-
11.发明申请Linear-Hyperbranched Polymers as Performance Additives for Solid Electrolytic Capacitors 审中-公开线性超支化聚合物作为固体电解电容器的性能添加剂公开(公告)号：US20160254099A1
公开(公告)日：2016-09-01
申请号：US15149720
申请日：2016-05-09
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , Gopakumar Sivasankarapillai , Yaru Shi , Philip M. Lessner
IPC: H01G9/042 , C09D177/12 , C09D5/24 , H01G9/15 , H01G9/00
CPC classification number: H01G9/0425 , C09D5/24 , C09D177/12 , H01B1/124 , H01G9/0029 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
Abstract translation: 本文提供了改进的电容器和形成改进的电容器的方法。 该方法包括提供阳极并在阳极上形成电介质。 形成线型超支化聚合物并制备包含至少一种导电聚合物，一个聚阴离子和线性超支化聚合物的导电聚合物分散体。 如果形成导电聚合物分散体的一层，其中所述电介质位于阳极和层之间。
-
公开(公告)号：US20210327646A1
公开(公告)日：2021-10-21
申请号：US17233796
申请日：2021-04-19
Applicant: KEMET Electronics Corporation
Inventor： Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
-
公开(公告)号：US20210198469A1
公开(公告)日：2021-07-01
申请号：US17167176
申请日：2021-02-04
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Yaru Shi , Qingping Chen , Philip M. Lessner
IPC: C08L25/18 , H01G9/028 , H01G9/042 , C07C309/28 , C07C309/30 , H01G9/00 , H01G9/04 , H01G9/15 , H01M4/136 , H01M4/137
Abstract: An improved slurry of conductive polymer is provided. The slurry comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented the ratio of Formula A: AxByCz Formula A wherein: A is polystyrenesulfonic acid or salt of polystyrenesulfonate; B and C separately represent polymerized units substituted by a group selected from: —C(O)OR6 wherein R6 is selected from the group consisting of: —(CHR17)b—R18. All other groups are defined. The conductive polymer has an average particle size of at least 1 nm to no more than 10 microns.
-
公开(公告)号：US10947376B2
公开(公告)日：2021-03-16
申请号：US16411915
申请日：2019-05-14
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Yaru Shi , Qingping Chen , Philip M. Lessner
IPC: C08L25/18 , C07C309/30 , H01G9/042 , H01M4/137 , H01G9/00 , H01G9/028 , C07C309/28 , H01G9/04 , H01G9/15 , H01M4/136
Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.
-
公开(公告)号：US20210005396A1
公开(公告)日：2021-01-07
申请号：US17023870
申请日：2020-09-17
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Qingping Chen , Yaru Shi , Philip M. Lessner
IPC: H01G9/00 , H01G9/042 , C09D5/24 , C09D165/00 , C09D4/06 , C09D125/18 , C09D7/65 , H01G9/15 , H01G9/025 , C08F12/30 , H01B1/12 , C08F212/14 , C09D133/14 , H01G9/028
Abstract: An improved capacitor is provided wherein the capacitor comprising an anode foil; and a conductive polymer layer on the anode foil. The conductive polymer layer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and the polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns. The second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
-
Patent Agency Ranking
16.发明申请公开(公告)号：US20200273791A1
公开(公告)日：2020-08-27
申请号：US16553395
申请日：2019-08-28
Applicant: KEMET Electronics Corporation
Inventor： Allen Templeton , John Bultitude , Lonnie G. Jones , Philip M. Lessner
IPC: H01L23/498 , H01L23/522 , H01L23/367 , H01L29/778
Abstract: An improved electronic assembly is provided. The electronic assembly comprises a ceramic interposer comprising multiple layers. The active layers of the multiple layers form an embedded capacitor comprising parallel electrodes with a dielectric between adjacent electrodes wherein adjacent electrodes have opposite polarity. A wide band gap device is also on the multilayered ceramic interposer.
-
公开(公告)号：US20190066927A1
公开(公告)日：2019-02-28
申请号：US16175186
申请日：2018-10-30
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Philip M. Lessner , Abhijit Gurav
Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.
-
18.发明授权公开(公告)号：US10128054B2
公开(公告)日：2018-11-13
申请号：US15149720
申请日：2016-05-09
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , Gopakumar Sivasankarapillai , Yaru Shi , Philip M. Lessner
Abstract: Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
-
19.发明申请公开(公告)号：US20170338047A1
公开(公告)日：2017-11-23
申请号：US15595137
申请日：2017-05-15
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Yaru Shi , Qingping Chen , Philip M. Lessner
CPC classification number: H01G9/042 , H01G9/0036 , H01G9/04 , H01G9/15 , H01G2009/0014 , H01G2009/0404 , H01M4/136 , H01M4/137
Abstract: A capacitor and a method of making a capacitor, is provided with improved reliability performance. The capacitor comprises an anode; a dielectric on the anode; and a cathode on the dielectric wherein the cathode comprises a conductive polymer and a polyanion wherein the polyanion is a copolymer comprising groups A, B and C represented by Formula AxByCz as described herein.
-
公开(公告)号：US09748043B2
公开(公告)日：2017-08-29
申请号：US13959995
申请日：2013-08-06
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , John E. McConnell , Robert Ramsbottom , Philip M. Lessner , Randolph S. Hahn , John Bultitude
CPC classification number: H01G9/048 , H01G9/0029 , H01G9/012 , H01G9/04 , H01G9/0425 , H01G11/26 , Y10T29/417
Abstract: A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal.
-
-
-
-
-
-
-
-
-
Search Results
52
records
(took 0.031 seconds)
