than about 50 μs, an energy per pulse having a range less than about 0.1 Joule, and a repetition rate with a range greater than about 1000 Hz. The system also includes a control subsystem coupled to the laser source, the control subsystem configured to synchronize a position of the sample with the pulse duration and energy level in order to selectively remove at least one of a thermal barrier coating, a bondcoat and a substrate metal in the sample to form the at least one trench.