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公开(公告)号：US20070294047A1
公开(公告)日：2007-12-20
申请号：US11449979
申请日：2006-06-09
Applicant: Leonard Hayden
Inventor： Leonard Hayden
IPC: G01R19/00
CPC classification number: G01D18/00 , G01R35/005
Abstract: A calibration system for a probe measurement system including a set up wizard.
Abstract translation: 用于探头测量系统的校准系统，包括设置向导。
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公开(公告)号：US07304488B2
公开(公告)日：2007-12-04
申请号：US11607398
申请日：2006-12-01
Applicant: K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
Inventor： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC: G01R31/00
CPC classification number: G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
Abstract: A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a second surface a ground path that shields both the signal path and the probe tip.
Abstract translation: 用于测量高频集成电路或其他微电子器件的电气特性的屏蔽探针。 探针可以包括延伸穿过电介质基底的探针尖端，其在第一表面上支撑测试仪器的信号路径，并且在第二表面上支撑屏蔽信号路径和探针尖端的接地路径。
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公开(公告)号：US07205784B2
公开(公告)日：2007-04-17
申请号：US11442503
申请日：2006-05-25
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor： Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/26
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
Abstract translation: 直流电流和调制信号同时施加到被测器件（例如激光二极管）上的接触焊盘，探头通过传输调制信号通过阻抗匹配电阻器和直接传输来降低信号失真和功耗 电流超过阻抗匹配电阻的第二信号通路。
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公开(公告)号：US07161363B2
公开(公告)日：2007-01-09
申请号：US10848777
申请日：2004-05-18
Applicant: K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
Inventor： K. Reed Gleason , Tim Lesher , Eric W. Strid , Mike Andrews , John Martin , John Dunklee , Leonard Hayden , Amr M. E. Safwat
IPC: G01R31/00
CPC classification number: G01R1/06772 , G01R1/06711 , G01R1/06755 , G01R1/06777
Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
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公开(公告)号：US06724205B1
公开(公告)日：2004-04-20
申请号：US10294130
申请日：2002-11-13
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor： Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R3102
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.
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Patent Agency Ranking
公开(公告)号：US07495461B2
公开(公告)日：2009-02-24
申请号：US11975176
申请日：2007-10-18
Applicant: Leonard Hayden , John Martin , Mike Andrews
Inventor： Leonard Hayden , John Martin , Mike Andrews
CPC classification number: G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
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公开(公告)号：US20080074129A1
公开(公告)日：2008-03-27
申请号：US11901626
申请日：2007-09-18
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor： Leonard Hayden , Scott Rumbaugh , Mike Andrews
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
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公开(公告)号：US20080042677A1
公开(公告)日：2008-02-21
申请号：US11975175
申请日：2007-10-18
Applicant: Leonard Hayden , John Martin , Mike Andrews
Inventor： Leonard Hayden , John Martin , Mike Andrews
IPC: G01R31/26
CPC classification number: G01R1/06772 , G01R1/07342 , Y10T29/49121 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208
Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
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公开(公告)号：US20080018343A1
公开(公告)日：2008-01-24
申请号：US11879865
申请日：2007-07-18
Applicant: Leonard Hayden
Inventor： Leonard Hayden
IPC: G01R35/00
CPC classification number: G01R27/32 , G01D18/00 , G01R35/005
Abstract: A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced.
Abstract translation: 补偿矢量网络分析仪的校准的方法包括在至少一对端口上执行校准以确定与每个端口相关联的误差项，其中至少一个误差项基于从一组中选择负载标准的电抗 的电位值，使得参考电抗误差减小。
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公开(公告)号：US07285969B2
公开(公告)日：2007-10-23
申请号：US11714003
申请日：2007-03-05
Applicant: Leonard Hayden , Scott Rumbaugh , Mike Andrews
Inventor： Leonard Hayden , Scott Rumbaugh , Mike Andrews
IPC: G01R31/02
CPC classification number: G01R1/06766 , G01R1/06738 , G01R1/06772
Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
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