公开(公告)号：US20230230818A1

公开(公告)日：2023-07-20

申请号：US18183090

申请日：2023-03-13

Applicant: Kokusai Electric Corporation

Inventor： Tetsuaki Inada ,  Junya Konishi ,  Masaki Murobayashi ,  Takeshi Yasui ,  Takeo Sato

IPC: H01J37/32

CPC classification number: H01J37/32834 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32522 ,  H01J37/32743 ,  H01J2237/182 ,  H01J2237/186 ,  H01J2237/188 ,  H01J2237/334 ,  H01J2237/24585

Abstract: According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: a process vessel in which a substrate is processed; an outer vessel configured to cover an outer circumference of the process vessel; a gas flow path provided between the outer vessel and the outer circumference of the process vessel; an exhaust path in communication with the gas flow path; an adjusting valve configured to be capable of adjusting a conductance of the exhaust path; a first exhaust apparatus provided on the exhaust path downstream of the adjusting valve; a pressure sensor configured to measure an inner pressure of the outer vessel; and a controller configured to be capable of adjusting an exhaust volume flow rate of the first exhaust apparatus by controlling the first exhaust apparatus based on a pressure measured by the pressure sensor.