公开(公告)号：US20230083951A1

公开(公告)日：2023-03-16

申请号：US17799080

申请日：2020-02-19

Applicant: LG ELECTRONICS INC.

Inventor： Dohee KIM ,  Dohwan YANG ,  Yongil SHIN

IPC: H01L21/673

Abstract: The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

公开(公告)号：US20220246593A1

公开(公告)日：2022-08-04

申请号：US17616125

申请日：2019-06-11

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Dohee KIM ,  Yongil SHIN ,  Dohwan YANG

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/00 ,  H01L27/12

Abstract: A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

公开(公告)号：US20210272936A1

公开(公告)日：2021-09-02

申请号：US17254656

申请日：2018-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Dohee KIM

IPC: H01L25/075 ,  H01L21/683 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed are a display device, and a method of manufacturing the display device. The display device includes a substrate having a plurality of metal pads, and a semiconductor light-emitting element electrically connected to the plurality of metal pads through self-assembly. Specifically, each metal pad includes a bonding metal electrically connected to a conductive electrode of a respective semiconductor light-emitting element, and a coating layer encompassing the bonding metal.

公开(公告)号：US20230163248A1

公开(公告)日：2023-05-25

申请号：US17798812

申请日：2020-02-17

Applicant: LG ELECTRONICS INC.

Inventor： Jinsung KIM ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/005

Abstract: Discussed is a self-assembly apparatus of a semiconductor light emitting diode. The self-assembly apparatus can include a fluid chamber including a space to accommodate a fluid and semiconductor light emitting diodes having a magnetic metal, a magnet to apply a magnetic force to the semiconductor light emitting diodes in a state where an assembly surface of a board is submerged in the fluid, a power supply portion to induce an electric field between assembly electrodes provided on the board so that the semiconductor light emitting diodes become seated at predetermined positions of the board while the semiconductor light emitting diodes are moved by a change in a position of the magnet, and a repair portion disposed in the fluid chamber and to separate some of the semiconductor light emitting diodes seated on the board from the board. The repair portion can be configured to spray and suction the fluid.

公开(公告)号：US20230005888A1

公开(公告)日：2023-01-05

申请号：US17783731

申请日：2020-01-08

Applicant: LG ELECTRONICS INC.

Inventor： Yongil SHIN ,  Dohee KIM ,  Dohwan YANG

IPC: H01L25/075 ,  H01L33/00

Abstract: A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semdconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emittng elements are separated from the one surface of the magnet accommodating part.

公开(公告)号：US20220367423A1

公开(公告)日：2022-11-17

申请号：US17638163

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohwan YANG ,  Dohee KIM ,  Yongil SHIN ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.

公开(公告)号：US20200279826A1

公开(公告)日：2020-09-03

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.

公开(公告)号：US20190326144A1

公开(公告)日：2019-10-24

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Dohee KIM ,  Changseo PARK ,  Hyunwoo CHO

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  B65G47/92

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US20230268214A1

公开(公告)日：2023-08-24

申请号：US18023998

申请日：2020-09-22

Applicant: LG ELECTRONICS INC.

Inventor： Yongil SHIN ,  Jinhyung LEE ,  Dohee KIM ,  Dohwan YANG ,  Kisu KIM

IPC: H01L21/68

CPC classification number: H01L21/68 ,  H01L33/0093

Abstract: A method for manufacturing a display device according to the present invention is characterized by comprising the steps of: supplying semiconductor light-emitting elements in a first chamber containing a fluid; disposing a distribution device, in which a plurality of magnets are arranged, on one side of the first chamber; rotating the distribution device such that the semiconductor light-emitting elements form a continuous pattern along the arrangement direction of the plurality of magnets; and stopping the distribution device such that the semiconductor light-emitting elements are distributed to a plurality of dummies, wherein in the step of stopping the distribution device, the plurality of dummies are formed at positions corresponding to the plurality of magnets.

公开(公告)号：US20230138887A1

公开(公告)日：2023-05-04

申请号：US17793896

申请日：2020-02-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohwan YANG ,  Dohee KIM ,  Yongil SHIN

IPC: H01L25/075 ,  H01L33/00

Abstract: According to a semiconductor light-emitting element collecting apparatus and a semiconductor light-emitting element collecting method using the same according to an embodiment of the present invention, in order to collect semiconductor light-emitting elements, a fluid accommodated in a housing unit is rotated such that semiconductor light-emitting elements are guided to sink to a bottom surface of the housing unit, and accordingly, the semiconductor light-emitting elements can be rapidly collected. In addition, a collecting operation can be performed without exerting the physical force to the semiconductor light-emitting elements, a collecting rate of the semiconductor light-emitting elements can be improved.