公开(公告)号：US20220319892A1

公开(公告)日：2022-10-06

申请号：US17628776

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Hyeyoung YANG ,  Jisoo KO ,  Wonjae CHANG

IPC: H01L21/68 ,  H01L21/683

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

公开(公告)号：US20250040321A1

公开(公告)日：2025-01-30

申请号：US18576641

申请日：2021-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Kitae AN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62

Abstract: The present invention can be applied to a technical field relating to display devices, and relates to a modular display device using, for example, light-emitting devices and to a method for manufacturing same. The present invention comprises: at least two display modules, each including a substrate having a first surface and a second surface, and a plurality of semiconductor light-emitting devices mounted on the first surface of the substrate; a light-absorbing layer positioned in a gap between the display modules; and an encapsulation layer positioned on the first surfaces of the display modules, wherein the light-absorbing layer may include: a first section positioned on the first surface of the substrate; a second section positioned in a gap between the display modules adjacent to each other; and a third section positioned on the second surface of the substrate.

公开(公告)号：US20220367421A1

公开(公告)日：2022-11-17

申请号：US17623853

申请日：2019-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Jisoo KO ,  Hyeyoung YANG ,  Wonjae CHANG ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L33/62

Abstract: The present invention may be applied to display device-related technical fields and relates to a display device using a semiconductor light-emitting element, such as a micro light-emitting diode (LED), and a manufacturing method therefor. The present invention, according to one embodiment, may comprise: a substrate; a stepped film positioned on at least some pixel regions, among a plurality of individual pixel regions positioned on the substrate; an assembly electrode positioned on the substrate or the stepped film; an insulation layer positioned on the assembly electrode; a partition wall positioned on the insulation layer and defining an assembly groove having mounted therein a semiconductor light-emitting element forming the individual pixel; the semiconductor light-emitting element mounted in an assembly surface of the assembly groove; and a lighting electrode electrically connected to the semiconductor light-emitting element.

公开(公告)号：US20190326477A1

公开(公告)日：2019-10-24

申请号：US16415583

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/62 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00

Abstract: The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.

公开(公告)号：US20200279826A1

公开(公告)日：2020-09-03

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.

公开(公告)号：US20190326144A1

公开(公告)日：2019-10-24

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Dohee KIM ,  Changseo PARK ,  Hyunwoo CHO

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  B65G47/92

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US20190063818A1

公开(公告)日：2019-02-28

申请号：US16086724

申请日：2017-03-02

Applicant: LG Electronics Inc.

Inventor： Hyunwoo CHO ,  Woocheol KANG ,  Geunhyung LEE ,  Gwinan HWANG

IPC: F25D21/08 ,  F25B39/02 ,  F25B47/00 ,  F25D23/00

Abstract: An evaporator includes: an evaporator case that defines a food storage space therein; a cooling tube located at the evaporator case and filled with refrigerant; a foil heater attached to at least one surface of the evaporator case and configured to contact the evaporator case and to generate heat such that heat for defrosting is transferred to the evaporator case. A defrosting time is reduced in comparison to that of conventional natural defrosting, such that the freshness of food can be maintained, and the cooling efficiency, having been reduced by frost, is increased such that power consumption can be reduced. The foil heater is attached to a conventional roll-bond type evaporator case, and the present invention has an advantageous effect of facilitating the maintenance of the foil heater because of a structure in which the foil heater is attached to the evaporator case.

公开(公告)号：US20180283766A1

公开(公告)日：2018-10-04

申请号：US15518502

申请日：2016-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Kwangsoo JUNG ,  Woocheol KANG ,  Yonggap PARK ,  Geunhyung LEE ,  Jongmin LEE ,  Hyunwoo CHO

IPC: F25D21/08 ,  F28D15/02 ,  F25B47/02 ,  F25B39/02 ,  F28F1/40 ,  F28F1/12

Abstract: The present disclosure discloses a defrosting device, including a heating unit provided in an evaporator; and a heat pipe, both end portions of which are connected to an inlet and an outlet of the heating unit, respectively, and at least part of which is disposed adjacent to a cooling tube to dissipate heat to the cooling tube of the evaporator due to high-temperature working fluid heated and transferred by the heating unit, wherein the heating unit includes a heater case provided with a vacant space therein, and provided with the inlet and the outlet at positions separated from each other, respectively, along a length direction; and a heater attached to an outer surface of the heater case to heat working fluid within the heater case.

公开(公告)号：US20220302342A1

公开(公告)日：2022-09-22

申请号：US17832221

申请日：2022-06-03

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Hyunwoo CHO ,  Mihee HEO

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

公开(公告)号：US20220293823A1

公开(公告)日：2022-09-15

申请号：US17633520

申请日：2019-08-21

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Jisoo KO ,  Hyeyoung YANG ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.