公开(公告)号：US20200279826A1

公开(公告)日：2020-09-03

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.

公开(公告)号：US20190326144A1

公开(公告)日：2019-10-24

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Dohee KIM ,  Changseo PARK ,  Hyunwoo CHO

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  B65G47/92

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US20190063818A1

公开(公告)日：2019-02-28

申请号：US16086724

申请日：2017-03-02

Applicant: LG Electronics Inc.

Inventor： Hyunwoo CHO ,  Woocheol KANG ,  Geunhyung LEE ,  Gwinan HWANG

IPC: F25D21/08 ,  F25B39/02 ,  F25B47/00 ,  F25D23/00

Abstract: An evaporator includes: an evaporator case that defines a food storage space therein; a cooling tube located at the evaporator case and filled with refrigerant; a foil heater attached to at least one surface of the evaporator case and configured to contact the evaporator case and to generate heat such that heat for defrosting is transferred to the evaporator case. A defrosting time is reduced in comparison to that of conventional natural defrosting, such that the freshness of food can be maintained, and the cooling efficiency, having been reduced by frost, is increased such that power consumption can be reduced. The foil heater is attached to a conventional roll-bond type evaporator case, and the present invention has an advantageous effect of facilitating the maintenance of the foil heater because of a structure in which the foil heater is attached to the evaporator case.

公开(公告)号：US20180283766A1

公开(公告)日：2018-10-04

申请号：US15518502

申请日：2016-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Kwangsoo JUNG ,  Woocheol KANG ,  Yonggap PARK ,  Geunhyung LEE ,  Jongmin LEE ,  Hyunwoo CHO

IPC: F25D21/08 ,  F28D15/02 ,  F25B47/02 ,  F25B39/02 ,  F28F1/40 ,  F28F1/12

Abstract: The present disclosure discloses a defrosting device, including a heating unit provided in an evaporator; and a heat pipe, both end portions of which are connected to an inlet and an outlet of the heating unit, respectively, and at least part of which is disposed adjacent to a cooling tube to dissipate heat to the cooling tube of the evaporator due to high-temperature working fluid heated and transferred by the heating unit, wherein the heating unit includes a heater case provided with a vacant space therein, and provided with the inlet and the outlet at positions separated from each other, respectively, along a length direction; and a heater attached to an outer surface of the heater case to heat working fluid within the heater case.

公开(公告)号：US20210358893A1

公开(公告)日：2021-11-18

申请号：US17013201

申请日：2020-09-04

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L33/00

Abstract: The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber 300, a roller unit 200 and assembly inspection unit 500. The fluid chamber 300 can accommodate semiconductor light emitting devices 150. Semiconductor light emitting devices 150 can be assembled on an assembly substrate 210. The assembly substrate 210 can be mounted on the roller unit 200. The roller unit 200 can rotate the assembly substrate 210. The assembly inspection unit 500 can inspect the semiconductor light emitting devices 150 assembled on the assembly substrate 210. The roller unit 200 can include a roller rotated part 220 where the assembly substrate 210 is mounted and rotated, a roller driving part 230 for rotating the roller rotated part 220, and a magnet head unit 400 for applying magnetic force to the semiconductor light emitting devices 150 to be assembled on the assembly substrate 210.

公开(公告)号：US20210351158A1

公开(公告)日：2021-11-11

申请号：US17286844

申请日：2019-10-08

Applicant: LG ELECTRONICS INC.

Inventor： Juchan CHOI ,  Jideok KIM ,  Bongchu SHIM ,  Seulbitna LEE ,  Kiseong JEON ,  Hyunwoo CHO

IPC: H01L23/00 ,  H01L21/67 ,  H01L25/075

Abstract: Discussed is an apparatus for self-assembling semiconductor light-emitting devices, the apparatus including a fluid chamber to accommodate the semiconductor light-emitting devices, each semiconductor light-emitting device having a magnetic body; a magnet to apply a magnetic force to the semiconductor light-emitting devices while an assembly substrate is disposed at an assembly position of the self-assembly apparatus; a power supply to induce formation of an electric field on the assembly substrate to allow the semiconductor light-emitting devices to be seated at a preset positions on the assembly substrate in a process of moving the semiconductor light-emitting devices due to a change in a position of the magnet; and a fluid injector to shoot a fluid to some of the semiconductor light-emitting devices to allow the some of the semiconductor light-emitting devices seated on the assembly substrate to be separated from the assembly substrate.

公开(公告)号：US20200184859A1

公开(公告)日：2020-06-11

申请号：US16789053

申请日：2020-02-12

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Seongmin MOON ,  Bongchu SHIM ,  Kiseong JEON ,  Hyunwoo CHO

IPC: G09F9/33 ,  H01L33/44 ,  H01L33/62 ,  H01L27/15

Abstract: Discussed in a method of fabricating a display device, the method including transferring a substrate to an assembly position, and placing a plurality of semiconductor light emitting devices each having a first conductive semiconductor layer and a second conductive semiconductor layer into a fluid chamber, guiding a movement of the plurality of semiconductor light emitting devices in the fluid chamber to assemble the plurality of semiconductor light emitting devices at preset positions of the substrate, etching at least one of the first conductive semiconductor layer and the second conductive semiconductor layer while the plurality of semiconductor light emitting devices are placed at the preset positions of the substrate and connecting a first wiring electrode and a second wiring electrode respectively to each of the plurality of semiconductor light emitting devices.

公开(公告)号：US20190325790A1

公开(公告)日：2019-10-24

申请号：US16415770

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Seongmin MOON ,  Bongchu SHIM ,  Kiseong JEON ,  Hyunwoo CHO

IPC: G09F9/33 ,  H01L27/15 ,  H01L33/44 ,  H01L33/62

Abstract: The present disclosure relates to a display device using semiconductor light emitting devices and a fabrication method thereof, and the display device according to the present disclosure can include a plurality of semiconductor light emitting devices, a first wiring electrode and a second wiring electrode respectively extended from the semiconductor light emitting devices to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes disposed on the substrate, and provided with a first electrode and a second electrode configured to generate an electric field when an electric current is supplied, and a dielectric layer formed to cover the pair electrodes, wherein the first wiring electrode and the second wiring electrode are formed on an opposite side to the plurality of the pair electrodes with respect to the semiconductor light emitting devices.

公开(公告)号：US20170336114A1

公开(公告)日：2017-11-23

申请号：US15312772

申请日：2015-10-21

Applicant: LG ELECTRONICS INC.

Inventor： Geunhyung LEE ,  Jongryul KIM ,  Kwangsoo JUNG ,  Woocheol KANG ,  Jongmin LEE ,  Hyunwoo CHO

IPC: F25B47/02 ,  F25D21/08 ,  F25D21/12 ,  F28D15/02

CPC classification number: F25B47/022 ,  F25B2400/01 ,  F25D21/08 ,  F25D21/12 ,  F28D15/0266 ,  F28F2215/04

Abstract: A defrosting device includes a heating unit filled with a working fluid and including an active heating part heated to a first temperature that can evaporate the working fluid, and a passive heating part positioned at a rear side of the active heating part and heated to a lower temperature than the first temperature. The defrosting device also includes a heat pipe disposed adjacent to an evaporator to transfer heat to the evaporator while circulating working fluid heated by the active heating part, the heat pipe including an entrance portion configured to receive working fluid evaporated by the active heating part, and a return portion connected adjacent to the passive heating part and configured to receive working fluid that has condensed after circulating through the heat pipe. Condensed working fluid received at the heating unit first passes through the passive heating part before being reheated at the active heating part.