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公开(公告)号:US20230187134A1
公开(公告)日:2023-06-15
申请号:US18107154
申请日:2023-02-08
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Nathan A. Reed , Allen Templeton , James R. Magee , James Davis , Abhijit Gurav , Hunter Hayes
IPC: H01G4/12 , H01G4/30 , C04B35/50 , C04B35/495 , C04B35/465 , H01G4/40
CPC classification number: H01G4/1245 , H01G4/306 , C04B35/50 , C04B35/495 , C04B35/465 , H01G4/1227 , H01G4/30 , H01G4/40 , C04B2235/66
Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
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公开(公告)号:US20220076892A1
公开(公告)日:2022-03-10
申请号:US17467841
申请日:2021-09-07
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Nathan A. Reed , Allen Templeton , James R. Magee , James Davis , Abhijit Gurav , Hunter Hayes , Hanzheng Guo
IPC: H01G4/30 , H01G4/12 , H01G4/40 , C04B35/465
Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
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公开(公告)号:US11621126B2
公开(公告)日:2023-04-04
申请号:US17467841
申请日:2021-09-07
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Nathan A. Reed , Allen Templeton , James R. Magee , James Davis , Abhijit Gurav , Hunter Hayes , Hanzheng Guo
IPC: H01G4/12 , C04B35/465 , H01G4/30 , C04B35/50 , C04B35/495 , H01G4/40
Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
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公开(公告)号:US11081882B2
公开(公告)日:2021-08-03
申请号:US16513349
申请日:2019-07-16
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Lonnie G. Jones , Iain D. Kinnon , Nathan A. Reed , Jeffrey W. Bell
IPC: H02H9/04
Abstract: A protected electric circuit, and method of protecting a protected circuit is provided. The circuit comprises at least one sensitive device wherein the sensitive device operates at a device voltage and has a maximum voltage capability. At least one light emitting diode electrically connected with the sensitive device wherein the light emitting diode has a first trigger voltage wherein the first trigger voltage is above the device voltage and below the maximum voltage capability. When any said extraneous energy above the first trigger energy is experienced the light emitting diode emits photons thereby converting at least some of the extraneous energy to photon energy.
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公开(公告)号:US12249463B2
公开(公告)日:2025-03-11
申请号:US17233796
申请日:2021-04-19
Applicant: KEMET Electronics Corporation
Inventor: Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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公开(公告)号:US20200028356A1
公开(公告)日:2020-01-23
申请号:US16513349
申请日:2019-07-16
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Lonnie G. Jones , Iain D. Kinnon , Nathan A. Reed , Jeffrey W. Bell
IPC: H02H9/04
Abstract: A protected electric circuit, and method of protecting a protected circuit is provided. The circuit comprises at least one sensitive device wherein the sensitive device operates at a device voltage and has a maximum voltage capability. At least one light emitting diode electrically connected with the sensitive device wherein the light emitting diode has a first trigger voltage wherein the first trigger voltage is above the device voltage and below the maximum voltage capability. When any said extraneous energy above the first trigger energy is experienced the light emitting diode emits photons thereby converting at least some of the extraneous energy to photon energy.
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公开(公告)号:US12040135B2
公开(公告)日:2024-07-16
申请号:US18107154
申请日:2023-02-08
Applicant: KEMET Electronics Corporation
Inventor: John Bultitude , Nathan A. Reed , Allen Templeton , James R. Magee , James Davis , Abhijit Gurav , Hunter Hayes , Hanzheng Guo
IPC: H01G4/12 , C04B35/465 , C04B35/495 , C04B35/50 , H01G4/30 , H01G4/40
CPC classification number: H01G4/1245 , C04B35/465 , C04B35/495 , C04B35/50 , H01G4/1227 , H01G4/30 , H01G4/306 , H01G4/40 , C04B2235/66
Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
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公开(公告)号:US11178800B2
公开(公告)日:2021-11-16
申请号:US16517066
申请日:2019-07-19
Applicant: KEMET Electronics Corporation
Inventor: Lonnie G. Jones , Iain D. Kinnon , John Bultitude , Nathan A. Reed , Jeffrey W. Bell , George Michael Theis
Abstract: Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.
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公开(公告)号:US20210327646A1
公开(公告)日:2021-10-21
申请号:US17233796
申请日:2021-04-19
Applicant: KEMET Electronics Corporation
Inventor: Mark R. Laps , John Bultitude , Philip M. Lessner , Lonnie G. Jones , Allen Templeton , Nathan A. Reed
Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.
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公开(公告)号:US20200260618A1
公开(公告)日:2020-08-13
申请号:US16859261
申请日:2020-04-27
Applicant: KEMET Electronics Corporation
Inventor: Lonnie G. Jones , Iain D. Kinnon , John Bultitude , Nathan A. Reed , Jeffrey W. Bell , George Michael Theis
Abstract: Provided is an improved overvoltage protection element. The overvoltage protection device comprises at least one ESD protection couple comprising discharge electrodes in a plane, a gap insulator between the discharge electrodes, an overvoltage protection element parallel to the planar discharge electrodes wherein the overvoltage protection element comprises a conductor and an secondary material. The overvoltage protection element also comprises a primary insulator layer between the discharge electrodes and overvoltage protection element.
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