公开(公告)号：US20070000863A1

公开(公告)日：2007-01-04

申请号：US11170895

申请日：2005-06-30

申请人： David Bernard ,  John Krawczyk ,  Andrew McNees

发明人： David Bernard ,  John Krawczyk ,  Andrew McNees

IPC分类号： C23F1/00 ,  G11B5/127 ,  H01L21/00 ,  B44C1/22

CPC分类号： B41J2/1603 ,  B41J2/1628 ,  B81B2201/052 ,  B81C1/00087

摘要： A method of micro-machining a semiconductor substrate to form one or more through slots therein. The semiconductor substrate has a device side and a fluid side opposite the device side. The method includes diffusing a p-type doping material into the device side of the semiconductor substrate in one or more through slot locations to be etched through a thickness of the substrate. The semiconductor substrate is then etched with a dry etch process from the device side of the substrate to the fluid side of the substrate so that one or more through slots having a reentrant profile are formed in the substrate.

摘要翻译： 一种微加工半导体衬底以在其中形成一个或多个通孔的方法。 半导体衬底具有与器件侧相对的器件侧和流体侧。 该方法包括将p型掺杂材料扩散到半导体衬底的一个或多个通孔位置的器件侧，以通过衬底的厚度进行蚀刻。 然后用干蚀刻工艺将半导体衬底从衬底的器件侧蚀刻到衬底的流体侧，使得在衬底中形成具有折入轮廓的一个或多个通槽。

公开(公告)号：US20060189144A1

公开(公告)日：2006-08-24

申请号：US11063108

申请日：2005-02-22

申请人： John Krawczyk ,  Andrew McNees ,  Christopher Money ,  Girish Patil ,  David Rhine ,  Karthik Vaideeswaran

发明人： John Krawczyk ,  Andrew McNees ,  Christopher Money ,  Girish Patil ,  David Rhine ,  Karthik Vaideeswaran

IPC分类号： H01L21/30

CPC分类号： H01L21/0332 ,  B81B2203/0353 ,  B81C1/00531 ,  B81C1/00619 ,  B81C2201/0132 ,  B81C2201/014 ,  H01L21/0334 ,  H01L21/3081 ,  H01L21/3083

摘要： A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (hereinafter “slots”) in the substrates. The process includes applying a first layer to a back side of a substrate as a first etch stop material. The first layer is a relatively soft etch stop material. A second layer is applied to the first layer on the back side of the substrate to provide a composite etch stop layer. The second layer is a relatively hard etch stop material. The substrate is etched from a side opposite the back side of the substrate to provide a slot in the substrate.

摘要翻译： 使用深反应离子蚀刻工艺蚀刻半导体衬底以在衬底中产生通孔或槽（以下称为“槽”）的工艺。 该方法包括将第一层作为第一蚀刻停止材料施加到衬底的背面。 第一层是相对软的蚀刻停止材料。 将第二层施加到衬底的背面上的第一层以提供复合蚀刻停止层。 第二层是相对硬的蚀刻停止材料。 从与衬底的背面相对的一侧蚀刻衬底，以在衬底中提供槽。

公开(公告)号：US09132639B2

公开(公告)日：2015-09-15

申请号：US13097566

申请日：2011-04-29

申请人： David Bernard ,  Andrew McNees ,  James Mrvos

发明人： David Bernard ,  Andrew McNees ,  James Mrvos

IPC分类号： B41J2/16 ,  B41J2/14 ,  H01L21/265

CPC分类号： B41J2/1621 ,  B41J2/1603 ,  B41J2/1632 ,  B41J2/1634 ,  H01L21/265 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49401

摘要： A method for fabricating an ejection chip of a fluid ejection device includes forming a drive circuitry layer on a substrate, fabricating at least one fluid ejection element on the substrate, forming at least one slot within a top portion of the substrate, filling each slot of the at least one slot with a protective material, grinding the substrate from a bottom portion of the substrate up to a predetermined height, removing the protective material from the each slot of the at least one slot, and laminating a flow feature layer and a nozzle plate over the substrate having the at least one slot.

摘要翻译： 用于制造流体喷射装置的喷射芯片的方法包括在基板上形成驱动电路层，在基板上制造至少一个流体喷射元件，在基板的顶部部分内形成至少一个槽， 所述至少一个狭槽具有保护材料，将所述基底从所述基底的底部研磨到预定高度，从所述至少一个狭槽的每个槽移除所述保护材料，以及层压流动特征层和喷嘴 在具有至少一个槽的衬底上方。

公开(公告)号：US09079409B2

公开(公告)日：2015-07-14

申请号：US13172904

申请日：2011-06-30

申请人： Jiandong Fang ,  Paul Graf ,  Andrew McNees

发明人： Jiandong Fang ,  Paul Graf ,  Andrew McNees

IPC分类号： B41J2/145 ,  B41J2/175 ,  B41J2/14

CPC分类号： B41J2/1433 ,  B41J2/1404 ,  B41J2/145 ,  B41J2/175

摘要： Disclosed is a fluid ejection device for an inkjet printer that includes a substrate. The substrate includes at least one trench and a plurality of fluid flow vias configured in at least three parallel rows arranged over each trench of the at least one trench. Each row of the at least three parallel rows includes a set of fluid flow vias from the plurality of fluid flow vias arranged in one of a uniform manner and a non-uniform manner such that each fluid flow via of the set of fluid flow vias is configured in a spaced-apart relation with an adjacent fluid flow via. The each fluid flow via is configured in a diagonal relationship relative to a neighboring fluid flow via of an adjacent row of the at least three parallel rows. The fluid ejection device also includes a flow feature layer and a nozzle plate.

摘要翻译： 公开了一种包括基板的用于喷墨打印机的流体喷射装置。 衬底包括至少一个沟槽和多个流体流动通孔，其配置在至少三个平行的行中，排列在至少一个沟槽的每个沟槽上。 所述至少三个平行排中的每一行包括从所述多个流体流动通孔中的一组流体流动通孔以均匀方式和不均匀的方式之一布置，使得所述一组流体流动通孔的每个流体流动通道为 与相邻的流体流动通道以间隔开的关系构造。 每个流体流动通道相对于至少三个平行行的相邻行的相邻流体流动通道以对角关系构造。 流体喷射装置还包括流动特征层和喷嘴板。