公开(公告)号：US08063485B1

公开(公告)日：2011-11-22

申请号：US12163531

申请日：2008-06-27

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H05K7/20

CPC classification number: H01L23/4006 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.

Abstract translation: 板安装的集成电子封装组件设置有一个或多个固定元件，以将散热装置直接附接到封装。 固定元件沿着包装的周边定位，并将散热装置的基座固定到包装上，从而消除了包装和散热装置之间的二次散热材料的使用。

公开(公告)号：US20100200206A1

公开(公告)日：2010-08-12

申请号：US12370311

申请日：2009-02-12

Applicant: Carlo Mandrone ,  Joseph P. Mennucci ,  Kaveh Azar

Inventor： Carlo Mandrone ,  Joseph P. Mennucci ,  Kaveh Azar

IPC: F28F7/00 ,  B23P11/02 ,  A44B21/00

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T24/44017 ,  Y10T29/49876 ,  H01L2924/00

Abstract: Apparatus and method for making a heat sink assembly. The apparatus includes a first clip configured to be urgingly attached to a heat producing device, the first clip having a first edge, a second edge, a third edge, and a fourth edge. The apparatus further includes a heat sink configured to be attached to the first clip, and a second clip configured to be attached to the first clip, the second clip being sized to accommodate a portion of the heat sink, and the second clip urging the heat sink towards the heat producing device. Methods to make the foregoing apparatus are also described.

Abstract translation: 制造散热器组件的装置和方法。 该装置包括构造成被推动地附接到发热装置的第一夹子，第一夹具具有第一边缘，第二边缘，第三边缘和第四边缘。 该装置还包括配置成附接到第一夹子的散热器和被配置为附接到第一夹子的第二夹子，第二夹具的尺寸适于容纳散热器的一部分，并且第二夹子推动热量 汇向制热装置。 还描述了制造上述装置的方法。

公开(公告)号：US06691766B1

公开(公告)日：2004-02-17

申请号：US09663735

申请日：2000-09-15

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: F28D2700

CPC classification number: H05K7/20681 ,  F28D15/0266

Abstract: An electronics cooling system in accordance with the principles of the present invention includes an electronics cabinet that is thermally connected with the ground in the vicinity of the cabinet. The cabinet may or may not sit directly on the earth, but the thermal connection is made with the earth below, and in the near vicinity of, the cabinet, thereby employing the earth as a heat sink. In an illustrative embodiment, an enclosed cabinet includes a heat pipe that makes thermal contact with the ground in the immediate vicinity of the electronics cabinet. An electronics cabinet in accordance with the principles of the present invention is particularly suited for use in uncontrolled environments, such as may be encountered by remote telecommunications switches and wireless telecommunications equipment, for example.

Abstract translation: 根据本发明的原理的电子冷却系统包括与机柜附近的地面热连接的电子柜。 机柜可以或不可以直接坐在地球上，但热连接是用下面的地球和靠近机柜的地面做的，从而将地球作为散热器。 在说明性的实施例中，封闭的机柜包括与电子柜紧邻的地面进行热接触的热管。 根据本发明的原理的电子柜特别适用于例如可能由远程电信交换机和无线电信设备遇到的不受控制的环境中。

公开(公告)号：US5920458A

公开(公告)日：1999-07-06

申请号：US864980

申请日：1997-05-28

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: H01L23/367 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/09581 ,  H05K2201/10689

Abstract: An arrangement for cooling a heat dissipating circuit element mounted to a first side of a printed circuit board. A heat dissipation member is mounted to the other side of the circuit board and a thermally conductive post secured to the heat dissipation member extends through an aperture through the circuit board and into thermal contact with the circuit element.

Abstract translation: 一种用于冷却安装到印刷电路板的第一侧的散热电路元件的装置。 散热构件安装到电路板的另一侧，并且固定到散热构件的导热柱延伸穿过电路板的孔并与电路元件热接触。

公开(公告)号：US20100018670A1

公开(公告)日：2010-01-28

申请号：US12510874

申请日：2009-07-28

Applicant: Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

Inventor： Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

IPC: H01L23/40 ,  F28F7/00 ,  B23P11/00 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract translation: 提供散热器组件安装座。 通常本发明具有框架夹和弹簧夹。 框架夹具具有一个或多个向内延伸的突出部和两个或更多个垂直延伸的侧部。 一个或多个突片的尺寸设置成适合于可移除地耦合到发热装置。 两个或更多个垂直延伸的侧部之间的距离被设计成保持散热器的基部并防止散热器的水平运动。 弹簧夹耦合到框架夹子并且具有尺寸适于产生将散热器压靠在发热装置上的垂直力的弹簧偏压。

公开(公告)号：US07567435B2

公开(公告)日：2009-07-28

申请号：US11073831

申请日：2005-03-07

Applicant: Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

Inventor： Kaveh Azar ,  Joseph P. Mennucci ,  Carlo Mandrone

IPC: H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

Abstract translation: 提供散热器组件安装座。 通常本发明具有框架夹和弹簧夹。 框架夹具具有一个或多个向内延伸的突出部和两个或更多个垂直延伸的侧部。 一个或多个突片的尺寸设置成适合于可移除地耦合到发热装置。 两个或更多个垂直延伸的侧部之间的距离被设计成保持散热器的基部并防止散热器的水平运动。 弹簧夹耦合到框架夹子并且具有尺寸适于产生将散热器压靠在发热装置上的垂直力的弹簧偏压。

公开(公告)号：US20060198107A1

公开(公告)日：2006-09-07

申请号：US11073831

申请日：2005-03-07

Applicant: Kaveh Azar ,  Joseph Mennucci ,  Carlo Mandrone

Inventor： Kaveh Azar ,  Joseph Mennucci ,  Carlo Mandrone

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device.

公开(公告)号：US6161610A

公开(公告)日：2000-12-19

申请号：US346931

申请日：1999-07-02

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: F28F3/02 ,  F28F13/06 ,  H01L23/367 ,  H01L23/467 ,  H05K7/20

CPC classification number: H01L23/467 ,  F28F3/02 ,  F28F13/06 ,  F28F2215/08 ,  H01L23/3672 ,  H01L2924/0002 ,  Y10T29/49915 ,  H01L2924/00

Abstract: A heat exchanger and a method of manufacturing the heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. The individual fins of the heat exchanger comprise an arc shape with diametrically opposed legs extending vertically downward from each end of the fins. The individual fins are comprised of thermally conductive material affixed to and in thermal communication with the base. The individual fins are arcuately shaped sections separated by arcuately shaped channels. The fins, together with the channels and base form a fin field having an inlet region, a middle region and an outlet region. Additionally, the fins may comprise a plurality of orifices, slots and/or apertures to enhance cross channel fluid communication, and/or textured surface regions in the form of surface anomalies for disrupting formation of a boundary layer along said fins.

Abstract translation: 公开了用于从发热部件散热的热交换器和制造热交换器的方法。 热交换器包括与部件热连通的导热基座，固定到基座的多个导热板翅片，其中板翅片限定翅片场和通道，以及用于控制翅片场内的流体流动的流体控制。 热交换器的各散热器包括弧形，其具有从翅片的每个端部垂直向下延伸的直径相对的腿。 单个散热片由固定在基底上并与基底热连通的导热材料构成。 各个散热片是由弧形通道分隔的弧形部分。 翅片与通道和底座一起形成具有入口区域，中间区域和出口区域的翅片区域。 另外，翅片可以包括多个孔，槽和/或孔，以增强交叉通道流体连通，和/或以表面异常形式的纹理化表面区域，用于破坏沿所述翅片的边界层的形成。

公开(公告)号：US5778177A

公开(公告)日：1998-07-07

申请号：US933198

申请日：1997-09-18

Applicant: Kaveh Azar

Inventor： Kaveh Azar

IPC: G06F3/041 ,  G06F3/048 ,  G06F3/153 ,  G06T19/00 ,  H04N1/00 ,  H04N1/387 ,  H04N1/42 ,  H04N7/00 ,  H04N7/14 ,  H04N7/15

CPC classification number: G06T19/00 ,  H04N7/002 ,  H04N7/142 ,  G06T2219/024 ,  Y10S128/916

Abstract: An interactive scanning device or system having one or more single or multi-dimensional scanners, an input device, an image processor, and a communication interface, for scanning an object or surface and interactively displaying and manipulating a threedimensional image of the object or surface from the geometrical dimensions of the object or topology of the surface captured during scanning. The communication interface enables the geometrical dimensions of the object, the topology of the surface, or the image of the object, to be transmitted over a wire or wireless communication medium to an end user station having an interactive scanning device or a computer station, or both, for initial or further display and manipulation. A further embodiment of the present invention incorporates a photosensitive or photographic recording device to capture an optical image of the object or surface to superimpose with the scanned image.

Abstract translation: 一种具有一个或多个单维或多维扫描器，输入设备，图像处理器和通信接口的交互式扫描设备或系统，用于扫描物体或表面，并交互地显示和操纵物体或表面的三维图像 在扫描期间捕获的表面的对象或拓扑的几何尺寸。 通信接口使物体的几何尺寸，表面的拓扑结构或物体的图像通过有线或无线通信介质传送到具有交互式扫描设备或计算机站的终端用户站，或 两者，用于初始或进一步的显示和操纵。 本发明的另一个实施例包括一个感光或照相记录装置，以捕获物体或表面的光学图像以与扫描图像叠加。

公开(公告)号：US20100097760A1

公开(公告)日：2010-04-22

申请号：US12254125

申请日：2008-10-20

Applicant: Kaveh Azar ,  Bahman Tavassoli Hojati

Inventor： Kaveh Azar ,  Bahman Tavassoli Hojati

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H05K7/20145 ,  H01L2924/00

Abstract: An apparatus and a method for impingement cooling. The apparatus may include a plenum having a fluid. The plenum may be configured to contact a plate. A duct may be attached to the plate, wherein the duct may include a hole configured to pass the fluid, such as an air or a gas. A heat source, such as an electric or electronic component, may be located proximate to the hole, such as on a printed circuit board. The hole may be configured to make a contact between the fluid and the heat source. Methods to make the foregoing structure are also described.

Abstract translation: 一种用于冲击冷却的装置和方法。 该装置可以包括具有流体的增压室。 增压室可以被配置为接触板。 管道可以附接到板，其中管道可以包括被配置为使流体例如空气或气体通过的孔。 诸如电气或电子部件的热源可以位于孔附近，例如印刷电路板上。 孔可以构造成在流体和热源之间形成接触。 还描述了制造上述结构的方法。