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Patent Agency Ranking
11.发明授权Hermetically sealed polymer capacitors with high stability at elevated temperatures 有权在高温下具有高稳定性的密封聚合物电容器公开(公告)号：US09147530B2
公开(公告)日：2015-09-29
申请号：US14018001
申请日：2013-09-04
Applicant: Kemet Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Philip M. Lessner , Qingping Chen , Javaid Qazi
CPC classification number: H01G13/00 , B23K2101/38 , H01G9/012 , H01G9/028 , H01G9/0425 , H01G9/06 , H01G9/08 , H01G9/15
Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。
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公开(公告)号：US20210375555A1
公开(公告)日：2021-12-02
申请号：US17399500
申请日：2021-08-11
Applicant: KEMET Electronics Corporation
Inventor： Christian L. Guerrero , Jeffrey Poltorak , Yuri Freeman , Steve C. Hussey , Chris Stolarski
Abstract: An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
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公开(公告)号：US20190148081A1
公开(公告)日：2019-05-16
申请号：US16219355
申请日：2018-12-13
Applicant: KEMET Electronics Corporation
Inventor： Christian L. Guerrero , Jeffrey Poltorak , Yuri Freeman , Steve C. Hussey , Chris Stolarski
Abstract: An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
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公开(公告)号：US10290429B2
公开(公告)日：2019-05-14
申请号：US15872075
申请日：2018-01-16
Applicant: KEMET Electronics Corporation
Inventor： Christian L. Guerrero , Jeffrey Poltorak , Yuri Freeman , Steve C. Hussey , Chris Stolarski
Abstract: An improved capacitor is provided wherein the capacitor has an improved bond between the anode and anode wire. The anode comprises a pressed anode powder comprising a first density region and a second density region wherein the second density region has a higher density than the first density region. An anode wire extends into the second density region wherein the anode wire in the second density region is distorted by compression. This allows for better utilization of the metal powder surface area by allowing a lower bulk press density and lower sinter temperature while still achieving the necessary wire pull strength. In addition, this invention when utilized with deoxidation steps, results in sufficient wire pull strengths not possible otherwise.
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15.发明申请Hermetically Sealed Polymer Capacitors with High Stability at Elevated Temperatures 有权在高温下具有高稳定性的密封聚合物电容器公开(公告)号：US20140061284A1
公开(公告)日：2014-03-06
申请号：US14018001
申请日：2013-09-04
Applicant: Kemet Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Philip M. Lessner , Qingping Chen , Javaid Qazi
IPC: H01G13/00
CPC classification number: H01G13/00 , B23K2101/38 , H01G9/012 , H01G9/028 , H01G9/0425 , H01G9/06 , H01G9/08 , H01G9/15
Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。
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