公开(公告)号：US20010005053A1

公开(公告)日：2001-06-28

申请号：US09747976

申请日：2000-12-27

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Takashi Kitae ,  Tsutomu Mitani ,  Yukihiro Ishimaru ,  Hiroaki Takezawa

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19041 ,  H05K3/321 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2203/0307 ,  H05K2203/1446 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 nullm or more and to 10.0 nullm or less and preferably to 1.0 nullm or more and to 5.0 nullm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

Abstract translation: 电子部件4的外部电极3的表面形成有含有树脂成分的涂层。 因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。 此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。 此外，电子部件的外部电极3的表面粗糙度（Ra）设定为0.1μm以上且10.0μm以下，优选为1.0μm以上且5.0μm以下。 因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。